Circuit Thermal Arrangements TRIZ Cases
- UV LED Package Hermetic Sealing With Low Thermal Stress
Matched alloy sidewalls, a ceramic substrate, and a glass cover improve UV LED package heat dissipation and hermetic sealing while limiting thermal stress.
- Anti-Tilt Heat Sink Assembly for Even Chip Pressure
Elastic supports and a locking member keep the heat sink level during assembly, preventing uneven chip pressure and damage.
- Epoxy Resin Composition for 5 W/m·K Heat-Dissipation Boards
Controlled alumina and aluminum nitride particle sizes help epoxy circuit boards reach at least 5 W/m·K conductivity while keeping high filler loading manufacturable.
- Cooling Soldered Printed Circuit Boards Using Liquid Inert Gas
Evaporating liquid nitrogen absorbs heat from soldered printed circuit boards, reducing energy consumption and eliminating coolant disposal.
- GaN Circuit Assembly Thermal Management via Copper Inlay PCB
Copper-filled vias and inlays reduce thermal resistance in GaN assemblies, lowering conduction losses while maintaining simple FR4 manufacturing.
- Imaging Device Cooling via Housing-Conducted Heat Dissipation
A fan directs airflow through heat dissipation fins to cool components mounted on a circuit board.