Detergent Mixture Composition Preparation TRIZ Cases
- CMP Post-Cleaning Composition for Semiconductor Wafer Contaminant Removal
A cleaning composition with bulky protecting ligands and organic amines removes post-CMP contaminants from semiconductor wafers.
- Amine-Free Post-CMP Cleaning Composition for Microelectronic Devices
An amine-free cleaning composition removes post-CMP residues using complexing agents and basic compounds.
- Laundry Pastille Segmentation for Fragrance and Cleaning
Segmenting laundry pastilles into scent and performance types resolves the contradiction between fragrance impact and cleaning reliability.
- Polyamino-polycarboxylic Acid Cleaning Composition for Semiconductor Wafer
A polyamino-polycarboxylic acid cleaning composition enhances wetting ability on semiconductor wafers.
- Hexosaminidase Polypeptides for Biofilm Removal
Hexosaminidase polypeptides break down poly-N-acetylglucosamine to eliminate malodor and redeposition on textiles.
- Substrate Processing Nozzle Droplet Removal via Gas Flow
Gas flow removes adhered droplets from the processing nozzle before arm movement, preventing water marks on substrates caused by unintended dripping.
- Polysaccharide Trimellitic Anhydride Ester Scale Inhibition
Trimellitic anhydride esterified polysaccharides resist hydrolysis at basic pH while inhibiting calcium carbonate scale formation.