Millimeter wave transmission layer
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TOPPAN HOLDINGS INC
- Filing Date
- 2025-12-03
- Publication Date
- 2026-06-18
AI Technical Summary
Existing materials used in millimeter-wave transmitting components often lack high transmittance across a wide frequency band, limiting the selection of suitable materials for protecting millimeter-wave transmitters and receivers from the external environment.
A millimeter-wave transmission layer composed of a conductive pattern with specific design parameters, including a relative permittivity less than 1 across a defined frequency range, is integrated with a dielectric layer to enhance transmittance and structural stability.
The solution expands the material selection for millimeter-wave components, ensuring high transmittance and structural integrity across a wide frequency band, addressing the limitations of existing materials.
Smart Images

Figure JP2025042210_18062026_PF_FP_ABST