Edge Grinding Machines TRIZ Cases

Replacing rigid grinding stones with a flexible polishing tape prevents chipping during angular portion polishing while shortening air-cutting time.

A wafer beveling method adjusts polishing pad angle relative to the chamfered surface to maintain constant contact during mirror polishing.

A vehicle wheel burr removal device aligns a pyramid cutter and rotating blades to the workpiece center for uniform machining.

Elastic hinge arms adjust radial dimensions of grinding parts while maintaining parallel alignment, eliminating chip-trapping recesses that cause work failure.

A rigid polishing tool with a non-tiltable machining disk resolves positioning precision issues caused by tilting during high-speed material removal.

Spring-mounted abrasive wheels apply uniform pressure to resolve inconsistent sharpening and clogging issues.

Front-side abutment elements position sheet-like workpieces orthogonally to the advancement direction using brush-less motors.

A single ultrasonic oscillator drives multiple cleaning tanks through an output switch and matching units.

A two-step grinding method controls saw mark direction to prevent low die strength chips and reduce wafer chipping risks.

Four-station automation replaces manual labor, ensuring precise roundness while cutting rim and cap section burrs.

A contouring tool synchronizes its movement with the continuous feed-through of flat glass substrates to maintain precise corner geometry.

A flexible abrasive rotary tool abrades workpiece edges across multiple angles through planar section bending.

Simultaneous backing and printing dies apply fluorescent ink to paper sheets, ensuring absolute position matching between watermark and verification layers.

Rotating scraper tool removes burrs from aircraft turboshaft engine casings, eliminating manual handling risks and harmful dust projection.

Metrology feedback detects uneven pad wear to dynamically adjust conditioning disk rates, maintaining surface uniformity for continuous wafer processing.

A grinding tool uses a 65% thick binding material layer to embed similarly sized abrasive particles.

A displaceable carriage uses pressurized lubricant pockets to reduce friction while island-shaped surfaces provide damping.

Dual-stage polishing tapes remove deposited films and polish silicon substrates, preventing substrate damage from high-pressure diamond disks.

A brush-type deburring machine uses adjustable conveying discs and rotatable brush rollers to process elongate profile sections.

A two-sided surface grinding method oscillates workpieces within wheel peripheries to maintain precise contact zones.

A vibration polishing device uses magnetic adhesion to detachably couple the polishing bowl, enabling quick media changes without complex mechanical fasteners.

A positioning member secures the movable jaw within the sliding groove during surface grinding.

Parallel workholding devices enable simultaneous individual cam machining, reducing non-productive times and lowering production costs.

Alternating dual worktables eliminate grinding interruptions during plate delivery, sustaining continuous operation and consistent dimensions.

A clamping mechanism with linear and rotational movement adjusts eyeglass frames relative to the tracer.

A disk head with a circumferential surface supports a polishing tape to prevent displacement during wafer edge processing.

Opposing rotation of the workpiece and abrasive medium in a baffled vessel achieves nanometric surface roughness while maintaining high material removal rates.

An automated cutting device with L-shaped reverse chamfer cutters eliminates manual scratching and coaxiality deviations during continuous wheel production.

A precision divider and angle platform cut gemstone facets with 0.125 degree angular accuracy.

A grinding head uses a tangential diamond wheel to process glass edges.

Applying an adhesive layer before grinding special-shaped liquid crystal display panels prevents frame sealant peeling and substrate cracking.

A notched grind wheel rotates to align its rim notch with rotor disk lobe widths, grinding the wider slot base efficiently.

Multi-wheel grinder tool uses a belt-driven pulley system to transmit rotational motion from the motor to four independent polishing pads.

A deburring apparatus uses a reciprocating blocking cover to isolate the processing zone.

Automated spool mechanisms eliminate manual unwinding delays by continuously feeding wire stock through the grinding wheel.

A conical tool adjusts its height and rotation axis position to machine uniform chamfers on cross hole edges.