Antenna and electronic device including same

Abstract

According to an embodiment of the present disclosure, an electronic device may comprise: a housing including at least one side metal side wall, wherein a portion of the at least one side metal side wall is configured to operate as an antenna; a bracket disposed in the housing and configured to support at least one electronic component; a circuit board disposed in the housing and including a wireless communication circuit and a connecting member; and a metal plate configured to electrically connect the connecting member and the at least one side metal side wall, wherein a portion of the bracket protrudes from the one surface of the bracket and is configured to support the portion of the at least one side metal side wall, the metal plate is disposed on the portion of the bracket, and an RF signal path is provided through the metal plate between the connecting member and the at least one side metal side wall. Various other embodiments may be possible.

Description

Antenna and electronic device including the same

[0001] The embodiments disclosed in this document relate to electronic devices, for example, antennas and electronic devices including the same.

[0002] Driven by the remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. Electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs (personal computers), video / audio devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, or functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device comprises: a housing including at least one side metal sidewall, wherein a portion of the at least one side metal sidewall is configured to function as an antenna; a bracket disposed within the housing and configured to support at least one electronic component; a circuit board disposed on one surface of the bracket and comprising a wireless communication circuit and a connecting member; and a metal plate configured to electrically connect the connecting member and the at least one side metal sidewall, wherein a portion of the bracket protrudes from the one surface of the bracket and is configured to support the portion of the at least one side metal sidewall, and the metal plate is disposed on the portion of the bracket, and an RF signal path may be provided between the connecting member and the at least one side metal sidewall through the metal plate.

[0006] According to one embodiment of the present disclosure, an electronic device may comprise: a housing forming at least a portion of the exterior of the electronic device; a circuit board disposed within the housing and comprising a wireless communication circuit; a display disposed on the front surface of the housing; a rear plate forming at least a portion of the rear surface of the electronic device; and at least one side metal side wall electrically connected to the wireless communication circuit and forming a portion of the housing, comprising a first antenna portion forming at least a portion of the outer surface of the housing, a second antenna portion extending in a first direction from the inner surface of the first antenna portion, and a third antenna portion welded to overlap a flat portion of the second antenna portion in a second direction different from the first direction and electrically connected to the circuit board.

[0007] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0009] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 6 is a plan view illustrating an electronic device in which a portion of the housing functions as an antenna, according to one embodiment of the present disclosure.

[0014] FIG. 7 is a plan view for illustrating a side structure according to one embodiment of the present disclosure.

[0015] FIG. 8 is a perspective view for illustrating a housing including an antenna according to one embodiment of the present disclosure.

[0016] FIG. 9 is a perspective view for illustrating a housing including a conductive sheet according to one embodiment of the present disclosure.

[0017] FIG. 10 is a cross-sectional view of an electronic device cut along the line AA' of FIG. 3 according to one embodiment of the present disclosure.

[0018] FIG. 11 is a schematic diagram illustrating a multi-RF (radio frequency) signal path according to one embodiment of the present disclosure.

[0019] FIG. 12 is a cross-sectional view of an electronic device cut along the line AA' of FIG. 3 according to one embodiment of the present disclosure.

[0020] FIG. 13 is a schematic diagram illustrating a multi-RF signal path according to one embodiment of the present disclosure.

[0021] FIG. 14 is a cross-sectional view of an electronic device cut along the line AA' of FIG. 3 according to one embodiment of the present disclosure.

[0022] FIG. 15 is a schematic diagram illustrating a multi-RF signal path according to one embodiment of the present disclosure.

[0023] FIG. 16 is a cross-sectional view of an electronic device cut along the line AA' of FIG. 3 according to one embodiment of the present disclosure.

[0024] FIG. 17 is a cross-sectional view of an electronic device cut along the line AA' of FIG. 3 according to one embodiment of the present disclosure.

[0025] FIG. 18 is a perspective view showing a part of a housing including an antenna according to one embodiment of the present disclosure.

[0026] FIG. 19 is a perspective view of a conductive sheet according to one embodiment of the present disclosure.

[0027] FIG. 20 is a cross-sectional view of an electronic device including an antenna according to one embodiment of the present disclosure.

[0028] FIG. 21 is a perspective view of an electronic device including an antenna according to one embodiment of the present disclosure.

[0029] FIG. 22 is a cross-sectional view of an electronic device including an antenna according to one embodiment of the present disclosure.

[0030] FIG. 23 is a perspective view of an electronic device including an antenna according to one embodiment of the present disclosure.

[0031] FIG. 24 is a schematic diagram for illustrating an antenna according to one embodiment of the present disclosure.

[0032] FIG. 25 is a schematic diagram for illustrating an antenna according to one embodiment of the present disclosure.

[0033] FIG. 26 is a schematic diagram illustrating an antenna according to one embodiment of the present disclosure.

[0034] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0035] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0036] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0037] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0038] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0039] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0043] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0044] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0045] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0049] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0051] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0054] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0055] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0056] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear of an electronic device according to one embodiment of the present disclosure.

[0059] The embodiments of FIGS. 2 and 3 may be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 4 to 26. The configurations of the embodiments of FIGS. 2 and 3 may be partially or wholly identical to the configurations of the embodiment of FIG. 1 or the configurations of FIGS. 4 to 26.

[0060] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing (210) may refer to a structure forming part of the first surface (210A) of FIG. 2, the second surface (210B) and the side (210C) of FIG. 3. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate including various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side structure (or "side bezel structure") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0061] Although not illustrated, the front plate (202) may include region(s) that are curved and seamlessly extended toward the rear plate (211) at least a portion of the edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the regions that are curved and extended toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). Depending on the embodiment, the front plate (202) or the rear plate (211) may be substantially flat. For example, it may not include a curved and extended region. If it includes a curved and extended region, the thickness of the electronic device (101) in the portion containing the curved and extended region may be smaller than the thickness of the other portion.

[0062] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light-emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (217), or a light-emitting element (206)) or additionally include other components.

[0063] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of the side (210C). In one embodiment, the corners of the display (220) may be formed to be generally identical to the adjacent outer shape of the front plate (202). In one embodiment (not shown), to expand the area where the display (220) is visually exposed, the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be generally identical.

[0064] In one embodiment (not shown), a recess or opening is formed in a part of the screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or the opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on the back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus pen. In one embodiment, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first areas (210D) and / or the second areas (210E).

[0065] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). A microphone for acquiring external sound may be placed inside the microphone hole (203), and in one embodiment, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0066] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the second surface (210B) or side (210C) as well as on the first surface (210A) (e.g., display (220)) of the housing (210). The electronic device (101) may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0067] The camera module (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by the subject may be received through a third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the time when infrared light is received from the third sensor module (219).

[0068] A key input device (217) may be placed on a side (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module placed on a second side (210B) of the housing (210).

[0069] A light-emitting element (206) may be disposed, for example, on a first surface (210A) of a housing (210). The light-emitting element (206) may, for example, provide state information of an electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may, for example, provide a light source that is coupled with the operation of a camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0070] The connector holes (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (209) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0071] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the rear of an electronic device according to one embodiment of the present disclosure.

[0072] The embodiments of FIGS. 4 and 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 26. The configurations of the embodiments of FIGS. 4 and 5 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 3, or the configurations of FIGS. 6 to 26.

[0073] Referring to FIGS. 3 and 4, an electronic device (101) (e.g., electronic device (101) of FIG. 1 or FIG. 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., front plate (202) of FIG. 2), a display (330) (e.g., display (220) of FIG. 2), at least one printed circuit board (or board assembly) (341, 343), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., rear plate (211) of FIG. 3). When including a plurality of printed circuit boards (341, 343), the electronic device (101) may electrically connect different printed circuit boards by including at least one flexible printed circuit board (345). For example, the printed circuit boards (341, 343) may include a first circuit board (341) positioned above (e.g., in the +Y-axis direction) and a second circuit board (343) positioned below (e.g., in the -Y-axis direction) the battery (350), and the flexible printed circuit board (345) may electrically connect the first circuit board (341) and the second circuit board (343).

[0074] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., a first support member (311), or a second support member (360)) or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 to 3, and redundant descriptions are omitted below.

[0075] According to one embodiment, the first support member (311) may be provided in a flat shape for at least a portion. In one embodiment, the first support member (311) may be placed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed from, for example, a metal material (e.g., aluminum) and / or a non-metal material (e.g., polymer or injection molding). When the first support member (311) is formed at least partially from a metal material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) attached to one side and a printed circuit board (341, 343) attached to the other side. A processor, memory, and / or interface may be mounted on the printed circuit board (341, 343). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0076] According to one embodiment, the first support member (311) and the side structure (310) may be combined and referred to as a front case or housing (301). According to one embodiment, the housing (301) may be understood as a structure for generally accommodating, protecting, or housing a printed circuit board (341, 343) or a battery (350). In one embodiment, the housing (301) may be understood to include a structure that a user can visually or tactilely perceive from the exterior of the electronic device (101), such as a side structure (310), a front plate (320), and / or a rear plate (380). In one embodiment, the phrase “front or rear of the housing (301)” may refer to the first surface (210A) of FIG. 2 or the second surface (210B) of FIG. 3. In one embodiment, the first support member (311) is positioned between the front plate (320) (e.g., the first surface (210A) of FIG. 2) and the rear plate (380) (e.g., the second surface (210B) of FIG. 3), and can function as a structure for positioning electrical / electronic components such as printed circuit boards (341, 343) or a camera assembly (307).

[0077] According to one embodiment, the side structure (310) may include at least one side wall (3101, 3102, 3103, 3004). The at least one side wall (3101, 3102, 3103, 3104) may include a first side wall (3101), a second side wall (3102), a third side wall (3103), or a fourth side wall (3104).

[0078] According to one embodiment, the first side wall (3101) may be defined and / or referred to as the lower wall of the electronic device (101).

[0079] According to one embodiment, the second sidewall (3102) may extend from the first sidewall (3101) and be positioned substantially perpendicular to the first sidewall (3101). For example, the second sidewall (3102) may extend from one end of the first sidewall (3101) (e.g., the end facing the -X direction in FIG. 4 and 5).

[0080] According to one embodiment, the third sidewall (3103) may extend from the first sidewall (3101) and be positioned substantially perpendicular to the first sidewall (3101). For example, the third sidewall (3103) may extend from the other end of the first sidewall (3101) (e.g., the end facing the +X direction in FIG. 4 and 5). The third sidewall (3103) may be positioned substantially parallel to the second sidewall (3102).

[0081] According to one embodiment, the fourth side wall (3104) may be defined and / or referred to as the upper wall of the electronic device (101).

[0082] According to one embodiment, the fourth sidewall (3104) may extend from one end of the second sidewall (3102) (e.g., the end facing the +Y direction in FIG. 4 and 5).

[0083] According to one embodiment, the fourth side wall (3104) may be positioned substantially perpendicular to the second side wall (3102) and / or the third side wall (3103). Additionally, the fourth side wall (3104) may be positioned substantially parallel to the first side wall (3101).

[0084] According to one embodiment, the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104) may each include an inner surface facing the interior of the electronic device (101) and an outer surface facing the exterior of the electronic device (101).

[0085] According to one embodiment, the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104) may be formed integrally. According to one embodiment, the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104) may each be manufactured as separate members and assembled into a single side structure (310).

[0086] According to one embodiment, the first sidewall (3101), the second sidewall (3102), the third sidewall (3103), and the fourth sidewall (3104) may each be formed of a metal material and / or a non-metal material (e.g., a polymer).

[0087] According to one embodiment, the memory may include, for example, a volatile memory (e.g., the volatile memory (132) of FIG. 1) or a non-volatile memory (e.g., the non-volatile memory (134) of FIG. 1).

[0088] According to one embodiment, the interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD (secure digital) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0089] According to one embodiment, the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (341, 343) (e.g., the first circuit board (341)) together with a part of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (341) in between. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (343) in between. Circuit devices (e.g., processors, communication modules, or memory) implemented in the form of integrated circuit chips or various electrical / electronic components may be placed on printed circuit boards (341, 343), and according to the embodiment, the printed circuit boards (341, 343) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure capable of placing electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board not illustrated. For example, the lower support member (360b) may be placed to enclose an additional printed circuit board together with another part of the first support member (311). An additional printed circuit board not shown or a speaker module or interface placed on a lower support member (360b) may be placed correspondingly to the audio module (207) or connector holes (208, 209) of FIG. 2.

[0090] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, a printed circuit board (341, 343). The battery (350) may be disposed integrally inside the electronic device (101) or may be disposed detachably from the electronic device (101).

[0091] Although not illustrated, the antenna may include a conductive pattern implemented on the surface of the second support member (360) through, for example, a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the antenna in the form of a thin film may be placed between the rear plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, other antenna structures may be formed by a part or combination thereof of the side structure (310) and / or the first support member (311).

[0092] According to one embodiment, the camera assembly (307) may include at least one camera module. Inside the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be placed on a first support member (311) at a position adjacent to a printed circuit board (341, 343). In one embodiment, the camera module(s) of the camera assembly (307) may be largely aligned with any one of the camera windows (312, 313, 319) and may be wrapped at least partially in a second support member (360) (e.g., an upper support member (360a)).

[0093] FIG. 6 is a plan view illustrating an electronic device in which a portion of the housing functions as an antenna, according to one embodiment of the present disclosure.

[0094] The embodiment of FIG. 6 may be combined with the embodiments of FIG. 1 to 5, or the embodiments of FIG. 7 to 26. The configurations of the embodiment of FIG. 6 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 5, or the configurations of FIG. 7 to 26.

[0095] Referring to FIG. 6, an electronic device (101) (e.g., the electronic device (101) of FIG. 2 to 5) may include a housing (401) (e.g., the housing (301) of FIG. 4 and 5).

[0096] According to one embodiment, the housing (401) may include a side structure (410) (e.g., the side structure (310) of FIG. 4 and FIG. 5) and a first support member (411) (e.g., the first support member (311) of FIG. 4 and FIG. 5).

[0097] According to one embodiment, the first support member (411) may be combined and / or connected with the side structure (410). According to one embodiment, the first support member (411) may support components of the electronic device (101). For example, components of the electronic device (101) may be placed and / or seated on one side or the other side of the first support member (411).

[0098] According to one embodiment, the first support member (411) (e.g., bracket) may be configured to support at least one electronic component.

[0099] According to one embodiment, the first support member (411) may include a metal material (e.g., aluminum, stainless steel, or magnesium) and / or a non-metal material (e.g., injection molded).

[0100] According to one embodiment, the lateral structure (410) may include at least one side wall of the electronic device (101). The side wall may form at least a portion of the lateral surface of the electronic device (101).

[0101] According to one embodiment, the side structure (410) may include a metal material (e.g., aluminum, stainless steel, or titanium) and / or a non-metal material (e.g., injection molding).

[0102] According to one embodiment, the electronic device (101) may include at least one antenna (402). The at least one antenna (402) may be defined by a metal region formed of a metal material of the side structure (410). For example, at least a portion of the side structure (410) may form at least one antenna (402).

[0103] According to one embodiment, at least one antenna (402) may include a first antenna (4021), a second antenna (4022), a third antenna (4023), a fourth antenna (4024), a fifth antenna (4025), a sixth antenna (4026), a seventh antenna (4027), and / or an eighth antenna (4028).

[0104] According to one embodiment, each of the antennas (4021, 4022, 4023, 4023, 4024, 4025, 4026, 4027, 4028) may be electrically connected to a communication module (e.g., the communication module (190) of FIG. 1). For example, the antennas may be electrically connected to the communication module and configured to transmit and / or receive RF (radio frequency) signals.

[0105] According to one embodiment, the number of antennas is not limited by the illustrated embodiment, and some antennas of at least one antenna (402) may be omitted or at least one antenna (402) may include additional antennas.

[0106] According to one embodiment, each of the antennas may be separated through an adjacent antenna or an adjacent metal part and a non-metal part (e.g., a segmentation portion).

[0107] FIG. 7 is a plan view for illustrating a side structure according to one embodiment of the present disclosure.

[0108] The embodiment of FIG. 7 may be combined with the embodiments of FIG. 1 to 6, or the embodiments of FIG. 8 to 26. The configurations of the embodiment of FIG. 7 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 6, or the configurations of FIG. 8 to 26.

[0109] Referring to FIG. 7, the side structure (410) may include a plurality of frames that are divided from one another or separated from one another.

[0110] Although not illustrated, the side structure (410) may include a non-metallic part (e.g., the non-metallic part (414) of FIG. 18) that is positioned between a plurality of separated frames and connects the ends of the plurality of frames. The plurality of frames may include a metal material (e.g., aluminum, stainless steel, or titanium). The non-metallic part positioned between the plurality of frames may include a non-metallic material (e.g., injection molded or polymer).

[0111] According to one embodiment, any one frame of the side structure (410) may include a lateral metal sidewall (420). The lateral metal sidewall (420) may be interpreted as part of the housing (410) of the electronic device (101). For example, the housing (410) may include at least one lateral metal sidewall (420). The at least one lateral metal sidewall (420) may form at least a part of the side of the electronic device. For example, at least one frame among the plurality of frames of the side structure (410) may form an antenna (e.g., at least one antenna (402) of FIG. 6) of the electronic device (e.g., the electronic device (101) of FIG. 2 to 6). Hereinafter, embodiments of FIGS. 7 to 26 are described using a frame forming the first antenna (e.g., the first antenna (4021) of FIG. 6) shown in FIG. 6 as an example, but the descriptions thereof may be applied in the same and / or similarly to other antennas shown in FIG. 6.

[0112] According to one embodiment, a portion (421, 423) of at least one side metal sidewall (420) may be configured to function as an antenna.

[0113] According to one embodiment, an antenna formed as part of the at least one metal sidewall (420) (e.g., the first antenna (4021) of FIG. 6) may be electrically connected to a wireless communication circuit (e.g., the communication module (190) of FIG. 1, or the wireless communication circuit (441) of FIG. 10). The wireless communication circuit may be electrically connected to the antenna and may be configured to transmit and / or receive RF signals to an external electronic device through the antenna.

[0114] According to one embodiment, at least one side metal sidewall (420) operating as an antenna may include a first antenna portion (421), a second antenna portion (423), and a third antenna portion (425). The antenna portions (421, 423, 425) may each include a metal material (e.g., aluminum, stainless steel, or titanium), but are not limited thereto.

[0115] According to one embodiment, the first antenna portion (421) may form at least a part of the outer side wall of the side structure (410) or the housing (e.g., the housing (401) of FIG. 6). The first antenna portion (421) may be referred to as the outer wall or the antenna radiator.

[0116] According to one embodiment, the first antenna portion (421) may include an outer surface facing the outside of the electronic device (e.g., the outer surface (4211) of FIG. 10) and an inner surface opposite to the outer surface and facing the inside of the electronic device (e.g., the inner surface (4213) of FIG. 10). The outer surface of the first antenna portion (421) may form at least a portion of the side of the electronic device.

[0117] According to one embodiment, the second antenna portion (423) may extend in a first direction from the inner surface of the first antenna portion (421). The first direction may be substantially perpendicular to the inner surface of the first antenna portion (421), but is not limited thereto and may be a direction inclined to the inner surface of the first antenna portion (421).

[0118] According to one embodiment, the second antenna portion (423) may be formed integrally with the first antenna portion (421). For example, the first antenna portion (421) and the second antenna portion (423) may be formed through die casting or CNC (computerized numerical control) processing. The first antenna portion (421) may be referred to as an antenna radiator, and the second antenna portion (423) may be referred to as a flange.

[0119] According to one embodiment, the third antenna portion (425) may be welded to the second antenna portion (423). The third antenna portion (425) may be formed as a separate member from the second antenna portion (423) and joined to the second antenna portion (423) through a welding process.

[0120] According to one embodiment, the third antenna portion (425) can be manufactured as a separate part and joined to the second antenna portion (423) through a welding process.

[0121] According to one embodiment, the third antenna portion (425) may be formed by die-casting together with the first support member as part of the first support member (e.g., the first support member (411) of FIG. 6), then welded to the second antenna portion (423), and then cut from the first support member.

[0122] For example, according to a comparative example, when the second antenna portion and the third antenna portion are formed integrally, the CNC process must be performed repeatedly to realize a complex shape, which may increase the manufacturing cost of the antenna and / or side structure.

[0123] According to one embodiment of the present disclosure, the third antenna portion (425) is formed as a separate member from the second antenna portion (423) and then joined to the second antenna portion (423) through welding, thereby simplifying the shape of the antenna (420) and / or the side structure (410). Accordingly, the number of CNC processes is reduced, and thus manufacturing costs can be reduced.

[0124] FIG. 8 is a perspective view for illustrating a housing including an antenna according to one embodiment of the present disclosure. FIG. 9 is a perspective view for illustrating a housing including a conductive sheet according to one embodiment of the present disclosure.

[0125] The embodiments of FIGS. 8 and 9 may be combined with the embodiments of FIGS. 1 to 7, or the embodiments of FIGS. 10 to 26. The configurations of the embodiments of FIGS. 8 and 9 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 7, or the configurations of FIGS. 10 to 26.

[0126] Referring to FIGS. 8 and 9, the housing (401) (e.g., the housing (401) of FIG. 6) may include a side structure (410) (e.g., the side structure (410) of FIGS. 6 and 7) and a first support member (411) (e.g., the first support member (411) of FIG. 6) connected to the side structure (410).

[0127] Referring to FIG. 8, the side structure (410) may include at least one side metal sidewall (420) that operates as an antenna (e.g., a first antenna) and another side metal sidewall (420a) that is spaced apart from the at least one side metal sidewall (420) and operates as another antenna (e.g., a second antenna). The description of the at least one side metal sidewall (420) that operates as an antenna may be applied in the same and / or similarly to the other side metal sidewall (420a) that operates as another antenna.

[0128] According to one embodiment, the end of at least one side metal sidewall (420) may be spaced apart from the end of another side metal sidewall (420a). Although not illustrated, a non-metallic portion (e.g., the non-metallic portion (414) of FIG. 18) (e.g., a segment) may be disposed between the end of at least one side metal sidewall (420) and the end of the other side metal sidewall (420a). The at least one side metal sidewall (420) may be referred to as an antenna (e.g., a first antenna), and the other side metal sidewall (420a) may be referred to as a different antenna (e.g., a second antenna).

[0129] According to one embodiment, at least one side metal sidewall (420) may include a first antenna portion (421), a second antenna portion (423), and a third antenna portion (425).

[0130] According to one embodiment, the first antenna portion (421) and the second antenna portion (423) can be formed integrally to form one body.

[0131] According to one embodiment, the third antenna portion (425) may be formed as a separate member from the second antenna portion (423) and then joined by welding. In this case, the second antenna portion (423) and the third antenna portion (425) may each be formed independently and then joined by welding to finally form one body.

[0132] According to one embodiment, the third antenna portion (425) may be electrically connected to a wireless communication circuit (e.g., the communication module (190) of FIG. 1, or the wireless communication circuit (441) of FIG. 10). The wireless communication circuit may be electrically connected to the third antenna portion (425).

[0133] According to one embodiment, the third antenna portion (425) is welded to the second antenna portion (423), and the second antenna portion (423) may be formed integrally with the first antenna portion (421). Accordingly, the first antenna portion (421), the second antenna portion (423), and the third antenna portion (425) may form a conductive path (e.g., a first conductive path) or an RF signal path for transmitting an RF signal.

[0134] Referring to FIG. 9, the antenna (420) may include a first antenna portion (421), a second antenna portion (423), a third antenna portion (425), and a metal plate (427).

[0135] According to one embodiment, the metal plate (427) may include a metal material (e.g., copper or nickel), but is not limited thereto.

[0136] According to one embodiment, the metal plate (427) may be joined to the second antenna portion (423) and the third antenna portion (425). For example, the metal plate (427) may be welded to the second antenna portion (423) and the third antenna portion (425), but is not limited thereto. For example, the metal plate (427) may be joined to the second antenna portion (423) and the third antenna portion (425) through separate conductive parts (e.g., bolts or pins).

[0137] According to one embodiment, the metal plate (427) may be electrically connected to the second antenna portion (423) and the third antenna portion (425). The metal plate (427) may form another conductive path (e.g., the second conductive path) or another RF signal path for transmitting an RF signal.

[0138] According to one embodiment, at least one side metal sidewall (420) operating as an antenna may include a multi-RF (radio frequency) signal path electrically connected to a wireless communication circuit by including a conductive path (e.g., a first conductive path) and another conductive path (e.g., a second conductive path).

[0139] FIG. 10 is a cross-sectional view of an electronic device cut along the line AA' of FIG. 3 according to one embodiment of the present disclosure. FIG. 11 is a schematic diagram illustrating a multi-RF signal path according to one embodiment of the present disclosure.

[0140] The embodiments of FIGS. 10 and 11 may be combined with the embodiments of FIGS. 1 to 9, or the embodiments of FIGS. 12 to 26. The configurations of the embodiments of FIGS. 10 and 11 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 9, or the configurations of FIGS. 12 to 26.

[0141] Referring to FIGS. 10 and 11, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 through 6) may include a housing (401) (e.g., the housing (401) of FIG. 6). The housing (401) may form at least a part of the exterior of the electronic device (101).

[0142] According to one embodiment, the housing (401) may include a side structure (410) (e.g., the side structure (310) of FIG. 4 and 5, or the side structure (410) of FIG. 6), a bracket (411) (e.g., the first support member (311) of FIG. 4 and 5, or the first support member (411) of FIG. 6), and a rear plate (480) (e.g., the rear plate (380) of FIG. 4 and 5). The rear plate (480) may form at least a portion of the rear surface of the electronic device (101).

[0143] According to one embodiment, the bracket (411) may be configured to support at least one electronic component. The bracket (411) may be placed inside the housing (401).

[0144] According to one embodiment, the electronic device (101) may include a circuit board (440) (e.g., at least one printed circuit board (341, 343) of FIG. 4 and FIG. 5). The circuit board (440) may be placed in the internal space of a housing (401) defined or enclosed by a side structure (410), a first support member (411), and a rear plate (480). For example, the circuit board (440) may be placed on the rear surface of the first support member (411) (e.g., the side facing the -Z direction in FIG. 10) and supported by the first support member (411).

[0145] According to one embodiment, the circuit board (440) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or an RF-PCB (rigid-flexible PCB).

[0146] According to one embodiment, the circuit board (440) may include a wireless communication circuit (441) (e.g., the communication module (190) of FIG. 1). The wireless communication circuit (441) may be a component in the form of a chip disposed on or mounted on one side of the circuit board (440), but may include other forms of implementation. For example, the wireless communication circuit (441) may be implemented as a circuit embedded in the circuit board (440).

[0147] According to one embodiment, the wireless communication circuit (441) may be configured to transmit and / or receive RF signals to and from an external electronic device through an antenna (420).

[0148] According to one embodiment, the electronic device (101) may include a waterproofing member (460) comprising a waterproofing material.

[0149] According to one embodiment, the waterproof member (460) may include a waterproof tape.

[0150] According to one embodiment, a waterproof member (460) may be positioned between the second antenna portion (423) and the rear plate (480). The waterproof member (460) may be coupled to the second antenna portion (423) and the rear plate (480) to restrict and / or block moisture or foreign substances from the outside of the electronic device (101) from entering the interior of the electronic device (101) through the space between the side structure (410) and the rear plate (480). That is, the waterproof member (460) may seal the space between the rear plate (480) and the side structure (410) to provide a waterproof function for the electronic device (101).

[0151] According to one embodiment, the side structure (410) may include at least one side metal sidewall (420) configured to be electrically connected to a wireless communication circuit (441) and to function as an antenna (e.g., at least one side metal sidewall (420) of FIG. 9).

[0152] According to one embodiment, at least one side metal sidewall (420) may include a first antenna portion (421), a second antenna portion (423), and a metal plate (427).

[0153] According to one embodiment, the metal plate (427) may be configured to electrically connect the connecting member (450) and at least one side metal sidewall (420).

[0154] According to one embodiment, a portion (413) of the bracket (411) may protrude from one surface of the bracket (411). The portion (413) of the bracket (411) may include a metal support. The portion (413) of the bracket (411) (e.g., metal support) may be configured to support a portion (e.g., a first antenna portion (421) and a second antenna portion (423)) of at least one side metal sidewall (420).

[0155] According to one embodiment, the metal support (413) of the bracket (411) may be interpreted as part of the bracket (411). According to one embodiment, the metal support (413) may be defined and / or interpreted as part of at least one side metal sidewall (420) (e.g., the third antenna part (425) of FIG. 9).

[0156] According to one embodiment, the first antenna portion (421) may form at least a portion of the outer wall of the housing (401). The first antenna portion (421) may include an outer surface (4211) facing the outside of the electronic device (101) and an inner surface (4213) opposite to the outer surface (4211) and facing the inside of the electronic device (101). The outer surface (4211) may form at least a portion of the outer surface of the electronic device (101) and / or the housing (401).

[0157] According to one embodiment, the second antenna portion (423) may extend from the inner surface of the first antenna portion (421) in a first direction (e.g., the Y-axis direction of FIG. 10). The first direction may be substantially perpendicular to the inner surface of the first antenna portion (421), but is not limited thereto. For example, the first direction may be inclined to the inner surface of the first antenna portion (421).

[0158] According to one embodiment, a part (413) of the bracket (411) (e.g., a metal support) may be joined to the second antenna part (423). A part (413) of the bracket (411) (e.g., a metal support) may be welded to the second antenna part (423).

[0159] According to one embodiment, a part (413) of the bracket (411) (e.g., a metal support) may be welded to overlap a flat portion of the second antenna part (423) in a second direction different from the first direction (e.g., the Z-axis direction of FIG. 10). The second direction may be substantially perpendicular to the first direction, but is not limited thereto. The second direction may be inclined to the first direction. The overlap of a part (413) of the bracket (411) (e.g., a metal support) to a flat portion of the second antenna part (423) may be understood as the part (413) of the bracket (411) (e.g., a metal support) being seated and overlapped on a flat or smooth portion of the outer surface of the second antenna part (423) that is free of steps such as grooves or protrusions, but is not limited thereto.

[0160] According to one embodiment, a part (413) of the bracket (411) (e.g., a metal support) may be electrically connected to a wireless communication circuit (441). For example, a part (413) of the bracket (411) (e.g., a metal support) may be electrically connected to the wireless communication circuit (441) through a conductive sheet (427), an RF connector (450), and a circuit board (440).

[0161] According to one embodiment, a portion (413) of a bracket (411) (e.g., a metal support) may include a first element (4131) extending in a first direction, and a second element (4133) extending from the first element (4131) and extending in a second direction different from the first direction.

[0162] According to one embodiment, the first element (4131) may extend in a first direction and may overlap the flat portion of the second antenna portion (423) in a second direction. The first element (4131) may be welded to the flat portion of the second antenna portion (423). The illustrated reference numeral 4132 indicates the welded portion of the first element (4131) and the second antenna portion (423).

[0163] According to one embodiment, the first element (4131) may be welded so as to overlap with the area facing the display (e.g., the display (330) of FIG. 4 and FIG. 5) in the flat portion of the second antenna portion (423), but is not limited thereto.

[0164] According to one embodiment, the second element (4133) may extend in a second direction from the first element (4131).

[0165] According to one embodiment, the second element (4133) may be spaced apart from and facing the end of the second antenna portion (423) (e.g., the end facing the -Y direction in FIG. 10), but is not limited thereto. For example, the housing (401) of the electronic device (101) may include a non-metallic region (403) (e.g., injection molded) disposed between the second element (4133) and the end of the second antenna portion (423), but is not limited thereto.

[0166] According to one embodiment, the metal plate (427) may be coupled to a part (413) of the second antenna part (423) and the bracket (411) (e.g., a metal support) and may be electrically connected to a part (413) of the second antenna part (423) and the bracket (411) (e.g., a metal support).

[0167] According to one embodiment, the metal plate (427) may be defined and / or referred to as a conductive sheet.

[0168] According to one embodiment, the metal plate (427) may have a greater conductivity than a part (413) of the bracket (411) (e.g., metal support (413)). For example, as the metal plate (427) has a greater conductivity than a part (413) of the bracket (411), the conduction rate of the RF signal through the metal plate (427) may be improved.

[0169] According to one embodiment, the metal plate (427) may be welded to the second antenna portion (423) and a portion (413) of the bracket (411). For example, the metal plate (427) may be welded to the second antenna portion (423) and a portion (413) of the bracket (411) so as to be electrically connected to the second antenna portion (423) and a portion (413) of the bracket (411). The metal plate (427) may be configured to provide an RF signal path between a portion (421, 423) of at least one side metal sidewall (420) that acts as an antenna from the connecting member (450). In this case, the metal plate (427) may form at least a portion of a multi-RF signal path.

[0170] According to one embodiment, the metal plate (427) may be joined to the second antenna portion (423) and a portion (413) of the bracket (411) via a conductive tape. For example, the metal plate (427) may be electrically connected to the second antenna portion (423) and a portion (413) of the bracket (411) via a conductive tape. The metal plate (427) may be configured to provide an RF signal path between a portion (421, 423) of at least one side metal sidewall (420) that acts as an antenna from the connecting member (450). In this case, the metal plate (427) may form at least a portion of a multi-RF signal path.

[0171] According to one embodiment, a first region (4271) of the metal plate (427) may be joined to a second antenna portion (423) and a portion (413) of the bracket (411) via a non-conductive tape (e.g., insulating tape). As the first region (4271) of the metal plate (427) is joined to the second antenna portion (423) and a portion (413) of the bracket (411) via a non-conductive tape, it may be electrically insulated from the second antenna portion (423). In this case, it may be configured so as not to provide an RF signal path between the first region (4271) of the metal plate (427) and the second antenna portion (423), but is not limited thereto. For example, as the metal plate (427) does not provide an RF signal path between the first region (4271) of the metal plate (427) and the second antenna portion (423), a single RF signal path may be provided between a portion (421, 423) of at least one side metal sidewall (420) that acts as an antenna from the connecting member (450). According to an embodiment, the first region (4271) of the metal plate (427) and the second antenna portion (423) may be electromagnetically coupled so that an RF signal path is formed between them, and in such case, the first region (4271) of the metal plate (427) may form at least a portion of a multi-RF signal path.

[0172] According to one embodiment, the metal plate (427) may include a first region (4271) and a second region (4273).

[0173] According to one embodiment, the first region (4271) may extend in a first direction. For example, at least a portion of the metal plate (427) may extend in the first direction. The extension of at least a portion of the metal plate (427) in the first direction may be understood as the metal plate (427) extending at least partially from the second antenna portion (423) toward a portion (413) of the bracket (411).

[0174] According to one embodiment, the first region (4271) may be welded so as to overlap the area facing the rear plate (480) among the flat portions of the second antenna portion (423). The illustrated reference numeral 4272 indicates the portion where the first region (4271) and the second antenna portion (423) are welded.

[0175] According to one embodiment, the second region (4273) may extend in a second direction from the first region (4271). The second region (4273) may be joined to a part (413) of the bracket (411) to cover at least a portion of the second element (4133) of the part (413) of the bracket (411). For example, the second region (4273) may be welded so as to overlap with the second element (4133) of the part (413) of the bracket (411). The illustrated reference numeral 4274 indicates the portion where the second region (4273) and the second element (4133) are welded.

[0176] According to one embodiment, the electronic device (101) and / or circuit board (440) may include a connecting member (450) disposed on one side of the circuit board (440). The connecting member (450) may be disposed in the internal space of the housing (401). The connecting member (450) may be disposed on and / or mounted on the circuit board (440) and may be in contact with a second region (4273) of the metal plate (427). The connecting member (450) may be defined as a feeding part configured to feed an RF signal.

[0177] According to one embodiment, the connecting member (450) may include at least one of a C-clip, a finger-clip, or a conductive gasket, but is not limited thereto.

[0178] Although not illustrated, the metal plate (427) may have a second region (4273) omitted, and the connecting member (450) may be in direct contact with the second element (4133) of a part (413) of the bracket (411).

[0179] According to one embodiment, at least one side metal sidewall (420) and / or a metal support (413) of a bracket (411) may be electrically connected to the ground of an electronic device (101). For example, the metal support (413) of the bracket (411) may be electrically connected to the ground of a circuit board (440) through a separate connector (e.g., C-clip, finger-clip, or conductive gasket).

[0180] According to one embodiment, the wireless communication circuit (441) can be electrically connected to the metal plate (427) through the circuit board (440) and the connecting member (450).

[0181] According to one embodiment, the wireless communication circuit (441) may be configured to transmit and / or receive RF signals to and from an external electronic device through at least one side metal sidewall (420). For example, the wireless communication circuit (441) may radiate RF signals to the outside of the electronic device (101) through a multi-RF signal path comprising a circuit board (440), a connecting member (450), a metal plate (427), a metal support (413) of a bracket (411), a second antenna portion (423), and a first antenna portion (421). For example, the wireless communication circuit (441) may be configured to transmit and / or receive RF signals through a multi-RF signal path.

[0182] According to one embodiment, the bracket (411) may include a metal part (411b) (e.g., stainless steel) and a non-metal part (411a). The non-metal part (411a) may include an insert molding resin formed by insert injection together with the metal part (411b).

[0183] According to one embodiment, a portion (4111a) of the non-metallic portion (411a) of the bracket (411) may have a portion (413) of the bracket (411) (e.g., a metal support) positioned thereon and may be in contact with a portion (421, 423) of at least one side metal sidewall (420).

[0184] According to one embodiment, a part (413) (e.g., a metal support) of the bracket (411) may be formed separately from the metal part (411b) and the non-metal part (411a) of the bracket (411), but is not limited thereto. According to one embodiment, a part (413) (e.g., a metal support) of the bracket (411) may be formed integrally with the metal part (411b) and the non-metal part (411a) of the bracket (411).

[0185] Referring to FIG. 11, a gap (g) may be formed between the inner surface of the first antenna portion (421) (e.g., inner surface (4213) of FIG. 10) and the first element of the metal support (413) of the bracket (411) (e.g., first element (4133) of FIG. 10). The gap (g) may be a metal gap formed between the first element of the metal support (413) and the inner surface of the first antenna portion (421), but is not limited thereto. The gap (g) may be an air gap, but is not limited thereto. For example, the gap (g) may be filled with an insulating material (e.g., a non-conductive material). Due to the gap (g) (e.g., a metal gap), parasitic capacitance may be formed between the first antenna portion (421) and the metal support (413) of the bracket (411). Parasitic capacitance can reduce the radiation efficiency of at least one side metal sidewall (420) operating as an antenna. According to one embodiment of the present disclosure, multiple RF signal paths (P1, P2) may be provided. The multi-RF signal path (P1, P2) may include a first RF signal path (P1) defined by a second area of ​​the metal plate (427) (e.g., the second area (4273) of FIG. 10), a part of the bracket (411) (413), a second antenna part (423), and a first antenna part (421), and a second RF signal path (P2) defined by a second area of ​​the metal plate (427) (e.g., the second area (4273) of FIG. 10), a first area of ​​the metal plate (427) (e.g., the first area (4273) of FIG. 10), a part of the bracket (411) (413), a second antenna part (423), and a first antenna part (421). Accordingly, the path through which an RF signal is transmitted from a wireless communication circuit (e.g., the wireless communication circuit (441) of FIG. 10) is provided as a multi-RF signal path (P1, P2), thereby limiting, preventing, and / or reducing the reduction in antenna radiation efficiency caused by parasitic capacitance.

[0186] FIG. 12 is a cross-sectional view of an electronic device cut along line AA' of FIG. 3 according to one embodiment of the present disclosure. FIG. 13 is a schematic diagram illustrating a multi-RF signal path according to one embodiment of the present disclosure.

[0187] The embodiments of FIGS. 12 and 13 may be combined with the embodiments of FIGS. 1 to 11, or the embodiments of FIGS. 14 to 26. The configurations of the embodiments of FIGS. 12 and 13 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 11, or the configurations of FIGS. 14 to 26.

[0188] Among the configurations of the embodiments of FIGS. 12 and 13, the configurations having the same reference numerals as the configurations of FIGS. 10 and 11 may be described by reference to the configurations of FIGS. 10 and 11.

[0189] Referring to FIGS. 12 and 13, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 through 6) may include a housing (401) (e.g., the housing (401) of FIG. 6). The housing (401) may form at least a part of the exterior of the electronic device (101).

[0190] According to one embodiment, the side structure (410) of the housing (401) may include at least one side metal sidewall (420).

[0191] According to one embodiment, at least one side metal sidewall (420) can function as an antenna. The at least one side metal sidewall (420) may include a first antenna portion (421), a second antenna portion (423), a metal plate (427a) (e.g., the metal plate (427) of FIG. 10), and another metal plate (429).

[0192] According to one embodiment, the metal plate (427a) may be coupled to a part (413) of the second antenna part (423) and the bracket (411) (e.g., a metal support) and may be coupled to be electrically connected to the part (413) of the second antenna part (423) and the bracket (411).

[0193] According to one embodiment, the metal plate (427a) may be extended in a first direction. According to one embodiment, the extension of the metal plate (427a) in the first direction may be understood as the metal plate (427a) extending from the second antenna portion (423) toward a portion (413) of the bracket (411).

[0194] According to one embodiment, the metal plate (427a) may be welded so as to overlap the area facing the rear plate (480) in the flat portion of the second antenna portion (423). The illustrated reference numeral 4272a indicates the portion where the metal plate (427a) and the second antenna portion (423) are welded.

[0195] According to one embodiment, the metal plate (427a) may be welded so as to overlap the area facing the rear plate (480) among the second elements (4133) of the metal support (413). The illustrated reference numeral 4272b indicates the portion where the metal plate (427a) and the third antenna portion (425) are welded.

[0196] According to one embodiment, the other metal plate (429) may be a separate plate separated from the metal plate (427a). The other metal plate (429) may include copper or nickel, but is not limited thereto.

[0197] According to one embodiment, the metal plate (427a) may be referred to as the first metal plate, and the other metal plate (429) may be referred to as the second metal plate.

[0198] According to one embodiment, the other metal plate (429) may extend in a second direction. The other metal plate (429) may be joined to the metal support (413) to cover at least a portion of the second element (4133) of the metal support (413). For example, the other metal plate (429) may be welded so as to overlap the second element (4133) of the metal support (413). The illustrated reference numeral 4291 indicates the portion where the other metal plate (429) and the second element (4133) are welded.

[0199] According to one embodiment, the waterproof member (460) may be positioned so as not to cover the metal plate (427a). Accordingly, when repair of the metal plate (427a) is required, the metal plate (427a) can be immediately exposed by separating the rear plate (480), making the repair easier.

[0200] According to one embodiment, the connecting member (450) may be placed on and / or mounted on a circuit board (440) and may be in contact with another metal plate (429).

[0201] According to one embodiment, the wireless communication circuit (441) can be electrically connected to another metal plate (429) through a circuit board (440) and a connecting member (450).

[0202] According to one embodiment, the wireless communication circuit (441) may be configured to transmit and / or receive RF signals to and from an external electronic device through at least one side metal sidewall (420) that acts as an antenna. For example, the wireless communication circuit (441) may radiate RF signals to the outside of the electronic device (101) through a multi-RF signal path comprising a circuit board (440), a connecting member (450), another metal plate (429), a metal support (413), a metal plate (427a), a second antenna portion (423), and a first antenna portion (421). For example, the wireless communication circuit (441) may be configured to transmit and / or receive RF signals through the multi-RF signal path.

[0203] Referring to FIG. 13, a gap (g) may be formed between the inner surface of the first antenna portion (421) (e.g., inner surface (4213) of FIG. 12) and the first element of the metal support (413) (e.g., first element (4131) of FIG. 12). Due to the gap (g), parasitic capacitance may be formed between the first antenna portion (421) and the metal support (413). Parasitic capacitance may reduce the radiation efficiency of at least one side metal sidewall (420) acting as an antenna. According to one embodiment of the present disclosure, multiple RF signal paths (P1, P2) may be provided. A multi-RF signal path (P1, P2) may include a first RF signal path (P1) defined by another metal plate (429), a metal support (413), a second antenna part (423), and a first antenna part (421), and a second RF signal path (P2) defined by another metal plate (429), a metal support (413), a metal plate (427a), a second antenna part (423), and a first antenna part (421). Accordingly, a path through which an RF signal is transmitted from a wireless communication circuit (e.g., the wireless communication circuit (441) of FIG. 12) is provided as a multi-RF signal path (P1, P2), so as to limit, prevent, and / or reduce the reduction of antenna radiation efficiency due to parasitic capacitance.

[0204] FIG. 14 is a cross-sectional view of an electronic device cut along line AA' of FIG. 3 according to one embodiment of the present disclosure. FIG. 15 is a schematic diagram illustrating a multi-RF signal path according to one embodiment of the present disclosure.

[0205] The embodiments of FIGS. 14 and 15 may be combined with the embodiments of FIGS. 1 to 13, or the embodiments of FIGS. 16 to 26. The configurations of the embodiments of FIGS. 14 and 15 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 11, or the configurations of the embodiments of FIGS. 14 to 26.

[0206] Among the configurations of the embodiments of FIGS. 14 and 15, the configurations having the same reference numerals as the configurations of FIGS. 10 to 13 may refer to the description of the configurations of FIGS. 10 to 13.

[0207] Referring to FIGS. 14 and 15, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 through 6) may include a housing (401) (e.g., the housing (401) of FIG. 6). The housing (401) may form at least a part of the exterior of the electronic device (101).

[0208] According to one embodiment, the side structure (410) of the housing (401) may include at least one side metal sidewall (420) that operates as an antenna.

[0209] According to one embodiment, at least one side metal sidewall (420) may include a first antenna portion (421), a second antenna portion (423), a metal plate (427b) (e.g., the metal plate (427) of FIG. 10), and another metal plate (429).

[0210] According to one embodiment, the metal plate (427b) may be coupled to a part (413) of the first antenna part (421) and the bracket (411) (e.g., a metal support) and may be electrically connected to the part (413) of the first antenna part (421) and the bracket (411).

[0211] According to one embodiment, the metal plate (427b) may include a first region (4271b) and a second region (4273b).

[0212] According to one embodiment, the first region (4271b) may extend in a first direction. For example, at least a portion of the metal plate (427b) may extend in a first direction. The extension of at least a portion of the metal plate (427b) in a first direction may be understood as the metal plate (427b) extending at least partially from the second antenna portion (423) toward a portion (413) of the bracket (411) or from the first antenna portion (421) toward a portion (413) of the bracket (411).

[0213] According to one embodiment, the first region (4271b) may be welded so as to overlap the area facing the display (e.g., the display (330) of FIG. 4 and FIG. 5) in the flat portion of the first element (4131) of a part (413) of the bracket (411) (e.g., a metal support). The display may be placed on the front surface of the housing (401). Illustrated reference numeral 4272b indicates the portion where the first region (4271b) and the first element (4131) of the metal support (413) of the bracket (411) are welded.

[0214] According to one embodiment, the second region (4273b) may extend in a second direction from the first region (4271b). The second region (4273b) may be coupled to the first antenna portion (421) to cover at least a portion of the inner surface (4213) of the first antenna portion (421). For example, the second region (4273b) may be welded so as to overlap the inner surface (4213) of the first antenna portion (421). The illustrated reference numeral 4274b indicates the portion where the second region (4273b) and the first antenna portion (421) are welded.

[0215] According to one embodiment, the waterproof member (460a) (e.g., the waterproof member (460) of FIG. 10) may extend from the second antenna portion (423) to the non-metallic region (403) (e.g., the non-metallic region (403) of FIG. 10), but is not limited thereto.

[0216] According to one embodiment, the wireless communication circuit (441) can be electrically connected to another metal plate (429) through a circuit board (440) and a connecting member (450).

[0217] According to one embodiment, the wireless communication circuit (441) may be configured to transmit and / or receive RF signals to and from an external electronic device through at least one side metal sidewall (420) that acts as an antenna. For example, the wireless communication circuit (441) may radiate RF signals to the outside of the electronic device (101) through a multi-RF signal path comprising a circuit board (440), a connecting member (450), another metal plate (429), a metal support (413), a second antenna portion (423), a metal plate (427b), and a first antenna portion (421). For example, the wireless communication circuit (441) may be configured to transmit and / or receive RF signals through a multi-RF signal path.

[0218] Referring to FIG. 15, a gap (g) may be formed between the inner surface of the first antenna portion (421) (e.g., inner surface (4213) of FIG. 14) and the first element of the metal support (413) (e.g., first element (4131) of FIG. 14). Due to the gap (g), parasitic capacitance may be formed between the first antenna portion (421) and the metal support (413). Parasitic capacitance may reduce the radiation efficiency of the antenna (420). According to one embodiment of the present disclosure, multiple RF signal paths (P1, P2) may be provided. The multi-RF signal path (P1, P2) may include a first RF signal path (P1) defined by another metal plate (429), a metal support (413), a second antenna portion (423), and a first antenna portion (421), and a second RF signal path (P2) defined by another metal plate (429), a metal support (413), a metal plate (427b), and a first antenna portion (421). Accordingly, a path through which an RF signal is transmitted from a wireless communication circuit (e.g., the wireless communication circuit (441) of FIG. 14) is provided as a multi-RF signal path (P1, P2), thereby limiting, preventing, and / or reducing the reduction of antenna radiation efficiency due to parasitic capacitance.

[0219] FIG. 16 is a cross-sectional view of an electronic device cut along line AA' of FIG. 3 according to one embodiment of the present disclosure. FIG. 17 is a cross-sectional view of an electronic device cut along line AA' of FIG. 3 according to one embodiment of the present disclosure.

[0220] The embodiments of FIGS. 16 and 17 may be combined with the embodiments of FIGS. 1 to 15, or the embodiments of FIGS. 18 to 26. The configurations of the embodiments of FIGS. 16 and 17 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 15, or the configurations of FIGS. 18 to 26.

[0221] Among the configurations of the embodiments of FIGS. 16 and 17, the configurations having the same reference numerals as the configurations of FIGS. 10 to 15 may be described by reference to the configurations of FIGS. 10 to 15.

[0222] Referring to FIG. 16, at least one side metal sidewall (420) that acts as an antenna for an electronic device (101) (e.g., the electronic device (101) of FIG. 2 to 6) may include a metal plate (427c) (e.g., the metal plate (427) of FIG. 10).

[0223] According to one embodiment, the metal plate (427c) can be coupled to the second antenna portion (423) and the metal support (413), and can be electrically connected to the second antenna portion (423) and the metal support (413).

[0224] According to one embodiment, the metal plate (427c) may be extended in a first direction. According to one embodiment, the extension of the metal plate (427c) in the first direction may be understood as the metal plate (427c) extending from the second antenna portion (423) toward the metal support (413).

[0225] According to one embodiment, at least a portion of the metal plate (427c) may be placed in a recess (4231) formed in the portion facing the rear plate (480) of the second antenna portion (423). For example, the metal plate (427c) may be placed in at least a portion of the second antenna portion (423) where the recess (4231) is formed, and may form a substantially flat plane with the other portion of the second antenna portion (423).

[0226] According to one embodiment, the metal plate (427c) may be welded so as to overlap the recess (4231) of the second antenna portion (423). The illustrated reference numeral 4271c indicates the portion where the metal plate (427c) and the recess (4231) of the second antenna portion (423) are welded.

[0227] According to one embodiment, the metal plate (427c) may be welded so as to overlap the area facing the rear plate (480) among the second elements (4133) of the metal support (413). The illustrated reference numeral 4272c indicates the portion where the metal plate (427c) and the metal support (413) are welded.

[0228] According to one embodiment, the waterproof member (460b) (e.g., the waterproof member (460) of FIG. 10a) may be positioned to cover at least a portion of the second antenna portion (423) and at least a portion of the metal plate (427c).

[0229] Referring to FIG. 17, at least one side metal sidewall (420) that acts as an antenna for an electronic device (101) (e.g., the electronic device (101) of FIG. 2 to 6) may include a metal plate (427d) (e.g., the metal plate (427) of FIG. 10).

[0230] According to one embodiment, the metal plate (427d) can be coupled to the metal support (413) of the second antenna portion (423) and the bracket (411), and can be electrically connected to the second antenna portion (423) and the metal support (413).

[0231] According to one embodiment, the electronic device (101) may include a cover portion (404).

[0232] According to one embodiment, the metal plate (427d) may be covered by a cover portion (404). The cover portion (404) may include a non-metallic material (e.g., injection molded), but is not limited thereto.

[0233] According to one embodiment, the cover portion (404) can cover at least a portion of the metal plate (427d) and at least a portion of the second antenna portion (423).

[0234] According to one embodiment, the waterproof member (460c) may cover at least a portion of the cover portion (404). For example, the waterproof member (460c) may be positioned between the cover portion (404) and the rear plate (480) to limit, prevent, and / or reduce foreign matter and / or moisture from the outside of the electronic device (101) entering the inside of the electronic device (101) through the space between the cover portion (404) and the rear plate (480).

[0235] According to one embodiment, the metal plate (427d) may be extended in a first direction. According to one embodiment, the extension of the metal plate (427d) in the first direction may be understood as the metal plate (427d) extending from the second antenna portion (423) toward.

[0236] According to one embodiment, the metal plate (427d) may be welded so as to overlap the second antenna portion (423). The illustrated reference numeral (4271d) indicates the portion where the metal plate (427d) and the second antenna portion (423) are welded.

[0237] According to one embodiment, the metal plate (427d) may be welded so as to overlap the area facing the rear plate (480) among the second elements (4133) of the metal support (413). The illustrated reference numeral 4272d indicates the portion where the metal plate (427d) and the metal support (413) are welded.

[0238] FIG. 18 is a perspective view showing a part of a housing including an antenna according to one embodiment of the present disclosure.

[0239] The embodiment of FIG. 18 may be combined with the embodiments of FIG. 1 to 17, or the embodiments of FIG. 19 to 26. The configurations of the embodiment of FIG. 18 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 17, or the configurations of FIG. 19 to 26.

[0240] Referring to FIG. 18, the housing (401) (e.g., the housing (401) of FIG. 8) may include a side structure (410) and a first support member (411).

[0241] According to one embodiment, the side structure (410) may include at least one side metal sidewall (420) that functions as an antenna and another side metal sidewall (420a) that functions as a different antenna and is spaced apart from the at least one side metal sidewall (420). The side structure (410) may include a non-metal portion (414) that extends from at least a portion (412) of the bracket (411) and is positioned between the at least one side metal sidewall (420) and the other side metal sidewall (420a). The non-metal portion (414) may be referred to as a segmentation portion.

[0242] According to one embodiment, at least a portion (412) of the bracket (411) may wrap around at least a portion of the flanges of at least one side metal sidewall (420) and the other side metal sidewall (420a) (e.g., the second antenna portion (423) and the metal support (413) of FIG. 8). For example, when the bracket (411) is injection molded, at least a portion of at least one side metal sidewall (420) and the other side metal sidewall (420a) may be injection molded so that they are wrapped by at least a portion (412) of the bracket (411).

[0243] According to one embodiment, one side (4232) of the second antenna portion (423) and one side (4132) of the metal support (413) may be exposed without being covered by at least a part (412) of the bracket (411).

[0244] According to one embodiment, a metal plate (427) (e.g., the metal plate (427) of FIG. 10) may be electrically connected by welding to one side (4232) of the exposed second antenna portion (423) and one side (4132) of the metal support (413).

[0245] FIG. 19 is a perspective view of a conductive sheet according to one embodiment of the present disclosure.

[0246] The embodiment of FIG. 19 may be combined with the embodiments of FIG. 1 to 18, or the embodiments of FIG. 20 to 26. The configurations of the embodiment of FIG. 19 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 18, or the configurations of FIG. 20 to 26.

[0247] Referring to FIG. 19, the metal plate (527) (e.g., the metal plate (427) of FIG. 10) may include a first region (5271), a second region (5273), and a connecting region (5275).

[0248] According to one embodiment, at least a portion of the first region (5271) (e.g., the first region (4271) of FIG. 10) may be welded to an exposed surface (e.g., the exposed surface (4232) of FIG. 18) of the second antenna portion (e.g., the second antenna portion (423) of FIG. 18).

[0249] According to one embodiment, at least a portion of the second region (5273) (e.g., the second region (4273) of FIG. 10) may be welded to an exposed side (e.g., the exposed side (4132) of FIG. 18) of a metal support (e.g., the metal support (413) of FIG. 18).

[0250] According to one embodiment, the connecting area (5275) may be positioned to cover the second area (5273), and the connecting area (5275) may be coupled to at least a part of the bracket (e.g., at least a part (412) of the bracket (411) in FIG. 18), but is not limited thereto. That is, the connecting area (5275) may be coupled to at least a part of the bracket forming a peripheral area of ​​one exposed side of the metal support.

[0251] FIG. 20 is a cross-sectional view of an electronic device including an antenna according to one embodiment of the present disclosure. FIG. 21 is a perspective view of an electronic device including an antenna according to one embodiment of the present disclosure.

[0252] FIG. 22 is a cross-sectional view of an electronic device including an antenna according to one embodiment of the present disclosure. FIG. 23 is a perspective view of an electronic device including an antenna according to one embodiment of the present disclosure.

[0253] The embodiments of FIGS. 20 to 23 may be combined with the embodiments of FIGS. 1 to 19 or the embodiments of FIGS. 24 to 26. The configurations of the embodiments of FIGS. 20 to 23 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 19 or the configurations of FIGS. 24 to 26.

[0254] Referring to FIGS. 20 through 23, an electronic device (101) (e.g., the electronic device (101) of FIG. 10) may include at least one side metal sidewall (520) (e.g., at least one side metal sidewall (420) of FIG. 10), and a rear plate (580) (e.g., the rear plate (480) of FIG. 10).

[0255] According to one embodiment, at least one side metal sidewall (520) may include a first antenna portion (521) (e.g., the first antenna portion (421) of FIG. 10), and a second antenna portion (523) (e.g., the second antenna portion (423) of FIG. 10).

[0256] According to one embodiment, a metal support (513, 513a) (e.g., metal support (413) of FIG. 10) may include a first element (5131, 5131a) (e.g., first element (4131) of FIG. 10) extending along a second antenna portion (523) and a second element (5133, 5133a) (e.g., second element (4133) of FIG. 10) extending from the first element (5131, 5131a) and substantially perpendicular to the first element (5131, 5131a).

[0257] According to one embodiment, a non-metallic region (503, 503a) (e.g., the non-metallic region (403) of FIG. 10) may be disposed between the second antenna portion (523) and the second element (5133, 5133a) of the metal support (513, 513a).

[0258] Referring to FIGS. 20 and 21, a first element (5131) of the metal support (513) may be welded over an area facing the display (e.g., the display (330) of FIGS. 4 and 5) in the flat portion of the second antenna portion (523). Reference numeral 5132 shown in FIG. 20 indicates the portion where the second antenna portion (523) and the first element (5131) of the metal support (513) are welded.

[0259] Referring to FIGS. 22 and 23, a first element (5131a) of the metal support (513a) may be welded over the area facing the rear plate (580) in the flat portion of the second antenna portion (523). Reference numeral 5132a shown in FIG. 22 indicates the portion where the second antenna portion (523) and the metal support (513a) are welded.

[0260] Referring to FIGS. 20 to 23, a metal support (513, 513a) can be connected to a connecting member (e.g., the connecting member (450) of FIG. 10) and electrically connected to a wireless communication circuit (e.g., the wireless communication circuit (441) of FIG. 10).

[0261] FIG. 24 is a schematic diagram illustrating an antenna according to one embodiment of the present disclosure. FIG. 25 is a schematic diagram illustrating an antenna according to one embodiment of the present disclosure. FIG. 26 is a schematic diagram illustrating an antenna according to one embodiment of the present disclosure.

[0262] The embodiments of FIGS. 24 to 26 can be combined with the embodiments of FIGS. 1 to 23. The configurations of the embodiments of FIGS. 24 to 26 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 23.

[0263] Referring to FIGS. 24 through 26, at least one side metal sidewall (520) (e.g., at least one side metal sidewall (520) of FIGS. 20 and 22) may include a first antenna portion (521), a second antenna portion (523, 523a), and a metal support (513b, 513c, 513d).

[0264] Referring to FIG. 24, the second antenna portion (523) may extend from the first antenna portion (521) in a direction perpendicular to the first antenna portion (521). The metal support (513b) may include a first element (5131b) extending along the second antenna portion (523) and a second element (5133b) extending from the first element (5131b) and perpendicular to the first element (5131b). A connecting member (550b) (e.g., the connecting member (450) of FIG. 10) may be connected to the second element (5133b) of the metal support (513b). The illustrated reference numeral (5132b) indicates a welded portion between the first element (5131b) of the metal support (513b) and the second antenna portion (523).

[0265] Referring to FIG. 25, the second antenna portion (523) may extend from the first antenna portion (521) in a direction perpendicular to the first antenna portion (521). The metal support (513c) may include a first element (5131c) extending along the second antenna portion (523), a second element (5133c) extending from the first element (5131c) and perpendicular to the first element (5131c), and a third element (5135c) extending from the second element (5133c) and perpendicular to the second element (5133c). A connecting member (550c) (e.g., the connecting member (450) of FIG. 10) may be connected to the third element (5135c) of the metal support (513c). The illustrated reference numeral (5132b) indicates the part where the first element (5131c) of the metal support (513) and the second antenna part (523) are welded.

[0266] Referring to FIG. 26, the second antenna portion (523a) may extend from the first antenna portion (521) in a direction inclined with respect to the first antenna portion (521). The metal support (513d) may include a first element (5131d) extending along the second antenna portion (523a), and a second element (5133d) extending from the first element (5131d) and inclined with respect to the first element (5131d). A connecting member (550d) (e.g., the connecting member (450) of FIG. 10) may be connected to the second element (5133d) of the metal support (513d). The illustrated reference numeral (5132d) indicates a welded portion between the first element (5131d) of the metal support (513d) and the second antenna portion (523a).

[0267] An electronic device may utilize at least a portion of the metal frame forming its exterior as an antenna. When forming an antenna with a metal frame, the metal frame may include a protruding flange for feeding power inwardly. Since the shape of the metal frame including the flange is somewhat complex, there was a problem where manufacturing costs increased when CNC machining the metal frame, as the CNC machining had to be performed multiple times.

[0268] According to one embodiment of the present disclosure, an antenna and an electronic device including the same may be provided, wherein two flanges (e.g., a second antenna portion and a third antenna portion) are formed separately and joined by welding.

[0269] According to one embodiment of the present disclosure, since two flanges are manufactured separately and then joined, an antenna and an electronic device including the same can be provided, which can realize a complex shape while performing relatively little CNC machining.

[0270] According to one embodiment of the present disclosure, as a metal plate provides an additional conductive path, an antenna with improved antenna radiation efficiency through multiple RF signal paths and an electronic device including the same may be provided.

[0271] However, the problems to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0272] According to one embodiment of the present disclosure, even if cracks or gaps are formed in the two flange welded portions or parasitic capacitance occurs due to gaps between structures, antenna radiation efficiency may not be reduced as a multi-RF signal path is provided to transmit RF signals through a metal plate.

[0273] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0274] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (401) comprising at least one side metal sidewall (420), wherein a portion (421, 423) of the at least one side metal sidewall (420) is configured to operate as an antenna.

[0275] According to one embodiment, the electronic device (101) may be disposed within the housing (401) and configured to support at least one electronic component.

[0276] According to one embodiment, the electronic device (101) may include a circuit board (440) disposed on one side of the bracket (411) and comprising a wireless communication circuit (441) and a connecting member (450).

[0277] According to one embodiment, the electronic device (101) may include a metal plate (427) configured to electrically connect the connecting member (450) and the at least one side metal sidewall (420).

[0278] According to one embodiment, a portion (413) of the bracket (411) may be configured to protrude from the one surface of the bracket (411) and support the portion (421, 423) of the at least one side metal sidewall (420).

[0279] According to one embodiment, a metal plate (427) may be placed on the part (413) of the bracket (411).

[0280] According to one embodiment, an RF (radio frequency) signal path may be provided through the metal plate (427) between the connecting member (450) and the at least one side metal sidewall (420).

[0281] According to one embodiment, the part (413) of the bracket (411) may include a metal support (413).

[0282] According to one embodiment, another part (4111a) of the bracket (411) in which the metal support (411) is positioned and the part (421, 423) of the at least one side metal sidewall (420) is in contact may be an insert molding resin.

[0283] According to one embodiment, the metal support (413) and the metal plate (427) can be welded together so that a multi-RF signal path is provided between the connecting member (450) and the at least one side metal sidewall (420).

[0284] According to one embodiment, the metal support (413) and the metal plate (427) can be electrically insulated from each other so that a single RF signal path is provided between the connecting member (450) and the at least one side metal sidewall (420).

[0285] According to one embodiment, the capacitance due to the gap (g) between the part (413) of the bracket (411) and the at least one side metal sidewall (420) can be prevented or reduced by providing the RF signal path through the metal plate (427) between the connecting member (450) and the at least one side metal sidewall (420).

[0286] According to one embodiment, the at least one side metal sidewall (420) may include a first antenna portion (421) forming at least a portion of the outer surface of the electronic device (101), and a second antenna portion (423) protruding in a first direction from the inner surface of the first antenna portion (421) and coupled with the metal plate (427) and the portion (413) of the bracket (411).

[0287] According to one embodiment, the part (413) of the bracket (411) may overlap the flat part of the second antenna part (423) in a second direction different from the first direction.

[0288] According to one embodiment, the metal plate (427) may include a first region (4271) that is coupled to the second antenna portion (423) and extends in the first direction.

[0289] According to one embodiment, the metal plate (427) may include a second region (4273) that extends from the first region (4271) and is coupled to the part (413) of the bracket (411).

[0290] According to one embodiment, the part (413) of the bracket (411) may include a first element (4131) that is coupled to the second antenna part (423) and extends along the first direction.

[0291] According to one embodiment, the portion (413) of the bracket (411) may include a second element (4133) that extends from the first element (4131) and is spaced apart from the end of the second antenna portion (423).

[0292] According to one embodiment, the electronic device (101) may further include a non-metallic region (403) disposed between the second element (4133) and the end of the second antenna portion (423).

[0293] According to one embodiment, the electronic device (101) may further include a rear plate (480) forming at least a portion of the rear surface of the electronic device (101).

[0294] According to one embodiment, the electronic device (101) may further include a waterproof member (460) disposed between the second antenna portion (423) and the rear plate (480).

[0295] According to one embodiment, the electronic device (101) may have at least a portion of the metal plate (427c) welded to a recess (4231) formed in the second antenna portion (423).

[0296] According to one embodiment, the electronic device (101) may further include a cover portion (404) covering the second antenna portion (423) and the metal plate (427d).

[0297] According to one embodiment, the electronic device (101) may include another side metal sidewall (420a) spaced apart from the at least one side metal sidewall (420), wherein a portion of the other side metal sidewall (420a) is configured to operate as another antenna.

[0298] According to one embodiment, the electronic device (101) may further include a non-metallic portion (414) disposed between the at least one side metal sidewall (420) and the other side metal sidewall (420a).

[0299] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (401) that forms at least a part of the exterior of the electronic device (101).

[0300] According to one embodiment, the electronic device (101) may include a circuit board (440) disposed within the housing (401) and including a wireless communication circuit (441).

[0301] According to one embodiment, the electronic device (101) may include a display (330) disposed on the front surface of the housing (401).

[0302] According to one embodiment, the electronic device (101) may include a rear plate (480) that forms at least a portion of the rear surface of the electronic device (101).

[0303] According to one embodiment, the electronic device (101) may include at least one side metal sidewall (420) that is electrically connected to the wireless communication circuit (441) and forms at least a portion of the housing (401), and comprises a first antenna portion (421) that forms at least a portion of the outer surface of the housing (401), a second antenna portion (423) that extends in a first direction from the inner surface (4213) of the first antenna portion (421), and a third antenna portion (425) that is welded to overlap a flat portion of the second antenna portion (423) in a second direction different from the first direction and is electrically connected to the circuit board (440).

[0304] According to one embodiment, the third antenna portion (425) may be welded to the area of ​​the second antenna portion (423) facing the display (330).

[0305] According to one embodiment, the third antenna portion (525a) may be welded to the area of ​​the second antenna portion (523) facing the rear plate (580).

[0306] According to one embodiment, the second direction may be perpendicular to or inclined with respect to the first direction.

[0307] According to one embodiment, the electronic device (101) may further include an RF connector (450) disposed on the circuit board (440) and electrically connected to the antenna (420).

[0308] Although specific embodiments have been described in the detailed description of this document, it will be obvious to those skilled in the art that various modifications are possible within the scope of this document.

[0309] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0310] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0311] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0312] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0313] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0314] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing (401) comprising at least one side metal sidewall (420), wherein a portion (421, 423) of the at least one side metal sidewall (420) is configured to function as an antenna; A bracket (411) disposed within the above housing (401) and configured to support at least one electronic component; A circuit board (440) disposed on one side of the above bracket (411) and including a wireless communication circuit (441) and a connecting member (450); and It includes a metal plate (427) configured to electrically connect the connecting member (450) and the at least one side metal sidewall (420), and A portion (413) of the bracket (411) protrudes from the surface of the bracket (411) and is configured to support the portion (421, 423) of the at least one side metal sidewall (420). The metal plate (427) is placed on the part (413) of the bracket (411), and An electronic device (101) in which an RF signal path is provided through a metal plate (427) between the connecting member (450) and the at least one side metal sidewall (420).

2. In Paragraph 1, The above part (413) of the above bracket (411) includes a metal support (413), and The electronic device (101) in which the metal support (413) is positioned and the other part (4111a) of the bracket (411) in contact with the part (421, 423) of the at least one side metal sidewall (420) is an insert molding resin.

3. In Paragraph 1 or 2, The metal support (413) is an electronic device (101) welded to at least one side metal sidewall (420).

4. In any one of paragraphs 1 to 3, The metal support (413) and the metal plate (427) are welded together to form an electronic device (101) such that a multi-RF signal path is provided between the connecting member (450) and the at least one side metal sidewall (420).

5. In any one of paragraphs 1 through 4, The metal support (413) and the metal plate (427) are electrically insulated from each other so that a single RF signal path is provided through the metal plate (427) between the connecting member (450) and the at least one side metal sidewall (420) in an electronic device (101).

6. In any one of paragraphs 1 through 5, An electronic device (101) in which capacitance due to a gap between the part (413) of the bracket (411) and the at least one side metal sidewall (420) is prevented or reduced by providing the RF signal path through the metal plate (427) between the connecting member (450) and the at least one side metal sidewall (420).

7. In any one of paragraphs 1 through 6, The above at least one side metal sidewall (420) comprises a first antenna portion (421) forming at least a portion of the outer surface of the electronic device (101) and a second antenna portion (423) protruding in a first direction from the inner surface of the first antenna portion (421) and coupled with the metal plate (427) and the portion (413) of the bracket (411).

8. In any one of paragraphs 1 through 7, The above part (413) of the above bracket (411) is an electronic device (101) superimposed on the flat part of the second antenna part (423) in a second direction different from the first direction.

9. In any one of paragraphs 1 through 8, The metal plate (427) above A first region (4271) coupled to the second antenna portion (423) and extended along the first direction; and An electronic device (101) comprising a second region (4273) extending from the first region (4271) and coupled to the part (413) of the bracket (411).

10. In any one of paragraphs 1 through 9, The above part (413) of the above bracket (411) is, A first element (4131) coupled to the second antenna portion (423) and extended in the first direction; and An electronic device (101) comprising a second element (4133) extending from the first element (4131) and spaced apart from the end of the second antenna portion (423).

11. In any one of paragraphs 1 through 10, An electronic device (101) further comprising a non-metallic region (403) disposed between the second element (4253) and the end of the second antenna portion (423).

12. In any one of paragraphs 1 through 11, A rear plate (480) forming at least a portion of the rear surface of the electronic device (101); and An electronic device (101) further comprising a waterproof member (460) disposed between the second antenna portion (423) and the rear plate (480).

13. In any one of paragraphs 1 through 12, A portion of the metal plate (427c) is an electronic device (101) welded to a recess (4231) formed in the second antenna portion (423).

14. In any one of paragraphs 1 through 13, An electronic device (101) further comprising a cover portion (404) covering the second antenna portion (423) and the metal plate (427d).

15. In any one of paragraphs 1 through 14, As another side metal sidewall (420) spaced apart from the at least one side metal sidewall (420), wherein a part of the other side metal sidewall (420a) is configured to operate as another antenna; and An electronic device (101) further comprising a non-metallic portion (414) disposed between at least one side metal sidewall (420) and the other side metal sidewall (420a).

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