Temperature-Stable Separator Sheets for Component Carrier Array Processing
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Solution Overview
Problem
Component carriers in array form are prone to damage and contamination during back-end processing due to direct physical contact and transfer of process residues, which affects mechanical robustness and electrical reliability, especially during high-temperature processes.
Innovation Solution
The use of temperature-stable separator sheets with low surface roughness and non-adhesive properties to space arrays, preventing direct contact and contamination, and allowing for efficient batch processing without unstacking, including baking procedures up to 300°C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If arrays are stacked in direct contact during processing, then handling efficiency and productivity are improved, but the risk of damage and contamination increases
Solution Approach 1:
A separator body is introduced as an intermediary element between adjacent arrays in the stack. This separator body prevents direct physical contact between arrays, thereby eliminating damage and contamination while allowing the arrays to remain stacked for efficient handling and processing.
2Reliability
If separator bodies are used to space arrays, then the risk of scratches and contamination is reduced, but device complexity increases
Solution Approach 1:
The separator body is implemented as a thin, flexible sheet-like structure that can be easily inserted and removed between arrays. This minimizes the added complexity while effectively providing the spacing and protection function required to prevent scratches and contamination.
3Productivity
If arrays are processed in stacked configuration, then throughput is improved, but heat removal becomes more difficult
Solution Approach 1:
The separator body acts as a thermal intermediary that allows heat to be managed between arrays. It provides sufficient spacing to enable heat removal pathways while maintaining the stacked configuration for high throughput processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the risk of scratches and contamination, improves throughput and yield, and allows for automated handling, ensuring mechanical robustness and electrical reliability even under harsh conditions.
Implementation Method 1
forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body (in particular in such a way that any direct physical contact between adjacent arrays is disabled by the separator body in between)
Implementation Method 2
the separator sheet is temperature stable at least up to 300° C. (in particular, the material of the separator sheet may withstand temperatures of at least 300° C. without damage or loss of its separation function)
Data Source
AI summary
A method of processing component carriers is disclosed. The method includes providing a plurality of arrays each comprising a plurality of component carriers, providing a plurality of separator bodies, forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body, and carrying out at least one process, in particular at least one back-end process, using the stack. A separator sheet for spacing arrays and a method of using separator sheets for spacing arrays during processing the arrays are also provided.