3D Rigid Printed Circuits TRIZ Cases
- 3D PCB Dielectric Channels for Uniform High-Current Copper Traces
Preformed dielectric channels filled by electrolytic metallization create uniform copper traces with lower waste, lower resistance, and better heat dissipation.
- Metal Plate Interface Geometry for Resin Bonding and Insulation
Controlled protrusions, recesses, kurtosis, and overhang improve resin-to-metal adhesion while maintaining insulation and preventing peeling.