Conductive Polymer Interconnection via Soluble Polymer Joining
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Solution Overview
Problem
Existing methods for joining conductive polymers often require metal solder, high temperatures, or large electrical potentials, which can degrade the electrical and mechanical properties of the polymers and hinder their flexibility.
Innovation Solution
A method involving the use of a second soluble polymer, such as poly 3-hexyl thiophene, to connect two portions of an electrically conducting polymer, where the solvent is allowed to evaporate, leaving the second polymer to join the first polymer portions, with iodine doping to enhance conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal solder is used to join conductive polymer portions, then electrical conductivity is achieved, but weight increases and flexibility is impeded
Solution Approach 1:
The patent uses a conductive polymer solution as the interconnect material, which is homogeneous in composition with the base conductive polymer. This eliminates the need for dissimilar metal solder materials, maintaining flexibility and reducing weight while achieving electrical conductivity through the polymer-polymer interface.
Solution Approach 2:
The patent changes the physical state and composition parameters by using a soluble polymer that can be applied as a liquid solution and then固化 into a conductive interconnect. This parameter change allows the interconnect to conform to the flexible substrate without the rigidity and weight of traditional metal solders.
2Reliability
If metal solder is used to join conductive polymer portions, then electrical conductivity is achieved, but flexibility is impeded
Solution Approach 1:
The conductive polymer interconnect material is homogeneous with the base polymer, ensuring compatible mechanical properties including flexibility. This allows the joined structure to maintain the bendability and conformability characteristic of flexible electronics without the rigidity introduced by metal solder.
Solution Approach 2:
The patent creates a composite interconnect structure where the soluble conductive polymer forms a matrix that bonds the base polymer portions. This composite approach maintains the flexible polymer nature throughout the joint, avoiding the flexibility loss associated with metal solder while achieving electrical conductivity.
3Strength
If high temperatures are used to join conductive polymers, then joining is achieved, but electrical and mechanical properties are degraded
Solution Approach 1:
The patent changes the processing temperature parameter from high temperature to room temperature or low temperature by using a soluble polymer that固化 at ambient conditions. This parameter change enables strong joining through solvent evaporation and polymer固化 without thermal degradation of the conductive polymer's electrical and mechanical properties.
Solution Approach 2:
The soluble polymer acts as an intermediary material that facilitates joining at low temperatures. This intermediary polymer provides adhesion between the base polymer portions through weak intermolecular forces and hydrogen bonding, achieving strong joints without the high temperatures that would degrade the conductive polymer properties.
4Strength
If large electrical potentials are used to join conductive polymers, then joining is achieved, but electrical and mechanical properties are degraded
Solution Approach 1:
The soluble polymer serves as a chemical intermediary that enables joining through non-electrical mechanisms such as solvent evaporation and polymer固化. This eliminates the need for large electrical potentials that would degrade the conductive polymer, while still achieving strong electrical and mechanical connections through the polymer-polymer interface.
Solution Approach 2:
The patent replaces the electrical field-based joining mechanism with a chemical/physical mechanism involving solvent evaporation and polymer固化. This substitution eliminates the harmful electrical potentials while achieving equivalent or superior joining strength through molecular-level adhesion in the polymer matrix.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively joins conductive polymers while maintaining their electrical and mechanical properties, ensuring flexibility and conductivity without the need for metal solder or high-temperature processes.
Implementation Method 1
The solvent is allowed to evaporate leaving the second polymer joining the two portions of the first polymer
Implementation Method 2
The P3HT is doped with iodine to improve its conductivity
Data Source
AI summary
Method for connecting two portions of a first electrically conducting polymer with a second polymer. The method includes disposing a solution of a second polymer in a solvent to be in contact with the two portions of the first electrically conducting polymer and allowing the solvent to evaporate leaving the second polymer joining the two portions of the first polymer. The second polymer may be doped to improve its conductivity.