Imaging Device Cooling via Housing-Conducted Heat Dissipation
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Solution Overview
Problem
Conventional imaging devices face challenges in reducing size and weight while maintaining high functionality due to the space occupied by traditional cooling mechanisms, especially when multiple heat-generating components are mounted on multiple circuit boards in a scattered manner.
Innovation Solution
The proposed imaging device incorporates a housing with an intake and discharge port, an imaging sensor, a circuit board with heat-generating components, and a heat dissipation plate, along with a fan that takes in outside air and blows it through heat dissipation fins of a heat sink, efficiently cooling components and reducing the overall size and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional cooling mechanism including fan, duct, and heat dissipation plate is disposed to cool heat-generating components, then cooling function is achieved, but the size of the apparatus increases
Solution Approach 1:
The housing is made up of a heat dissipation member that integrates the cooling function directly into the structural component. The heat dissipation plate transfers heat from components to the housing, which then dissipates heat through its own surface area, eliminating the need for separate ducts and reducing overall apparatus size.
Solution Approach 2:
The housing serves dual functions: it provides the structural enclosure for the apparatus and simultaneously acts as a heat dissipation member. This multi-functionality reduces the need for additional dedicated cooling components, thereby reducing apparatus size.
2Quantity of substance
If multiple circuit boards with heat-generating components are disposed in a scattered manner to reduce product size, then component density increases, but the cooling mechanism occupies larger space inside the apparatus
Solution Approach 1:
Multiple heat dissipation plates are integrated with the housing structure, allowing scattered heat-generating components on multiple circuit boards to be cooled through a unified heat dissipation system. The housing itself serves as the heat dissipation member, eliminating the need for separate cooling mechanisms for each component location.
3Volume of moving object
If the mounting area of circuit board is reduced for reduction in size, then apparatus becomes more compact, but heat-generating components require more efficient cooling which increases mechanism space
Solution Approach 1:
Heat dissipation plates are positioned in close contact with specific heat-generating components on the circuit board, providing localized heat transfer. The housing material and structure are designed to conduct and dissipate heat efficiently from these localized points, maintaining effective cooling in a compact configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient cooling of heat-generating components, achieving reductions in size and weight, higher functionality, and ease of handling for the imaging device.
Implementation Method 1
a first heat dissipation plate for transferring heat from the first heat-generating component to the housing
Implementation Method 2
a fan disposed adjacent to the first heat dissipation plate, taking in outside air through the intake port, air-cooling the first heat dissipation plate with the taken-in outside air, and blowing out the air from the discharge port
Data Source
AI summary
To achieve reductions in size and weight and a higher functionality of an imaging device, the imaging device comprises a first circuit board mounting a first heat-generating component for processing a signal from the imaging sensor, a first heat dissipation plate for transferring heat from the first heat-generating component to the housing; and a fan disposed adjacent to the first heat dissipation plate, air-cooling the first heat dissipation plate, wherein the fan is configured to take in the air in a rotation axis direction and discharges the air in an outer circumferential direction, and the discharged air is blown to heat dissipation fins of the heat sink of the first heat dissipation plate and discharged from the discharge port.