Conductive Material TRIZ Cases

Graft modification of a propylene/alpha-olefin copolymer with an unsaturated carboxylic acid improves adhesive strength while maintaining flow properties.

Controlled glass frits in aluminum pastes prevent fire-through damage to perforated dielectric layers while ensuring strong adhesion.

Soluble polymer joining maintains electrical conductivity and flexibility without metal solder or high temperatures.

Dispersed silver crystallized precipitates within a copper matrix enhance vibration durability and heat resistance in thinned wire rods for micro speakers.

Conductive nanocomposites use carboxylic acid-functionalized ligands to form stable layers without sintering.

A conductive polymer material incorporates a quaternary ammonium base and alkyl sulfate radical within its main chain to enable ionic conduction.

Optimized Co-Si ratios in a copper matrix enable precise precipitation hardening, resolving the trade-off between high yield strength and electro-conductivity.

Cu-Ni-Si alloy plate balances strength and formability for electronic components under thermal stress.

Urethane-bond resin with silicon side chains combined with fluorosulfonic acid salts maintains conductivity and biocompatibility despite water exposure.

Integrating divalent fluorine-containing groups into the polymer backbone improves alkali resistance while preserving mechanical flexibility and solubility.

Fluorine substituents on the polymer backbone reduce moisture absorption and intermolecular agglomeration, extending OLED device lifespan.

A semiconductive ceramic sintered compact featuring a conductive phase of manganese, iron, and titanium within an alumina matrix.

Phosphonium salt ion carriers in polar rubber prevent blooming and maintain stable electrical resistance during charging roller operation.

Composite metal oxide and carbon alloy anodes buffer volume expansion during cycling, maintaining capacity without structural degradation.

Replacing liquid electrolytes with solid-state cellulose composites eliminates solvent leakage while maintaining reliable charge transport.

A composite electrode structure with a lanthanide layer reduces electron injection barriers and enhances stability against oxidation.

An intermediate silver layer absorbs bending strain in a terminal plating film, suppressing cracks while maintaining wear resistance.

A conductive polymer dispersion uses a composite binder system to form stable aqueous coatings.

Dual polyol stabilizers enable high-concentration silver inks for printing, resolving the contradiction between ink viscosity and electrical conductivity.

Mixed PbO-Bi2O3 glass frit balances adhesive strength against increased series resistance caused by softening during firing.

A variable impedance material limits trigger voltages below 1200 volts using high electro-magnetic permeability powder.

Light-induced phase transition evaporates solvent from PEDOT:PSS coating during patterning, eliminating separate drying steps that extend processing time.

Side-chain sulfonic acid groups on a polyvinyl backbone improve heat-resistance and stability of conductive polymer composites.

2,7-Pyrene polymers widen the band gap to produce deep-blue singlet emission and extend device lifetime.

Applying voltage during doping increases polymer conductivity, allowing it to replace separate binders and raise battery capacity.

Hydrazine reduction in mixed solvents yields copper powder without protective layers, eliminating high sintering temperatures and agglomeration.

A multilayer metal film structure on an inductor base uses an inwardly extended portion to enhance adhesion between the conductive layers.

A composite of two lithium nickel complex oxides with distinct nickel contents increases filling density and capacity while maintaining thermal stability.

A Cu-Mg-P copper alloy plate with controlled crystal orientation and grain size.

A mobile station determines a precoding matrix from downlink channel estimates to process uplink signals.

Aryl-substituted main group element halides act as stable dopants in organic semiconducting matrices to increase electrical conductivity.

A Cu-Ni-Co-Si alloy sheet achieves high strength and conductivity through controlled secondary phase particle densities.

A copper rod uses specific cobalt, phosphorus, and tin ratios to form uniform precipitates that boost strength and conductivity.

A controlled solution heat treatment uniformly disperses iron-based compounds within an aluminum alloy conductor wire to stabilize plastic deformation.

Silver zinc electrode paste formulation controls penetration depth during firing, preventing short circuits in ultra-thin emitter layers.

A fluorinated sulfonamide polymer compound enhances electrical conductivity and chemical stability through specific repeating unit structures.

Transient liquid phase sintering creates interconnected metallurgical networks using blended metal alloys.

Organometallic tantalum precursors deposit controlled tantalum carbide nitride films with tailored electronic properties.

Zr or Ti surface treatment on a lithium composite oxide core-shell structure resolves safety and cycle life trade-offs.

A transparent conductor combines metal nanowires with a conductive polymer to form a flexible, low-resistance film.

Swelling addition polymer cores with aromatic blends and heat treating them improves elastic modulus and coating adhesion.

Aluminum-tin paste creates solderable back-side electrodes, eliminating costly silver pastes and boosting efficiency via full back surface fields.

Bifunctional positive electrode additive with cyano and carbonyl groups bonds to the active material surface.

A noble metal coating conformally covers copper nanowires to maintain electrical conductivity while preventing oxidation.

Carbon nanotubes create conductive paths at aluminum grain boundaries, resolving conductivity loss from oxide films and air gaps.

A Cu-In-Zn-Sn-(Se,S)-based thin film reduces indium usage while maintaining high conversion efficiency.

Glass frit shields spherical aluminium from oxidation while matching ceramic thermal expansion, achieving over 100 W/mK conductivity.