Camera Module Connector Shielding for Compact EMI Control
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Solution Overview
Problem
Existing camera modules face challenges in miniaturization and EMI noise blocking, particularly in subminiature, low-power devices, which affect the performance of high-resolution cameras in mobile devices.
Innovation Solution
A camera module design incorporating a circuit board with a noise-blocking unit beneath a second circuit board, exposing a ground layer, and a reinforcing member connected via an adhesive, which reduces electrical resistance and enhances EMI noise blocking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a noise-blocking unit is added beneath the second circuit board to block EMI noise, then EMI noise blocking performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The noise-blocking unit is nested within the recess of the second circuit board, with the reinforcing member positioned on top of the noise-blocking unit. This nested arrangement integrates multiple functional elements (ground layer exposure, EMI shielding, and structural reinforcement) into a compact configuration that reduces overall device complexity while maintaining effective EMI noise blocking performance.
Solution Approach 2:
The design utilizes the vertical dimension by creating a recess in the second circuit board and positioning the noise-blocking unit and reinforcing member within this three-dimensional space. This approach effectively blocks EMI noise without increasing the horizontal footprint of the device, allowing complex functionality to be achieved within compact dimensions.
2Object-affected harmful factors
If the noise-blocking unit is made larger to improve EMI noise blocking, then EMI noise blocking performance is improved, but the available space in the recess is exceeded and manufacturing precision requirements increase
Solution Approach 1:
The noise-blocking unit is designed with specific dimensional relationships where one side length is less than the corresponding recess dimension, creating optimal local contact areas with the ground layer. This localized quality approach ensures effective EMI noise blocking at critical interfaces while maintaining manufacturing feasibility and avoiding excessive precision requirements across the entire component.
3Volume of moving object
If the camera module is miniaturized to meet mobile device requirements, then device size is reduced, but EMI noise blocking performance and electrical resistance characteristics deteriorate
Solution Approach 1:
The noise-blocking unit and reinforcing member are nested within the recess of the second circuit board, allowing EMI shielding functionality to be integrated into the existing camera module structure without significantly increasing its overall size. This nested configuration enables effective EMI noise blocking while maintaining the miniaturized form factor required for mobile devices.
Solution Approach 2:
The design exploits the vertical space within the recess to position the noise-blocking unit and reinforcing member, achieving effective EMI noise blocking without increasing the horizontal dimensions of the camera module. This three-dimensional arrangement allows compact camera modules to maintain adequate EMI shielding performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces electrical resistance and improves EMI noise blocking, enabling better performance in miniaturized camera modules for mobile devices.
Implementation Method 1
a noise-blocking unit comprising a first noise-blocking portion disposed beneath the second circuit board and configured to block an electro-magnetic interference
Implementation Method 2
The adhesive may include a conductive particle, which is in contact with the ground layer through the noise-blocking unit
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
An embodiment comprises a lens driving part including a lens, a connection substrate connected to the lens driving part, and a connector part connected to the connection substrate. The connector part comprises a substrate including, on the upper surface thereof, a cavity and a ground layer, a noise shield part located within the cavity of the substrate and contacting the ground layer, and a reinforcement member located on the noise shield part. The reinforcement member is located in the cavity of the substrate and on the upper surface of the substrate. In a top view, the length of one side of the noise shield part is less than the length of one side of the cavity of the substrate.