Circuit Bendability/Stretchability TRIZ Cases

Laser or halogen irradiation accelerates etching in the bendable glass area, creating smooth thickness transitions that balance flexibility and impact resistance.

Dual-sided cooling plates form a fluid passage that removes heat from both sides while reducing traction inverter space use.

A guiding unit controls the flexible PCB bend path during lens-group movement, while adhesive grooves reduce lens deformation.

A flexible substrate bends behind the display panel, moving connection circuits away from the bezel to preserve a narrow border.

Curved routing and protective coverage help prevent bonding-stress cracks in COF flexible printed circuit boards.

This case shows how a lightweight support guides and stabilizes a bent flexible PCB for durable placement under vibration.

A recessed noise shield and reinforcing member connect to ground, improving EMI blocking and resistance in miniaturized camera modules.

A reinforced peripheral area preserves detection-area flexibility while protecting the sensor from excessive-bending damage.

Layered polymer film uses low-loss layer A and moisture-resistant layer B to limit peeling during reflow soldering.

A thinner central zone and patterned protrusions help glass-based foldable substrates bend tightly while resisting impact and puncture.

Selective layer coverage protects exposed leads from scratches and whisker defects.

This composite substrate uses elastic polymer and dielectric powder clusters to support stable frequency under stretching.