Dielectric Composition for Plasma Display Panels
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Solution Overview
Problem
Conventional plasma display panel technologies face challenges with high dielectric constant, high power consumption, environmental contamination due to Pb, and limitations in calcination temperature, which affect the production of large-screen panels with precise dimensions and low surface roughness.
Innovation Solution
A dielectric/barrier rib composition using polyhedral oligosilsesquioxane and inorganic/organic hybrid materials with a low dielectric constant, capable of calcination at less than 200°C, eliminating Pb and minimizing bubbling, and allowing for easy micropatterning and low-temperature processing on various substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional glass paste with PbO is used for dielectric layer, then high transparency can be achieved, but breakdown voltage decreases due to bubbles and metal Pb remaining after calcination
Solution Approach 1:
The invention extracts and eliminates Pb (lead) from the glass paste composition entirely. By removing the harmful Pb component while maintaining the optical and electrical properties through alternative glass compositions, the patent resolves the contradiction between transparency and breakdown voltage.
Solution Approach 2:
The invention changes the chemical composition parameters of the glass paste by replacing PbO-based glass with alternative glass systems that have appropriate softening points and optical properties. This parameter change eliminates bubbles and metal residues while maintaining transparency and improving breakdown voltage.
2Temperature
If low melting point glass paste is used to reduce calcination temperature, then thermal hysteresis effects are reduced, but high temperature calcination (550-580°C) is still required
Solution Approach 1:
The invention changes the softening point parameter of the glass paste by selecting glass compositions with inherently lower softening points. This allows calcination to be performed at temperatures below 500°C, avoiding thermal hysteresis effects while maintaining manufacturing precision and dimensional stability.
3Temperature
If low melting point glass containing Pb is used, then calcination temperature can be reduced, but dielectric constant increases to 10-12 causing high power consumption
Solution Approach 1:
The invention extracts and removes Pb from the glass composition. By eliminating Pb while maintaining low calcination temperature through alternative glass systems, the patent achieves both low dielectric constant (reducing power consumption) and low processing temperature.
Solution Approach 2:
The invention uses composite glass paste formulations that combine multiple glass components and additives to achieve the desired balance of low softening point, low dielectric constant, and Pb-free composition. This composite approach allows simultaneous optimization of processing temperature and electrical properties.
4Ease of manufacture
If glass paste is used for barrier rib manufacturing, then dielectric layer can be formed, but large amount of waste materials are produced increasing environmental contamination
Solution Approach 1:
The invention extracts and eliminates Pb from the glass paste, thereby removing the source of environmental contamination. This allows the manufacturing process to continue with ease while eliminating harmful waste materials and reducing environmental impact.
Data Source
AI summary
Provided is a dielectric/barrier rib composition for a plasma display panel, comprising a compound 1 of the formulaor at least one compound belonging to a polyhedral oligosilsesquioxane (compound 2) having R6SiO1.5 as a repeating unit, or comprising inorganic/organic hybrid materials having compounds 1 and 2 as a monomer, wherein X is an integer inclusive 0, R1, R2, R3, R4, R5 and R6 are independently a linear, branched or cyclic C1-C12 hydrocarbon group containing one or more alkyl, alkoxy, ketone, acryl, methacryl, allyl, aromatic, halogen, amino, mercapto, ether, ester, sulfone, nitro, hydroxyl, cyclobutene, carbonyl, carboxyl, alkyd, urethane, vinyl, nitrile, hydrogen, or epoxy functional group, and A is oxygen or NH. The inorganic/organic hybrid materials can be a material composed of an extended matrix, containing silicon and oxygen or nitrogen atoms, and having at least one silicon fraction directly bonded to a substituted or unsubstituted hydrocarbon atom.