Battery, manufacturing method of battery, and manufacturing method of electrode body

Abstract

The present disclosure provides a battery, a manufacturing method of a battery, and a manufacturing method of an electrode body. The manufacturing method of the electrode body includes: providing a collector including an upper surface; shielding a first region of the upper surface of the collector by a patterned thermal release adhesive layer; applying an electrode material on the upper surface of the collector, where a contact angle of the patterned thermal release adhesive layer relative to the electrode material is 90° or more; and removing the patterned thermal release adhesive layer, to form the electrode material into an electrode material layer that exposes the first region of the upper surface of the collector.

Description

BATTERY, MANUFACTURING METHOD OF BATTERY, AND MANUFACTURING METHOD OF ELECTRODE BODYBACKGROUND OF THE INVENTION1. Field of the Invention

[0001] The present disclosure essentially relates to a battery, a manufacturing method of a battery, and a manufacturing method of an electrode body2. Description of the Related Art

[0002] With the advance of science and technology, more and more portable electronic products have become people's life necessities, and the portable electronic product requires a battery as a source of an energy supply In this case, a secondary battery is used because the secondary battery has advantages such as no memory effect, a small size, and reusability, and is more environment-friendly than a primary battery. In the small-sized secondary battery, a nickel-cadmium battery that is toxic and causes environmental pollution and a nickel-metal hydride battery that has a relatively low volumetric energy density and a relatively high temperature have been gradually replaced by a lithium-ion battery.

[0003] Among lithium-ion batteries, a cylinder-shaped lithium battery and a square-shaped lithium battery are the most common types. The cylindershaped lithium battery is produced by using a quite mature winding process, which has a high automation degree, stable product quality, and a relatively low cost. Although a structure of the square-shaped lithium battery is simple compared with that of the cylinder-shaped lithium battery, because the squareshaped lithium battery can be produced in a customized maimer according to a size of a product, there are thousands of models on the market, and processes are difficult to unify due to a large quantity of models. Therefore, the cylinder-shaped lithium battery that can be produced in a standardized manner is used to ensure a production process, and a replaceable battery for the product is easily found.

[0004] In an existing design, because the cylinder-shaped lithium battery is usually provided with a combination of one or two positive electrode tabs and one or two negative electrode tabs. In addition to covering a collector of an electrode sheet with an electrode active material layer, space needs to be reserved for the positive electrode tab and the negative electrode tab. Therefore, a patterned electrode active material layer needs to be manufactured to satisfy the foregoing requirements. However, manufacturing the patterned electrode active material layer increases process difficulty of the battery, which may lead to a reduced yield of the battery.SUMMARY OF THE INVENTION

[0005] In one or more embodiments, a manufacturing method of an electrode body includes: providing a collector including an upper surface; shielding a first region of the upper surface of the collector by a patterned thermal release adhesive layer; applying an electrode material on the upper surface of the collector, where a contact angle of the patterned thermal release adhesive layer relative to the electrode material is 90° or more; and removing the patterned thermal release adhesive layer to form the electrode material into an electrode material layer that exposes the first region of the upper surface of the collector.

[0006] In one or more embodiments, a manufacturing method of a battery includes: forming a first electrode sheet, where forming the first electrode sheet includes: providing a first collector; covering a first empty electrode region of an upper surface of the first collector with a first thermal release adhesive layer; coating a first electrode slurry on the upper surface of the first collector, where a contact angle of the first thermal release adhesive layer relative to the first electrode slurry is 90° or more; heating the first electrode slurry to form a firstelectrode layer that exposes the first empty electrode region of the upper surface; heating the first thermal release adhesive layer to enable the first thermal release adhesive layer to be detached from the upper surface of the first collector; and disposing a first electrode tab in the first empty electrode region.

[0007] In one or more embodiments, a battery includes a first electrode sheet, a second electrode sheet, a first separator, and a second separator. The first electrode sheet includes a first collector, a first electrode layer, and a first electrode tab. The first electrode layer is disposed on an upper surface of the first collector and exposes a first empty electrode region. The first electrode tab is disposed in the first empty electrode region, where the first electrode tab is separated from the first electrode layer by a gap, and the gap has a non-uniform width in a normal direction of the upper surface of the first collector. A polarity of the second electrode sheet is different from a polarity of the first electrode sheet, and the second electrode sheet includes a second electrode tab. The first separator is disposed between the first electrode sheet and the second electrode sheet. The first electrode sheet is located between the first separator and the second separator.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] When the present disclosure is read with reference to the accompanying drawings, patterns of the present disclosure may be better understood according to the following implementations. It should be noted that various features may not be drawn to scale, and sizes of the various features may be arbitrarily enlarged or reduced to clearly describe the content of the present disclosure.

[0009] FIG. 1A to FIG. 13D are schematic diagrams of a manufacturing method of a battery according to some embodiments of the present disclosure.

[0010] FIG. 14 to FIG. 15D are schematic diagrams of a manufacturing method of a battery according to some embodiments of the present disclosure.

[0011] FIG. 16A and FIG. 16B are schematic diagrams of a manufacturing method of an electrode sheet according to some embodiments of the present disclosure.

[0012] FIG. 17A and FIG. 17B are schematic diagrams of a manufacturing method of an electrode sheet according to some embodiments of the present disclosure.

[0013] FIG. 18A and FIG. 18B are schematic diagrams of a manufacturing method of an electrode sheet according to some embodiments of the present disclosure.

[0014] In the drawings and implementations of the present disclosure, a same or similar element is represented by a same element symbol.PREFERRED EMBODIMENT OF THE PRESENT INVENTION

[0015] FIG. 1A to FIG. 13D are schematic diagrams of a manufacturing method of a battery 1 according to some embodiments of the present disclosure. In some embodiments, FIG. 1A to FIG. 9B are schematic diagrams of a manufacturing method of an electrode body 10 according to some embodiments of the present disclosure.

[0016] Refer to FIG. 1A and FIG. IB. FIG. IB is a schematic cross- sectional view taken along a section line IB- IB' in FIG. 1A. As shown in FIG. 1A and FIG. IB, a collector 100 including a surface 100a and a surface 100b that are opposite to each other may be provided, and a region R11 of the surface 100a of the collector 100 is shielded or covered by a thermal release adhesive layer 500. The surface 100a may be referred to as an upper surface, and the surface 100b may be referred to as a lower surface. The surface 100a may also be referred to as the lower surface, and the surface 100b may also be referred to as the upper surface. The region Rll may also be referred to as a "first region", an "empty electrode region", or a "first empty electrode region". In someembodiments, the surface 100a of the collector 100 further includes a region R12 (also referred to as a "second region" or an "empty electrode region"). In some embodiments, the region R12 is exposed from the thermal release adhesive layer 500. The collector 100 may be or include a conductive layer, for example, copper foil or aluminum foil. The thickness of the collector 100 may range from 8 pm to 15 pm.

[0017] The thermal release adhesive layer 500 may also be referred to as a "patterned thermal release adhesive layer" or a "first thermal release adhesive layer". The thickness T1 of the thermal release adhesive layer 500 may range from 10 pm to 25 pm. In some embodiments, the thermal release adhesive layer 500 includes a hydrophobic surface, for example, a surface 500a of the thermal release adhesive layer 500 (also referred to as an "upper surface") and a surface 500b of the thermal release adhesive layer 500 (also referred to as a "side surface").

[0018] The thermal release adhesive layer 500 may include a patterned adhesive layer 510 and a thermal release bonding layer 520. In some embodiments, the patterned adhesive layer 510 is adhered to the thermal release bonding layer 520. The thickness of the patterned adhesive layer 510 may range from 10 pm to 20 pm. In some embodiments, the patterned adhesive layer 510 includes polypropylene (polypropylene; PP), polyimide (polyimide; PI), or a combination thereof. In some embodiments, the patterned adhesive layer 510 includes the hydrophobic surface, for example, the surface 500a and the surface 500b. The patterned adhesive layer 510 may include a surface treatment layer (not shown) or may be formed into the hydrophobic surface through surface treatment. In some embodiments, the thermal release bonding layer 520 contacts the surface 100a of the collector 100. In some embodiments, the patterned adhesive layer 510 is bonded to the surface 100a of the collector 100 by the thermal release bonding layer 520. The thickness of the thermal release bonding layer 520 may range from 1.5 pm to 3 pm. In some embodiments, the thermal release bonding layer 520 includes an acrylic acid polymer. In someembodiments, the thermal release bonding layer 520 is configured to instantly or rapidly lose adhesiveness at a particular temperature. The thermal release bonding layer 520 may quickly lose the adhesiveness relative to the surface 100a of the collector 100 at 100°C to 120°C, 100°C to 110°C, 110°C to 130°C, or 110°C to 120°C.

[0019] Refer to FIG. 2. An electrode material 1100 may be applied on the surface 100a of the collector 100. In some embodiments, the electrode material 1100 is or includes an electrode slurry. In some embodiments, the electrode material 1100 is or includes a hydrophilic electrode slurry. The electrode slurry may include an electrode active material, a binder (binder), and a solvent. The electrode slurry may further include a conductive particle, for example, conductive carbon powder. In some embodiments, a composition of the electrode material 1100 (or the electrode slurry), other than the solvent, includes about 95% electrode active material, about 2.5% binder (binder), and about 2.5% conductive carbon powder. The electrode active material may be a positive electrode active material, for example, lithium nickel cobalt aluminate oxide (NCA) or lithium nickel cobalt manganese oxide (NCM). The electrode active material may also be a negative electrode active material, for example, a silicon- containing material, a graphite, or a combination thereof. However, a type of the electrode active material is not limited to the foregoing examples. In some embodiments, the electrode material 1100 (or the electrode slurry) may be formed through a mixer at a room temperature, and mixing duration is about 500 minutes to 550 minutes, to fully mix ingredients of the electrode material 1100 (or the electrode slurry). The surface 100a of the collector 100 may be coated with the electrode slurry. In some embodiments, a contact angle of the thermal release adhesive layer 500 relative to the electrode material 1100 (or the electrode slurry) is 90° or more, for example, 95° or more, 100° or more, 105° or more, or 110° or more. In some embodiments, the foregoing contact angle is defined as a contact angle of the hydrophobic surface of the patterned adhesive layer 510 relative to the hydrophilic electrode slurry, for example, acontact angle of the surface 500a (or a top surface) and / or the surface 500b (or the side surface) of the thermal release adhesive layer 500 (or the patterned adhesive layer 510) relative to the electrode material 1100 (or the electrode slurry).

[0020] In some embodiments, the electrode material 1100 is coated by a blade coating method. In some embodiments, the electrode material 1100 may be coated through a coating machine at the room temperature. In some embodiments, after being coated, the electrode material 1100 is left to stand for about 40 minutes to 60 minutes. As shown in FIG. 2, a step of coating the electrode material 1100 by the blade coating method may include adjusting a distance DI between a coating head 700 and the surface 100a of the collector 100 to be greater than the thickness T 1 of the thermal release adhesive layer 500. In some embodiments, a step of coating the electrode material 1100 by the blade coating method may include adjusting a movement path 700P of the coating head 700, to enable the movement path 700P to move in a direction DR1 and to enable the movement path 700P to be higher than the top surface (for example, the surface 500a) of the thermal release adhesive layer 500. In some embodiments, after being coated by the blade, an electrode material 110A is formed on the region R12, and the surface 500a of the thermal release adhesive layer 500 does not contact or only partially contacts the electrode material 110A. In some embodiments, the thickness T2 of the electrode material HOAis greater than the thickness T1 of the thermal release adhesive layer 500, and the surface 500a of the thermal release adhesive layer 500 is at least partially exposed from the electrode material 110A. In some embodiments, the thickness T2 of the electrode material 110A ranges from 25 pm to 50 pm. However, the thickness T2 of the electrode material 110A may also be adjusted to be in another thickness range according to performance required by a battery. In some embodiments, the surface 500a of the thermal release adhesive layer 500 is substantially completely exposed from the electrode material 110A. In some embodiments, the thickness T2 of the electrode material 110A is greater thanthe thickness T1 of the thermal release adhesive layer 500 by about 10 pm or more, for example, by about 10 pm to 30 pm or 10 pm to 20 pm. In some embodiments, the thickness T1 of the thermal release adhesive layer 500 is determined according to the thickness T2 of the predetermined electrode material 110A, so that a difference between the thicknesses T1 of the thermal release adhesive layer 500 and the thickness T2 of the predetermined electrode material 110A is 10 pm or more, for example, about 10 pm to 30 pm or 10 pm to 20 pm.

[0021] According to some embodiments of the present disclosure, because the foregoing contact angle of the thermal release adhesive layer 500 relative to the electrode material 1100 is designed to be relatively large, wettability of the electrode material 110A (or the electrode slurry) on a surface of the thermal release adhesive layer 500 or a contact surface between the electrode material 110A (or the electrode slurry) and the thermal release adhesive layer 500 is relatively poor. As a result, the electrode slurry is less inclined to be adhered to the surface of the thermal release adhesive layer 500 or is less inclined to be spread on the surface of the thermal release adhesive layer 500. In other words, the electrode slurry is actually repelled by the surface of the thermal release adhesive layer 500. Therefore, the electrode material 110A (or the electrode slurry) is relatively inclined to be aggregated into a water drop shape, to form an electrode material pattern on the region R12. Therefore, the electrode material 110A is easily formed into a structure that is shown in the present disclosure and that has the water drop shape or an arc-shaped upper surface. In addition, even if the electrode material 110A is already higher than the surface 500a (or the upper surface) of the thermal release adhesive layer 500, and based on a repulsion force between the electrode material 110A and the surface of the thermal release adhesive layer 500, the electrode material 110A is expanded and aggregated in a direction away from the thermal release adhesive layer 500 and hardly covers the surface 500a (or the upper surface) of the thermal release adhesive layer 500.

[0022] Further, according to some embodiments of the present disclosure, because in a coating step, the movement path 700P of the coating head 700 is designed to be higher than the top surface (for example, the surface 500a) of the thermal release adhesive layer 500, the coating head 700 does not scrape the thermal release adhesive layer 500. Therefore, the thermal release adhesive layer 500 can be prevented from being damaged and generating an impurity by the blade coating step, which can effectively reduce occurrence of a problem of a poor yield. In addition, as described above, because the foregoing contact angle of the thermal release adhesive layer 500 relative to the electrode material 110A is designed to be relatively large, even if the distance DI between the coating head 700 and the surface 100a of the collector 100 is greater than the thickness T1 of the thermal release adhesive layer 500, the electrode material 110A (or the electrode slurry) is also formed into a water drop-shaped structure protruding from the surface 500a of the thermal release adhesive layer 500, and hardly contacts or covers the surface 500a (for example, the top surface) of the thermal release adhesive layer 500.

[0023] In addition, according to some embodiments of the present disclosure, the electrode material 110A is formed as a pattern on the region R12 and has the thickness T2 that is greater than the thickness T1 of the thermal release adhesive layer 500 by about 10 pm or more. In this way, a contact area between the electrode material 110A and the thermal release adhesive layer 500 is relatively small. Therefore, a subsequent step of removing the thermal release adhesive layer 500 from the electrode material 110A is easier, which is conducive to further improve the yield.

[0024] Refer to FIG. 3A, FIG. 3B, FIG. 4A, FIG. 5A, and FIG. 5B. FIG. 3B is a schematic cross-sectional view taken along a section line 3B-3B' in FIG. 3 A, FIG. 4A is a partially enlarged view of a structure 4A in FIG. 3 A, and FIG. 5B is a schematic cross-sectional view taken along a section line 5B-5B' in FIG. 5A. As shown in FIG. 3A, FIG. 3B, and FIG. 4A, the curable electrode material 110A (as shown in FIG. 3 A and FIG. 3B) is formed into an electrode materiallayer 110 (as shown in FIG. 4A to FIG. 4D), and the thermal release adhesive layer 500 is removed to be formed into a structure shown in FIG. 5A and FIG. 5B. In some embodiments, as shown in FIG. 5 A and FIG. 5B, the thermal release adhesive layer 500 is removed to form the electrode material 110A into the electrode material layer 110 that exposes the region Rll of the surface 100a of the collector 100. The electrode material layer 110 may also be referred to as an electrode layer. In some embodiments, the electrode material layer 110 may include a plurality of electrode parts HOP that are separated through the thermal release adhesive layer 500.

[0025] In some embodiments, as shown in FIG. 3A and FIG. 3B, a step of curing the electrode material 110A may include heating the electrode material 110A (or the electrode slurry) to form the electrode material layer 110 (or the electrode layer) that exposes the region Rll (or the empty electrode region) of the surface 100a of the collector 100. In some embodiments, after the electrode material 110A is cured, the thermal release adhesive layer 500 is heated to enable the thermal release adhesive layer 500 to be detached from the surface 100a of the collector 100. In some embodiments, the thermal release adhesive layer 500 is heated at a predetermined temperature, and the predetermined temperature is higher than a boiling point of a solvent of the electrode slurry.

[0026] In some embodiments, the step of curing the electrode material 110A and the step of removing the thermal release adhesive layer 500 may be performed in a same heating step Pl. In some embodiments, the step of curing the electrode material 110A and the step of removing the thermal release adhesive layer 500 may be completed through a same heating process. In some embodiments, the heating step Pl is performed to cure the electrode material 110A to form the electrode material layer 110 and to enable the thermal release adhesive layer 500 to be detached from the surface 100a of the collector 100. In some embodiments, the heating step Pl further includes heating the thermal release bonding layer 520 until the thermal release bonding layer 520 substantially loses adhesiveness and is detached from the surface 100a of thecollector 100.

[0027] In some embodiments, the heating step Pl includes performing a first heating stage (also referred to as a "first temperature raising stage") and performing a second heating stage (also referred to as a "second temperature raising stage"). In some embodiments, the first heating stage includes curing the electrode material 110A at a first temperature. In some embodiments, the first heating stage includes raising a temperature to the first temperature and holding at the first temperature for a period of time to cure the electrode material 110A. In some embodiments, the first temperature is higher than the boiling point of the solvent of the electrode slurry. In some embodiments, the second heating stage is performed after the first heating stage and includes enabling the thermal release adhesive layer 500 to be detached from the surface 100a of the collector 100 at the second temperature, and the first temperature is lower than the second temperature. In some embodiments, the second heating stage includes raising a temperature from the first temperature to the second temperature and holding at the second temperature for a period of time to enable the thermal release adhesive layer 500 to be detached from the surface 100a of the collector 100. In some embodiments, the thermal release adhesive layer 500 is heated at the second temperature, so that the thermal release adhesive layer 500 (or the thermal release bonding layer 520) loses adhesiveness and is detached from the surface 100a of the collector 100, and the second temperature is higher than the boiling point of the solvent of the electrode slurry. In some embodiments, the heating step Pl includes raising a temperature from 90°C to 110°C to perform the first heating stage and the second heating stage. The first temperature is lower than 100°C, for example, lower than 95 °C, and the second temperature is higher than 95°C, for example, between 100°C to 110°C. In some embodiments, the electrode material 110A (or the electrode slurry) includes the positive electrode active material, and the heating step Pl is performed under the foregoing condition (raising the temperature from 90°C to 110°C). In some embodiments, the heating step Pl includes raising the temperature from 100°Cto 120°C to perform the first heating stage and the second heating stage. The first temperature is lower than 110°C, for example, lower than 105 °C, and the second temperature is higher than 105°C, for example, between 120°C to 130°C. In some embodiments, total heating duration of the heating step Pl is about 480 minutes to 500 minutes. In some embodiments, the electrode material 110A (or the electrode slurry) includes the negative electrode active material, and the heating step Pl is performed under the foregoing condition (raising the temperature from 100°C to 120°C).

[0028] As shown in FIG. 4A, in some embodiments, because the electrode material layer 110 is formed by heating and curing the electrode material 110 A, a solvent in the electrode material 110A (or the electrode slurry) is evaporated in the heating process, so that the thickness T2a of the electrode part HOP and the thickness T2b of an electrode part HOP' are less than the thickness T2 of the electrode material 110A (as shown in FIG. 2). In addition, in some embodiments, because a volume reduction caused by solvent evaporation is not completely uniform, an upper surface of the electrode material layer 110 does not has uniform height. For example, the thickness T2a of the electrode part HOP may be different from the thickness T2b of the electrode part HOP'. As shown in FIG. 4 A, in some embodiments, a surface 110a of the electrode material layer 110 (or the electrode part HOP) has a curved surface (the curved surface is formed by a water drop-shaped edge generated by the repulsion force between the slurry and the thermal release adhesive layer 500). In some embodiments, the surface 110a of the electrode material layer 110 (or the electrode part HOP) does not contact or does not cover the surface 500a of the thermal release adhesive layer 500.

[0029] Refer to FIG. 4B. FIG. 4B is a schematic diagram of a structure 4Ain FIG. 3 according to some embodiments of the present disclosure. In some embodiments, the electrode material layer 110 (or the electrode part HOP) does not contact or does not cover the surface 500a of the thermal release adhesive layer 500, and the electrode material layer 110 (or the electrode part HOP) isfurther separated from at least a part of the surface 500b (or the side surface) of the thermal release adhesive layer 500. The surface 110a of the electrode material layer 110 (or the electrode part HOP) has a convex curved surface (convex curved surface).

[0030] Refer to FIG. 4C. FIG. 4C is a schematic diagram of a structure 4Ain FIG. 3 according to some embodiments of the present disclosure. In some embodiments, the electrode material layer 110 (or the electrode part HOP) contacts or covers a part of the surface 500a of the thermal release adhesive layer 500. As shown in FIG. 4C, because a contact angle between the electrode material 110A (or the electrode slurry) and the thermal release adhesive layer 500 is relatively large, even if a part of the electrode material 110A (or the electrode slurry) extends above the surface 500a of the thermal release adhesive layer 500, the electrode material 110A (or the electrode slurry) is still affected by the repulsion force between the surface 500a of the thermal release adhesive layer 500 and the electrode material 110A (or the electrode slurry) and is aggregated into a shape close to a water drop, so that a protruding part located above the surface 500a of the thermal release adhesive layer 500 has the convex curved surface or the curved surface.

[0031] Refer to FIG. 4D. FIG. 4D is a schematic diagram of a structure 4Ain FIG. 3 according to some embodiments of the present disclosure. In some embodiments, because the solvent of the electrode slurry is evaporated in the heating process, apart of the region of the surface 110a of the electrode material layer 110 (or the electrode part HOP) is recessed inward, so that a recess is formed. In some embodiments, the depth of the recess is less than 1 pm.

[0032] According to some embodiments of the present disclosure, based on the repulsion force between the electrode material 110A and the surface of the thermal release adhesive layer 500, adhesion between the electrode material layer 110 (or the electrode part HOP) that is formed by curing and the thermal release adhesive layer 500 is relatively poor, and there is also a relatively smallcontact surface between the thermal release adhesive layer 500 and the electrode material layer 110 (or the electrode part HOP). Therefore, after the thermal release adhesive layer 500 (or the thermal release bonding layer 520) is heated to lose the adhesiveness to the collector 100, the thermal release adhesive layer 500 (or the thermal release bonding layer 520) may be easily separated from the electrode part HOP and is loosened from a gap between the electrode parts HOP, so that the yield can be increased.

[0033] In addition, according to some embodiments of the present disclosure, because the surface 110a of the electrode material layer 110 (or the electrode part HOP) hardly contacts or does not cover the surface 500a of the thermal release adhesive layer 500, the electrode material layer 110 (or the electrode part HOP) near the thermal release adhesive layer 500 is not detached from the collector 100 along with the thermal release adhesive layer 500. In addition, the thermal release adhesive layer 500 may be easily detached from a relatively large gap between the electrode parts HOP, and a detaching path is not shielded or blocked by the electrode parts HOP, so that the yield can be further increased.

[0034] Refer to FIG. 6A and FIG. 6B. FIG. 6B is a schematic cross- sectional view taken along a section line 6B-6B' in FIG. 6A. As shown in FIG. 6A and FIG. 6B, a region R21 (also referred to as a "second empty electrode region") of the surface 100b (or the lower surface) of the collector 100 may be shielded or covered by a thermal release adhesive layer 600. The thermal release adhesive layer 600 may include a patterned adhesive layer 610 and a thermal release bonding layer 620. A material and a structure of the thermal release adhesive layer 600 are the same as or similar to those of the thermal release adhesive layer 500. For descriptions of the thermal release adhesive layer 600, refer to related descriptions of the thermal release adhesive layer 500, and details are not described herein again.

[0035] Refer to FIG. 7A and FIG. 7B. FIG. 7B is a schematic cross-sectional view taken along a section line 7B-7B' in FIG. 7A. As shown in FIG. 7A and FIG. 7B, the surface 100b of the collector 100 may be coated with an electrode material (or an electrode slurry) to form an electrode material 130A, and a contact angle of the thermal release adhesive layer 600 relative to the electrode material 130A (or the electrode slurry) is 90° or more, for example, 95° or more, 100° or more, 105° or more, or 110° or more. In some embodiments, the electrode material 130Amay be formed through a step that is similar to the step of forming the electrode material 110A in FIG. 2 and FIG. 3A and FIG. 3B. The electrode material 130A is the same as or similar to the electrode material 110A. For descriptions of the electrode material 130A, refer to related descriptions of the electrode material 110A, and details are not described herein again.

[0036] Refer to FIG. 8A and FIG. 8B. FIG. 8B is a schematic cross- sectional view taken along a section line 8B-8B' in FIG. 8A. As shown in FIG. 8A and FIG. 8B, the electrode material 130Amay be cured to form an electrode material layer 130, and the thermal release adhesive layer 600 is removed. In some embodiments, the electrode slurry (the electrode material 130A) is heated to form an electrode layer 130 that exposes the region R21 (also referred to as the "second empty electrode region") of the surface 100b, and the thermal release adhesive layer 600 is heated so that the thermal release adhesive layer 600 is detached from the surface 100b of the collector 100. In some embodiments, the electrode material 130A may be cured to form the electrode material layer 130 through a step that is similar to the step of curing the electrode material 110A in FIG. 5A and FIG. 5B. The electrode material 130A is the same as or similar to the electrode material 110A. For descriptions of the electrode material 130A, refer to related descriptions of the electrode material 110A, and details are not described herein again.

[0037] In some embodiments, the thermal release adhesive layer 500 and the thermal release adhesive layer 600 include a same thermal release adhesive material. In some embodiments, a pattern of the region Rll (also referred to asthe "first empty electrode region") is different from a pattern of the region R21 (also referred to as the "second empty electrode region").

[0038] Refer to FIG. 9A and FIG. 9B. FIG. 9B is a schematic cross- sectional view taken along a section line 9B-9B' in FIG. 9A. As shown in FIG. 9A and FIG. 9B, a cutting step may be performed, to cut a structure of an electrode body shown in FIG. 8A and FIG. 8B into a plurality of electrode bodies 10. In some embodiments, cutting may be performed along a direction DR2 along which the region R21 (or the region R11) extends. A cutting channel may pass through a plurality of regions R21 (or regions Rll), and each region R21 (or region Rll) is cut to be an empty electrode region of each of different electrode bodies 10 respectively.

[0039] Refer to FIG. 10A and FIG. 10B. FIG. 10B is a schematic cross- sectional view taken along a section line 10B-10B' in FIG. 10A. As shown in FIG. 10A and FIG. 10B, a plurality of electrode tabs (for example, an electrode tab 150A, an electrode tab 150B, an electrode tab 150C, an electrode tab 150D, an electrode tab 150E, and an electrode tab 150F) are disposed on the region R21 (or the first empty electrode region) of the electrode body 10, to form an electrode sheet 10A (or referred to as a "first electrode sheet"). In some embodiments, the electrode tab 150A, the electrode tab 150B, the electrode tab 150C, the electrode tab 150D, the electrode tab 150E, and the electrode tab 15 OF are located among a plurality of electrode parts 13 OP that are separated from each other of the electrode layer 130. In some embodiments, the electrode tab 150A may have different lengths. The electrode tab 150A may be referred to as a "first electrode tab", and the electrode sheet 10A may be referred to as the "first electrode sheet".

[0040] Refer to FIG. 11A and FIG. 11B. FIG. 1 IB is a schematic cross- sectional view taken along a section line 11B-11B' in FIG. 11 A. As shown in FIG. 11A and FIG. 11B, an electrode sheet 20A (also referred to as a "second electrode sheet") is provided. The electrode sheet 20A may be formed througha process that is the same as or similar to the process of forming the electrode sheet 10A. For example, the electrode sheet 20A may be formed through the procedure described in FIG. 1A to FIG. 10B. In some embodiments, a polarity of the electrode sheet 20A is different from a polarity of the electrode sheet 10A. The electrode sheet 10A may be a positive electrode sheet, and the electrode sheet 20A may be a negative electrode sheet. Alternatively, the electrode sheet 10A may be a negative electrode sheet, and the electrode sheet 20A may be a positive electrode sheet.

[0041] Refer to FIG. 11B. In some embodiments, forming the electrode sheet 20A may include: providing a collector 200; covering a region Rll (or an empty electrode region) of a surface 200a of the collector 200 with a thermal release adhesive layer; coating the electrode slurry on the surface 200a of the collector 200, where a contact angle of the thermal release adhesive layer relative to the electrode slurry is 90° or more; heating the electrode slurry to form an electrode layer 210 (or an electrode part 210P) that exposes the region R11 of the surface 200a; and heating the thermal release adhesive layer to enable the thermal release adhesive layer to be detached from the surface 200a of the collector 200; and referring to both FIG. 11A and FIG. 11B, forming an electrode layer 230 (or an electrode part 23 OP) that exposes R21 (or an empty electrode region) on the surface 200b of the collector 200 in the foregoing maimer; and disposing an electrode tab 250A, an electrode tab 250B, an electrode tab 250C, and an electrode tab 250D in R21 (or the empty electrode region). The electrode tab 150A, electrode tab 150B, the electrode tab 150C, the electrode tab 150D, the electrode tab 150E, and the electrode tab 15 OF shown in FIG. 10A may be positive electrode tabs, and the electrode tab 250A, the electrode tab 250B, the electrode tab 250C, and the electrode tab 250D shown in FIG. 11A may be negative electrode tabs. Alternatively, the electrode tab 150A, electrode tab 150B, the electrode tab 150C, the electrode tab 150D, the electrode tab 150E, and the electrode tab 150F may be negative electrode tabs, and the electrode tab 250A, the electrode tab 250B, the electrode tab 250C, andthe electrode tab 250D may be positive electrode tabs.

[0042] Refer to FIG. 12A to FIG. 12C. A separator 30 (also referred to as a "first separator") may be disposed between the electrode sheet 10A and the electrode sheet 20A, and a separator 40 is disposed, to enable the electrode sheet 20A to be located between the separator 30 and the separator 40. Then, the electrode sheet 10 A, the separator 30, the electrode sheet 20 A, and the separator 40 are stacked and wound along a long axis direction (for example, the direction DR2) to form a rolled-up body shown in FIG. 12B to FIG. 12C. One end of the electrode tab 150A, the electrode tab 150B, the electrode tab 150C, the electrode tab 150D, the electrode tab 150E, and the electrode tab 150F and one end of the electrode tab 250A, the electrode tab 250B, the electrode tab 250C, and the electrode tab 250D are all protruded from the rolled-up body.

[0043] As shown in FIG. 12A to FIG. 12C, the battery 1 includes the electrode sheet 10 A, the separator 30, the electrode sheet 20 A, and the separator 40. The electrode sheet 10A includes the collector 100, the electrode material layer 110 and the electrode material layer 130, and the electrode tab 150A, the electrode tab 150B, the electrode tab 150C, the electrode tab 150D, the electrode tab 150E, and the electrode tab 15 OF. The electrode material layer 130 is disposed on the surface 100b of the collector 100 and exposes the region R21 (or the empty electrode region), and the electrode tab 150A, the electrode tab 150B, the electrode tab 150C, the electrode tab 150D, the electrode tab 150E, and the electrode tab 150F are disposed in the region R21 (or the empty electrode region). The electrode sheet 20A includes the collector 200, an electrode material layer 210, an electrode material layer 230, the electrode tab 250A, the electrode tab 250B, the electrode tab 250C, and the electrode tab 250D. The electrode material layer 230 is disposed on the surface 200b of the collector 200 and exposes the region R21 (or the empty electrode region), and the electrode tab 250A, the electrode tab 250B, the electrode tab 250C, and the electrode tab 250D are disposed on the region R21 (or the empty electrode region). The polarity of the electrode sheet 10A is different from the polarity ofthe electrode sheet 20A.

[0044] Refer to FIG. 13A. FIG. 13A is a partially enlarged view of a structure 13A in FIG. 12A. In some embodiments, a surface 130a of the electrode layer 130 (or the electrode part 130P) has a curved surface. In some embodiments, the thickness T3a of the electrode part 13 OP is different from the thickness T3b of an electrode part 130P'. In some embodiments, the electrode tab 150F is separated from the electrode layer 130 (or the electrode part 130P) by a gap Gl, and the gap G1 has the non-uniform width dl along a normal direction N1 of the surface 100b. In some embodiments, a forming process of the electrode part 130P as shown in FIG. 13A is similar to a forming process of the electrode part HOP as shown in FIG. 4 A, so that the surface 130a of the electrode part 13 OP has the curved surface, and the gap Gl has the non-uniform width dl. In some embodiments, at least two different regions of the gap Gl have different widths dl. In some embodiments, a width dl of an upper end region (a region between the curved surface of the electrode part 13 OP and the electrode tab 150F) of the gap Gl is greater than a width dl of a lower end region (a region between a vertical side surface of the electrode part 13 OP and the electrode tab 150F) of the gap Gl. In some embodiments, the width dl of the gap Gl is decreased along a direction toward the surface 100b of the collector 100.

[0045] Refer to FIG. 13B. FIG. 13B is a schematic diagram of a structure 13A in FIG. 12A according to some embodiments of the present disclosure. In some embodiments, the surface 130a of the electrode material layer 130 (or the electrode part 130P) has the convex curved surface (convex curved surface).

[0046] Refer to FIG. 13C. FIG. 13C is a schematic diagram of a structure 13A in FIG. 12A according to some embodiments of the present disclosure. In some embodiments, the width of a top part of the electrode material layer 130 (or the electrode part 13 OP) is greater than the width of a body part. In some embodiments, the top part of the electrode material layer 130 (or the electrodepart 13 OP) has a protruding part, and the protruding part has a convex curved surface or a curved surface.

[0047] Refer to FIG. 13D. FIG. 13D is a schematic diagram of a structure 13A in FIG. 12A according to some embodiments of the present disclosure. In some embodiments, atop of the surface 130a of the electrode material layer 130 (or the electrode part 13 OP) has a recess. In some embodiments, the depth of the recess is less than 1 pm.

[0048] FIG. 14 to FIG. 15D are schematic diagrams of a manufacturing method of a battery 1A according to some embodiments of the present disclosure. FIG. 15A to FIG. 15D respectively are schematic diagrams of a structure 15A in FIG. 14 according to some embodiments of the present disclosure.

[0049] Refer to FIG. 14. An electrode sheet 10A and an electrode sheet 20A are formed through a procedure similar to the procedure shown in FIG. 1 A to FIG. 11B. Before the electrode sheet 10A, a separator 30, the electrode sheet 20A, and a separator 40 are stacked and wound, a tape 170 and a tape 180 may be respectively disposed above a region Rll and a region R21. In some embodiments, the tape 170 covers the region Rll, and the tape 180 covers the region R21, an electrode tab 150A, an electrode tab 150B, an electrode tab 150C, an electrode tab 150D, an electrode tab 150E, and an electrode tab 150F. In some embodiments, the tape 170 and the tape 180 are or include an insulation tape, and are configured to protect the electrode tab to avoid a short circuit that occurs between the electrode tab and an external conductive element.

[0050] FIG. 16A and FIG. 16B are schematic diagrams of a manufacturing method of an electrode sheet according to some embodiments of the present disclosure.

[0051] Refer to FIG. 16A. A region Rll (a region in which an electrode tab is predetermined to be disposed) of a surface 100a of a collector 100 is firstcovered or shielded by a photoresist layer 810 and a region R12 is exposed, and then the surface 100a of the collector 100 is coated with an electrode material 820A or an electrode material 820A is sedimented on the surface 100a of the collector 100. The electrode material 820Amay be the same as or similar to the electrode material 110A or the electrode material 130A. The electrode material 820A is formed on a top surface of the photoresist layer 810 and in the region R12 of the surface 100a of the collector 100. As shown in FIG. 16A, the electrode material 820A that is formed between spacings of a pattern of the photoresist layer 810 may extend upward along a side wall of the photoresist layer 810.

[0052] Refer to FIG. 16B. Then a lift-off process is performed to remove the photoresist layer 810 and a part of the electrode material 820A above the photoresist layer 810, to form an electrode material layer 820 that exposes the region Rll , and then an electrode tab (not shown) is disposed in the region Rll . However, the electrode material 820A above the photoresist layer 810 may not be completely removed through the lift-off process, and consequently, an impurity particle 820b may remain in the region R12 of the surface 100a of the collector 100, which hinders disposition of the electrode tab. In addition, because the electrode material 820A may extend upward along the side wall of the photoresist layer 810, an extended part is formed into an ear-shaped protrusion 820a of the electrode material layer 820. The protrusion structure may produce a negative impact on a subsequent process of stacking and winding an electrode sheet and a separator, and may further reduce a yield.

[0053] FIG. 17A and FIG. 17B are schematic diagrams of a manufacturing method of a battery according to some embodiments of the present disclosure.

[0054] Refer to FIG. 17A. A region Rll of a surface 100a of a collector 100 is covered or shielded by a thermal release adhesive layer 830, and a region R12 is exposed. Composition and a characteristic of the thermal releaseadhesive layer 830 are different from composition and a characteristic of the foregoing thermal release adhesive layer 500 and composition and a characteristic of the foregoing thermal release adhesive layer 600 in the present disclosure.

[0055] Refer to FIG. 17B. An electrode material 820A is coated by the blade coating method, and a movement path of a coating head 700 is approximately located on a top surface of the thermal release adhesive layer 830. In this way, a height of an electrode material layer 820 (not shown in FIG. 17B) that is formed after the electrode material 820A is cured is basically equal to or lower than a height of the electrode material 820A, that is, not higher than a height of the thermal release adhesive layer 830, so that the thermal release adhesive layer 830 may be exposed from the electrode material layer 820, which is conducive to subsequent removal of the thermal release adhesive layer 830. However, the coating head 700 may scrape the thermal release adhesive layer 830, the thermal release adhesive layer 830 may be damaged and generate an impurity by the blade coating step, and the impurity may also fall in the region Rll, which reduces a yield.

[0056] FIG. 18A and FIG. 18B are schematic diagrams of a manufacturing method of a battery according to some embodiments of the present disclosure.

[0057] Refer to FIG. 18A. A region Rll of a surface 100a of a collector 100 is covered or shielded by a thermal release adhesive layer 830, and a region R12 is exposed, and then, an electrode material 820A is coated, and the height of the electrode material 820A is slightly higher than the height of the thermal release adhesive layer 830. In this way, a problem that a yield is reduced because a coating head 700 damages the thermal release adhesive layer 830 can be avoided.

[0058] Refer to FIG. 18B. The electrode material 820A is cured to form an electrode material layer 820, and then the thermal release adhesive layer 830is removed. However, because a contact angle of the thermal release adhesive layer 830 relative to the electrode material 820A is not designed to be 90° or more, as shown in FIG. 18 A, the electrode material 820 A roughly covers the thermal release adhesive layer 830. Therefore, when the thermal release adhesive layer 830 is removed, some parts of the electrode material layer 820 may be lifted-off from the surface 100a of the collector 100 together with the thermal release adhesive layer 830, and a defect (for example, an irregular protrusion 820c) may be even formed on the electrode material layer 820, which reduces the yield.

[0059] As used herein, terms "approximately", "substantially", "basically", and "about" are used to describe and consider small variations. When used in combination with an event or a situation, the terms may refer to a case in which an event or a situation occurs accurately and a case in which the event or situation occurs approximately. For example, when being used in combination with a value, the terms may refer to a variation range of less than or equal to ±10% of the value, for example, the variation range of less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a difference between two values is less than or equal to ±10% of an average value of the value, for example, less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, it may be considered that the two values are "substantially" or "about" the same. For example, being "substantially" parallel may refer to an angular variation range of less than or equal to ±10° relative to 0°, for example, the angular variation range of less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, being "substantially" perpendicular may refer to an angularvariation range of less than or equal to ±10° relative to 90°, for example, the angular variation range of less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0060] If a displacement between two surfaces is not greater than 5 pm, not greater than 2 pm, not greater than 1 pm, or not greater than 0.5 pm, it may be considered that the two surfaces are coplanar or substantially coplanar.

[0061] As used herein, the terms "conductive (conductive)", "electrically conductive (electrically conductive)" and " conductivity" refer to a capability to transport a current. Conductive materials generally indicate those materials that exhibit little or zero resistance to a flow of the current. One measure of conductivity is Siemens per meter (S / m). Generally, a conductive material is a material having conductivity that is greater than about 104S / m (such as at least 105S / m or at least 106S / m). Conductivity of a material may sometimes change with temperature. Unless otherwise specified, the conductivity of the material is measured at a room temperature.

[0062] As used herein, singular terms "a", "an", and "the" may include a plurality of referents unless the context clearly dictates otherwise. In the descriptions of some embodiments, assemblies disposed "on" or "above" another assembly may include a case in which a previous assembly is directly on a latter assembly (for example, in physical contact with the latter assembly), and a case in which one or more intervention assemblies are located between the previous assembly and the latter assembly.

[0063] Although the present disclosure is described and described with reference to specific embodiments of the present disclosure, these descriptions and illustrations do not limit the present disclosure. A person skilled in the art may clearly understand that various changes can be made and equivalent components may be replaced in the embodiments without departing from a true spirit and a scope of the present disclosure as defined by a patent scope of theappended claims. The drawings may not be drawn to scale. Due to variants in a manufacturing process and the like, there may be a difference between reproduction of the process and an actual device in the present disclosure. There may be other embodiments of the present disclosure that are not specifically shown. The specification and drawings should be considered as illustrative rather than limitative. Modifications may be made to adapt a specific situation, a material, composition of a substance, a method, or a program to the objective, the spirit, and the scope of the present disclosure. All such modifications are intended to fall within the scope of the patent scope of the appended claims. Although the method disclosed in this specification is described with reference to a particular operation performed in a particular sequence, it may be understood that these operations may be combined, sub-divided, or resequenced to form an equivalent method without departing from the teaching of the present disclosure. Therefore, unless specifically indicated in this specification, the sequence and grouping of the operations do not limit the present disclosure.

Claims

What is claimed is:

1. A manufacturing method of an electrode body, comprising: providing a collector having an upper surface; shielding a first region of the upper surface of the collector by a patterned thermal release adhesive layer; applying an electrode material on the upper surface of the collector, wherein a contact angle of the patterned thermal release adhesive layer relative to the electrode material is 90° or more; and removing the patterned thermal release adhesive layer to form the electrode material into an electrode material layer that exposes the first region of the upper surface of the collector.

2. The method according to claim 1 , wherein the contact angle is defined as a contact angle of an upper surface and / or a side surface of the patterned thermal release adhesive layer relative to the electrode material, and the contact angle is 110° or more.

3. The method according to claim 1 , wherein a thickness of the electrode material is greater than a thickness of the patterned thermal release adhesive layer, and an upper surface of the patterned thermal release adhesive layer is at least partially exposed from the electrode material.

4. The method according to claim 3, wherein applying the electrode material on the upper surface of the collector comprises: coating the electrode material by a blade coating method, wherein the blade coating method comprises adjusting a distance between a coating head and the upper surface of the collector to be greater than the thickness of the patterned thermal release adhesive layer.

5. The method according to claim 3, wherein applying the electrode material on the upper surface of the collector comprises: coating the electrode material by a blade coating method, wherein theblade coating method comprises adjusting a movement path of a coating head to be higher than a top surface of the patterned thermal release adhesive layer.

6. The method according to claim 1, wherein a second region of the upper surface of the collector is exposed from the patterned thermal release adhesive layer, the electrode material is formed on the second region, and an upper surface of the patterned thermal release adhesive layer does not contact or only partially contacts the electrode material.

7. The method according to claim 1, further comprising: performing a heating step to cure the electrode material to form the electrode material layer and to enable the patterned thermal release adhesive layer to be detached from the upper surface of the collector.

8. The method according to claim 7, wherein performing the heating step comprises: performing a first heating stage, wherein the first heating stage comprises curing the electrode material at a first temperature; and performing a second heating stage after the first heating stage, wherein the second heating stage comprises enabling the patterned thermal release adhesive layer to be detached from the upper surface of the collector at a second temperature, and the first temperature is lower than the second temperature.

9. The method according to claim 7, wherein the patterned thermal release adhesive layer comprises a thermal release bonding layer contacting the upper surface of the collector and a patterned adhesive layer comprising the contact angle and adhered to the thermal release bonding layer, and performing the heating step comprises heating the thermal release bonding layer until the thermal release bonding layer substantially loses adhesiveness and is detached from the upper surface of the collector.

10. The method according to claim 1, further comprising:curing the electrode material to form the electrode material layer; and after curing the electrode material, heating the patterned thermal release adhesive layer to enable the patterned thermal release adhesive layer to be detached from the upper surface of the collector.

11. The method according to claim 1, wherein the electrode material comprises a hydrophilic electrode slurry, the patterned thermal release adhesive layer has a hydrophobic surface, and the contact angle is defined as a contact angle of the hydrophobic surface relative to the hydrophilic electrode slurry.

12. A manufacturing method of a battery, comprising: forming a first electrode sheet, comprising: providing a first collector; covering a first empty electrode region of an upper surface of the first collector with a first thermal release adhesive layer; coating a first electrode slurry on the upper surface of the first collector, wherein a contact angle of the first thermal release adhesive layer relative to the first electrode slurry is 90° or more; heating the first electrode slurry to form a first electrode layer that exposes the first empty electrode region on the upper surface; heating the first thermal release adhesive layer to enable the first thermal release adhesive layer to be detached from the upper surface of the first collector; and disposing a first electrode tab in the first empty electrode region.

13. The method according to claim 12, further comprising: providing a second electrode sheet, wherein a polarity of the second electrode sheet is different from a polarity of the first electrode sheet; disposing a first separator between the first electrode sheet and the second electrode sheet; disposing a second separator, wherein the first electrode sheet islocated between the first separator and the second separator; and stacking the first electrode sheet, the first separator, the second electrode sheet, and the second separator and winding the first electrode sheet, the first separator, the second electrode sheet, and the second separator along a long axis direction to form a rolled-up body, wherein one end of the first electrode tab protrudes from the rolled-up body.

14. The method according to claim 13, wherein providing the second electrode sheet comprises: providing a second collector; covering a second empty electrode region of an upper surface of the second collector with a second thermal release adhesive layer; coating a second electrode slurry on the upper surface of the second collector, wherein a contact angle of the second thermal release adhesive layer relative to the second electrode slurry is 90° or more; heating the second electrode slurry to form a second electrode layer that exposes the second empty electrode region on the upper surface; heating the second thermal release adhesive layer to enable the second thermal release adhesive layer to be detached from the upper surface of the second collector; and disposing a second electrode tab in the second empty electrode region.

15. The method according to claim 12, wherein forming the first electrode sheet further comprises: covering a second empty electrode region of a lower surface of the first collector with a second thermal release adhesive layer; coating a second electrode slurry on the lower surface of the first collector, wherein a contact angle of the second thermal release adhesive layer relative to the second electrode slurry is 90° or more; heating the second electrode slurry to form a second electrode layer that exposes the second empty electrode region on the lower surface; andheating the second thermal release adhesive layer to enable the second thermal release adhesive layer to be detached from the lower surface of the first collector.

16. The method according to claim 15, wherein the first thermal release adhesive layer and the second thermal release adhesive layer comprise a same thermal release adhesive material, and a pattern of the first empty electrode region is different from a pattern of the second empty electrode region.

17. The method according to claim 12, wherein the first thermal release adhesive layer is heated at a predetermined temperature, and the predetermined temperature is higher than a boiling point of a solvent of the first electrode slurry.

18. A battery, comprising : a first electrode sheet, wherein the first electrode sheet comprises: a first collector; a first electrode layer disposed on an upper surface of the first collector and exposing a first empty electrode region; and a first electrode tab disposed on the first empty electrode region, wherein the first electrode tab is separated from the first electrode layer by a gap, and the gap has a non-uniform width in a normal direction of the upper surface of the first collector; a second electrode sheet, wherein a polarity of the first electrode sheet is different from a polarity of the second electrode sheet, and the second electrode sheet comprises a second electrode tab; a first separator disposed between the first electrode sheet and the second electrode sheet; and a second separator, wherein the first electrode sheet is between the first separator and the second separator.

19. The battery according to claim 18, wherein the non-uniform width of the gap is decreased in a direction toward the upper surface of the first collector.

20. The battery according to claim 18, wherein an upper surface of the first electrode layer has a curved surface.

21. The battery according to claim 18, wherein the first electrode sheet further comprises a plurality of first electrode tabs, the first electrode tabs are located among a plurality of parts of the first electrode layer that are separated from each other, and at least two of the plurality of parts have different thicknesses.

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