Conductive Pattern Reinforcement TRIZ Cases
- Ceramic Substrate Terminal Contact Layer Adhesion
Nickel-chromium alloy contact layers bridge copper terminals and ceramic substrates, resolving adhesion failures while blocking soldering flux corrosion.
- Amine-Heterocyclic Leveling Agent for Uniform Copper Plating
Reaction product of amine monomers and saturated heterocyclic polymers acts as a leveling agent in electroplating baths.