Fracol Radiator for Millimeter Wave Antenna Arrays
The Fracol radiator addresses PCB design constraints by using a multi-layer PCB structure with metal and dielectric layers and balanced transmission lines, enhancing wideband performance and radiation characteristics for millimeter wave applications.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
- Filing Date
- 2024-12-10
- Publication Date
- 2026-06-18
AI Technical Summary
Existing antenna elements with laminated dielectric layers using drilled or micro-vias are limited by PCB design constraints, which hinder achieving good wideband performance at millimeter wave frequencies due to radiator dimensions becoming very small and dielectric material limitations.
A millimeter wave Fracol radiator structure comprising a multi-layer printed circuit board (PCB) with metal layers and dielectric layers, featuring petals and vertical structures connected via vias, and a feedline structure with balanced broadside coupled transmission lines to optimize performance while minimizing complexity.
The Fracol radiator achieves improved wideband performance and radiation characteristics, suitable for millimeter wave applications, with reduced complexity and enhanced S-parameter and radiation pattern performance.
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