Anti-Noise Capacitors TRIZ Cases
- AIMD Connector Insulation Coating for High-Voltage Breakdown Strength
Nano-scale metal oxide insulation coatings raise dielectric breakdown strength in AIMD circuit board connectors, improving high-voltage reliability.
- Multilayer Ceramic Capacitor Electrode Layout to Prevent Layer Peeling
Auxiliary internal electrodes in lead-out regions balance sintering shrinkage and internal stress to reduce layer peeling in multilayer ceramic capacitors.
- Deep Trench Capacitor Void Structure for Handling Stress Relief
Stress-relief voids in a dielectric trench fill absorb handling stress, protecting deep trench capacitors and improving yield and reliability.
- Shielded Multilayer Ceramic Capacitor Layout for Broadband Signals
A spaced shield-to-active electrode layout cuts insertion loss and preserves multilayer ceramic capacitor performance at high frequencies.
- Multilayer Ceramic Capacitor Electrode Structure for Acoustic Noise Reduction
Higher subcomponent-metal solid solution layers at electrode interfaces suppress MLCC acoustic noise without adding thickness or sacrificing capacitance.
- High-Voltage Feed-Through Capacitor Insulation for Dielectric Breakdown
Matching tube resistivity to or above the resin lowers inter-conductor electric field intensity and improves high-voltage capacitor reliability.
- Polymer Feedthrough Seal Assembly for Hermetic High-Voltage Insulation
A polymer plug and ferrule replace glass-to-metal seals to maintain hermetic high-voltage insulation with lower cost and faster assembly.
- Double-Sided Copper-Clad Laminate for Voltage Endurance and Peel Strength
Controlled copper foil roughness balances peel strength, voltage endurance, and capacitor capacity in double-sided copper-clad laminates.