Conductive Material TRIZ Cases
- Cu-Zr-Si Alloy Shearing Performance
A Cu-Zr-Si alloy uses precipitation hardening to boost yield strength and Vickers hardness.
- Copper-Filled Conductive Adhesive for Fine Via Filling and Cost Reduction
Copper-filled conductive adhesive replaces silver to eliminate migration and reduce cost while filling fine vias.
- Solar Cell Electrode Intermediate Layer for Low Contact Resistance
An intermediate silver paste layer bridges aluminum finger electrodes and bus bar electrodes, reducing contact resistance while lowering manufacturing costs.