Optical Module Circuit Sub-board Segmentation for Signal Interference Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current optical modules face challenges in efficiently converting high-speed optical signals to electrical signals and vice versa, particularly with increasing transmission rates, due to complex signal processing and long connecting wire lengths which can lead to signal interference and reduced performance.
Innovation Solution
The optical module design incorporates a circuit board with a circuit sub-board and signal processing chip, featuring a connecting hole and signal lines that shorten connecting wire lengths between light transceiver assemblies and the signal processing chip, ensuring efficient photoelectric conversion and reduced signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional circuit board design is used with long connecting wires, then ease of manufacture is improved, but signal interference increases and transmission performance deteriorates
Solution Approach 1:
The circuit board is divided into a main circuit board and a sub-circuit board, with the sub-circuit board positioned adjacent to the light transceiver assembly. This segmentation allows the signal processing chip to be placed closer to the light transceiver assembly, significantly reducing the length of connecting wires and thereby reducing signal interference while maintaining manufacturing feasibility.
Solution Approach 2:
The sub-circuit board is extended along the direction away from the main circuit board, creating a three-dimensional layout that reduces wire length. By positioning the sub-circuit board in the spatial dimension adjacent to the light transceiver assembly, the design achieves shorter connection paths without complicating the manufacturing process.
2Ease of manufacture
If signal processing chip is placed far from light transceiver assembly, then ease of manufacture is improved, but connecting wire length increases causing signal interference
Solution Approach 1:
The circuit board is divided into a main circuit board and a sub-circuit board, with the sub-circuit board positioned adjacent to the light transceiver assembly. This segmentation allows the signal processing chip to be placed closer to the light transceiver assembly, significantly reducing the length of connecting wires and thereby reducing signal interference while maintaining manufacturing feasibility.
Solution Approach 2:
The sub-circuit board acts as an intermediary structure between the main circuit board and the light transceiver assembly. It provides a platform for mounting the signal processing chip close to the light transceiver assembly, enabling short connecting wires while maintaining ease of manufacture through standardized circuit board fabrication processes.
3Reliability
If connecting wire length is reduced, then signal interference is reduced, but device structure becomes more complex
Solution Approach 1:
The circuit board is divided into a main circuit board and a sub-circuit board, with the sub-circuit board positioned adjacent to the light transceiver assembly. This segmentation allows the signal processing chip to be placed closer to the light transceiver assembly, significantly reducing the length of connecting wires and thereby reducing signal interference while maintaining manufacturing feasibility.
Solution Approach 2:
The sub-circuit board serves multiple functions: it provides mechanical support for the signal processing chip, reduces connecting wire length, and maintains ease of manufacture through standardized fabrication. This multi-functionality reduces device complexity despite the segmented structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the optical module's ability to handle high-speed signal conversions, reducing signal interference and improving overall performance by minimizing wire lengths and optimizing signal processing pathways.
Implementation Method 1
an optical module is a tool for achieving interconversion between an optical signal and an electrical signal
Data Source
AI summary
An optical module includes a circuit board, a circuit sub-board, a signal processing chip, a first light transceiver assembly, and a second light transceiver assembly. The circuit board is configured to be electrically connected to an outside of the optical module. The circuit sub-board is disposed on the circuit board and electrically connected to the circuit board. The circuit sub-board includes a first body and a connecting hole. The connecting hole runs through an upper surface and a lower surface of the first body. The signal processing chip is disposed on the circuit sub-board. The first light transceiver assembly is disposed on the circuit board and located in the connecting hole. The second light transceiver assembly is disposed on the circuit board and located outside the connecting hole.