Coupling Light Guides TRIZ Cases

An integrated trigger on the spring push covers the latch to prevent accidental disengagement from snagging without adding separate parts.

Laser irradiation creates compressive and tensile stress layers in a glass capillary, preventing cracking at the thin-walled end during optical fiber insertion.

Segmented holding holes group eight fibers to eliminate waste from unused channels while stabilizing protrusion.

Oblique incidence angles and isolators redirect reflected light away from the receiver, eliminating crosstalk in single-wavelength systems.

A fiber optic connector uses a compress body to apply external force on the ferrule, maintaining precise end-face alignment.

Molded inner body integrates the optical plug frame to prevent moisture ingress while maintaining precise fiber alignment under spring bias.

Phase perturbations suppress optical crosstalk by up to 20 dB through destructive interference.

A modified MPO-style male connector permanently attaches a multi-fiber communication cable to an optoelectronic module.

A bidirectional optical module lens block redirects light paths using two surfaces to minimize component count.

A silicon housing with a lens and mirror directs light to a waveguide grating port for efficient coupling.

A multicore fiber connector consolidates multiple optical cores into a single interface to reduce the physical size of cable towing tools.

A field installable rugged optical terminus uses UV curing to secure fiber stubs within a ferrule assembly for rapid deployment.

Mounting platform with tabs extending into base channels secures optical splice trays, preventing fiber damage during deployment.

A single-sided optical isolator merges input and output fibers to simplify assembly.

Matching circuit impedance alignment suppresses resonance and expands system bandwidth in optical transmitters.

Magnetic lateral displacement of a sliding cap blocks contamination on optical probe ferrules, extending service life beyond 1000 plug-in cycles.

Azimuthal waveguide arrays and passive alignment reduce component count in multi-channel optical tap couplers, minimizing modal variations.

Sapphire alignment bore with index matching gel secures fiber ends, reducing signal loss in avionics environments.

Dynamic heatsink actuation modulates thermal contact area to maintain module temperature across extreme ambient conditions without airflow.

Prestressed bearing arrangement aligns coaxial optical waveguides, eliminating lenses to reduce device complexity while maintaining signal quality.

Segmented ferrule holes secure coated fibers with tapered adhesive portions, reducing internal stress and preventing optical property degradation.

A conductive ring member on the connector holder shields against electromagnetic interference, reducing manufacturing complexity and costs.

A unitary alignment pin guides a translating cover to align optical fibers within a connector housing.

Direct laser writing integrates an OAM mode sorter onto the fiber core, eliminating bulky alignment and reducing device size for high-capacity communication.

Protruded faces on a second facet allow accurate film formation and cover bonding, preventing damage and moisture issues while enabling board integration.

Integrated MEMS optical beam waveguides enable precise two-dimensional alignment between vertically stacked processor and memory die stacks.

Consolidating LC and MPO adapter holes on one front panel reduces manufacturing costs by enabling single-punch die formation.

Segmenting the circuit board and placing the signal processing chip near light transceivers shortens wire lengths to reduce signal interference.

Vertical arrangement of tapered waveguides reduces device footprint while maintaining high coupling efficiency and rapid switching speeds.

A light receiver includes a central light passing part on the optical axis to allow outgoing light transmission while receiving incident signals.

Adjustable positioning elements stabilize TOSA and ROSA alignment, resolving manufacturing precision versus device complexity trade-offs.