Cu-Zr-Si Alloy Shearing Performance
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Solution Overview
Problem
Copper alloys used in electric and electronic devices, such as connectors and bus bars, face challenges with poor shearing performance, burr formation, and dimensional accuracy due to high ductility and low Vickers hardness, which are exacerbated by the need for reduced size and weight in these components.
Innovation Solution
A Cu—Zr-based alloy with added Si, where the mass ratio of Zr to Si is within a specific range, improves yield strength, electrical conductivity, and Vickers hardness by precipitate hardening and dispersion of Cu—Zr—Si particles, enhancing shearing performance and surface scratch resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Cu-Zr-based alloy with composition close to pure copper is used to secure high electrical conductivity and high ductility, then electrical conductivity is improved, but shearing performance deteriorates and burr formation increases during press punching
Solution Approach 1:
The invention changes the chemical composition parameters by adding Si element (0.01-0.05 mass%) to the Cu-Zr-based alloy. This parameter change creates Cu-Zr-Si intermetallic compounds that precipitate in the copper matrix, simultaneously improving shearing performance while maintaining high electrical conductivity through optimized composition control
Solution Approach 2:
The invention creates a composite microstructure consisting of a copper matrix with dispersed Cu-Zr-Si intermetallic compounds. This composite structure combines the high electrical conductivity of pure copper with the enhanced shearing performance provided by the intermetallic compound precipitates
2Manufacturing precision
If the Vickers hardness of copper alloy is increased to improve shearing performance, then shearing performance is improved, but electrical conductivity may deteriorate
Solution Approach 1:
The invention optimizes the concentration parameters of Zr (0.003-0.01 mass%) and Si (0.01-0.05 mass%) to control the amount and distribution of Cu-Zr-Si intermetallic compounds. This optimized parameter control increases Vickers hardness for better shearing performance while limiting conductivity loss through controlled precipitate formation
Solution Approach 2:
The Cu-Zr-Si intermetallic compounds are distributed locally as fine precipitates within the copper matrix rather than uniformly throughout. This local distribution provides hardness enhancement at specific sites where precipitates form, while the bulk copper matrix maintains its high electrical conductivity properties
3Weight of moving object
If the size and thickness of copper alloy components are reduced to meet miniaturization requirements, then weight and size are reduced, but dimensional accuracy and shearing performance deteriorate
Solution Approach 1:
The invention modifies the alloy composition parameters to include Cu-Zr-Si intermetallic compounds that provide enhanced strength and hardness. This allows miniaturized components to maintain sufficient mechanical strength and dimensional accuracy during press punching operations despite reduced size and thickness
Solution Approach 2:
The composite microstructure with Cu-Zr-Si precipitates provides reinforcement that compensates for the reduced component size. The intermetallic compounds act as strengthening phases that maintain mechanical integrity and dimensional stability in thin-walled and small-sized components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alloy achieves improved yield strength, electrical conductivity, and Vickers hardness, ensuring high dimensional accuracy and reduced burr formation, making it suitable for components like connectors and bus bars with high electrical conductivity and mechanical strength.
Implementation Method 1
The Cu—Zr-based alloy is a precipitation-hardened copper alloy in which the strength is improved while the high electrical conductivity is maintained
Data Source
AI summary
Provided are a copper alloy for electric and electronic devices, a copper alloy sheet for electric and electronic devices, a component for electric and electronic devices, a terminal, and a bus bar. The copper alloy for electric and electronic devices includes, as a composition: 0.01 mass % or higher and lower than 0.11 mass % of Zr; 0.002 mass % or higher and lower than 0.03 mass % of Si; and a balance including Cu and unavoidable impurities, in which a ratio Zr/Si of the Zr content (mass %) to the Si content (mass %) is within a range of 2 to 30.