Mixed black particles in a photocuring composition resolve the trade-off between electrode conductivity and panel blackness.
A lead-free glass composition using vanadium, tellurium, phosphorous, and iron oxides enables reliable bonding at temperatures of 380°C or lower.
A double-layered green sheet uses glass paste with controlled etching rates to form stable barrier ribs.
Polyhedral oligosilsesquioxane dielectric composition eliminates lead and minimizes bubbling to lower calcination temperature below 200°C.