Conductive Pattern Polishing/Cleaning TRIZ Cases
- Curable Resin Composition for Printed Wiring Board Through-Hole Filling
A curable resin composition with controlled inorganic filler ratios fills through-holes completely.
- Polishing Composition for Polysilicon Film CMP
A polishing composition uses silica abrasives and specific lactam ring polymers to remove material from semiconductor surfaces.
- Temperature-Stable Separator Sheets for Component Carrier Array Processing
Temperature-stable separator sheets space component carrier arrays during processing to prevent scratches and contamination from process residues.