3D PCB Dielectric Channels for Uniform High-Current Copper Traces
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Solution Overview
Problem
Conventional PCB manufacturing processes result in non-uniform trace cross-sections, material loss, and increased resistance due to etching, require hazardous chemicals, and add layers that hinder thermal dissipation, making them unsuitable for high current applications.
Innovation Solution
A method involving the formation of a 3D dielectric substrate with channels and pockets filled with conductive material like copper, using electrolytic metallization to create uniform conductive layers with specific thicknesses, minimizing waste and optimizing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching process is used to form PCB traces, then traces can be formed with conductive material, but the trace cross-section becomes non-uniform with tapered side walls resulting in volume loss and higher resistance
Solution Approach 1:
Instead of removing conductive material through etching to form traces, the invention inverts the approach by depositing conductive material into pre-formed channels and pockets in the dielectric substrate. This additive approach eliminates the tapered side walls and volume loss inherent in subtractive etching processes, achieving uniform trace cross-sections while minimizing material waste.
Solution Approach 2:
The invention performs preliminary action by pre-forming channels and pockets in the dielectric substrate before depositing the conductive material. This preliminary structuring of the substrate allows the conductive material to be deposited in a controlled manner, ensuring uniform trace geometry and eliminating the need for subsequent etching that would cause material loss and non-uniform cross-sections.
2Reliability
If thicker conductive foil is used to carry high electric currents, then current-carrying capacity is improved, but material cost and processing complexity increase
Solution Approach 1:
The invention applies local quality by varying the depth of channels and pockets in the dielectric substrate to create conductive traces of different thicknesses in different locations. This allows high current-carrying traces to be formed with thicker conductive material only where needed, while other areas use thinner traces, optimizing both current capacity and material usage without increasing overall PCB complexity.
Solution Approach 2:
The invention changes the parameter of conductive material thickness by controlling the depth of channels and pockets during the molding process. By adjusting channel depth, the amount of conductive material deposited can be precisely controlled to match the required current-carrying capacity for each specific trace, eliminating the need to use uniformly thick foil across the entire PCB.
3Ease of manufacture
If conventional etching process is used, then PCB traces can be formed, but hazardous chemicals are consumed and energy-intensive recovery processes are required
Solution Approach 1:
The invention replaces the chemical etching process with a mechanical/molding approach to form channels and pockets in the dielectric substrate, followed by physical deposition of conductive material. This substitution eliminates the need for hazardous chemical etchants and the energy-intensive recovery processes required to reclaim copper from etching solutions, while still achieving precise trace formation.
Solution Approach 2:
The invention converts the harmful chemical etching process into a beneficial additive deposition process. By forming channels and pockets in the dielectric substrate first, the conductive material is precisely placed only where needed, eliminating the harmful waste associated with etching and converting the previously harmful subtractive process into a beneficial additive process that reduces chemical usage and environmental impact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of PCBs with efficient current carrying capacity, reduced material waste, and improved thermal dissipation, suitable for high current applications.
Implementation Method 1
channels and pockets formed by molding a dielectric laminate... depositing by electrolytic metallization the conductive traces and pads into the channels and pockets
Implementation Method 2
channels and pockets formed by molding a dielectric laminate
Data Source
AI summary
A printed circuit board (PCB) has a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.