AIMD Connector Insulation Coating for High-Voltage Breakdown Strength
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Solution Overview
Problem
Active implantable medical device (AIMD) circuit board connectors face challenges in achieving high-voltage dielectric breakdown strength, which is crucial for withstanding high-voltage stress and ensuring the reliability of medical implants.
Innovation Solution
The integration of nano-scale metal oxide insulating powders into the insulating materials used for AIMD circuit board connectors enhances the high-voltage dielectric breakdown strength, providing improved insulation and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional insulating materials are used in AIMD circuit board connectors, then the device structure remains simple and manufacturing is easier, but the high-voltage dielectric breakdown strength is insufficient
Solution Approach 1:
The patent applies composite materials by combining nano-scale metal oxide insulating powders with conventional insulating materials to create a hybrid insulating structure. This composite approach enhances the dielectric breakdown strength while maintaining the base material's structural properties, directly resolving the contradiction between reliability improvement and device complexity.
Solution Approach 2:
The patent changes the physical and chemical parameters of the insulating material by incorporating nano-scale metal oxide powders with specific particle sizes, concentrations, and distributions. These parameter modifications enhance the material's dielectric properties and breakdown strength without fundamentally altering the material system, thus improving reliability while controlling complexity.
2Reliability
If nano-scale metal oxide insulating powders are integrated into insulating materials, then the dielectric breakdown strength increases, but the manufacturing process becomes more complex
Solution Approach 1:
The patent optimizes manufacturing by controlling key parameters such as nano-powder particle size distribution, concentration ranges, and dispersion methods. By establishing specific parameter windows, the patent enhances dielectric breakdown strength while keeping the manufacturing process within manageable complexity limits through quantified process control.
3Reliability
If higher concentrations of nano-scale metal oxide powders are used, then the dielectric breakdown strength increases, but the material homogeneity and processing difficulty are affected
Solution Approach 1:
The patent addresses composition stability by optimizing the concentration parameter of nano-scale metal oxide powders within specific ranges. This parameter optimization ensures sufficient dielectric enhancement while preventing agglomeration and maintaining material homogeneity, thus resolving the contradiction between breakdown strength and compositional stability.
Solution Approach 2:
The patent utilizes the porous or particulate structure of nano-scale metal oxide powders to create a dispersed phase within the insulating material matrix. This structured incorporation allows for enhanced dielectric properties while maintaining material homogeneity through controlled distribution, balancing breakdown strength improvement with compositional stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the dielectric breakdown strength of AIMD circuit board connectors, reducing the risk of electrical failures and ensuring the continued functionality and safety of medical implants under high-voltage conditions.
Implementation Method 1
increasing the high-voltage dielectric breakdown strength of the AIMD circuit board connectors
Implementation Method 2
the novel addition of nano-scale metal oxide insulating powders to the insulating materials
Data Source
AI summary
A circuit board for an active implantable medical device (AIMD) has a circuit board land connected to at least one electrical circuit. A hermetic feedthrough terminal pin connector for the AIMD includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A terminal pin of the feedthrough extends outwardly beyond the insulator. A terminal pin connector has an electrically conductive connector housing that is connected to the circuit board land by an electrical connection material. At least one electrically conductive prong supported by the connector housing contacts and compresses against the feedthrough terminal pin to thereby make a removable electrical connection between the circuit board and the terminal pin. An insulative material loaded with electrically insulative nanoparticles coats at least a portion of the sidewall of the connector housing and the electrical connection material connecting the connector housing to the circuit board land.