MEMS device having reduced package size

The MEMS device integrates processing circuitry and movable components with vertical and lateral electrical connections, encapsulated by an overmold, addressing size and fragility issues to create a compact, durable, and cost-effective package for integration into small devices.

WO2026128567A1 Publication Date: 2026-06-18INVENSENSE INC
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
INVENSENSE INC
Filing Date
2025-12-10
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Existing MEMS devices are bulky and require additional packaging, which increases size, cost, and mechanical vulnerability, limiting their integration into compact devices.

⚗Method used

A MEMS device design that integrates processing circuitry and movable components with vertical and lateral electrical connections, encapsulated by an overmold, exposing solderable pads for direct mounting, eliminating intermediate packages and fragile wire bonds.

🎯Benefits of technology

The design achieves a smaller, more durable, and cost-effective MEMS package with improved electrical reliability and signal integrity, suitable for compact electronics and demanding environments.

✦ Generated by Eureka AI based on patent content.

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Abstract

A microelectromechanical systems (MEMS) device and methods for its fabrication are disclosed. The MEMS device includes a processing layer having processing circuitry and a plurality of bond pads and a MEMS layer bonded to the processing layer. Signals generated by a MEMS component are processed by the circuitry and routed through a plurality of electrical connections extending vertically from the bond pads to a redistribution layer and a plurality of solderable pads that define external contact points for direct electrical bonding to external circuitry. The MEMS and processing layers, along with the electrical connections, are encapsulated in an overmold with the solderable pads exposed at a substantially planar package surface.
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