Flexible Polishing Tape for Angular Substrate Edges

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Solution Overview

Problem

The existing methods for polishing angular portions formed by the grinding of a substrate's back surface and circumferential surface are inefficient, leading to potential damage, uneven polishing, and reduced throughput due to the rigidity of grinding stones and issues with protection films.

Innovation Solution

A method and apparatus using a flexible polishing tape that rotates and oscillates to polish the angular portions while peeling off protection films, allowing for quick and uniform polishing without damaging the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a grinding stone is used to polish the angular portion, then the angular portion can be removed, but the substrate may be damaged due to the rigidity of the grinding stone and misalignment

Engineering Contradiction:

Improvepolishing uniformityVSAvoidsubstrate integrity

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent replaces the rigid grinding stone with a flexible polishing tape that can conform to the substrate surface. The flexible tape reduces impact forces and prevents substrate damage while maintaining polishing effectiveness, directly resolving the contradiction between polishing uniformity and substrate integrity.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical parameters of the polishing tool from rigid (grinding stone) to flexible (polishing tape), and adjusts the polishing speed to be slower, reducing impact forces while maintaining effective material removal, thereby preventing substrate damage.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If the grinding stone is brought closer to the substrate slowly to prevent damage, then substrate damage is reduced, but the air-cutting time increases and throughput decreases

Engineering Contradiction:

Improvesubstrate integrityVSAvoidthroughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The flexible polishing tape allows for faster approach speeds compared to rigid grinding stones because it can absorb impact forces dynamically. This flexibility enables quicker air-cutting time reduction while maintaining substrate integrity, resolving the contradiction between reliability and productivity.

Inventive Principle:

Principle #30Flexible shells and thin films

3Ease of operation

If the substrate is rotated about its center, then the angular portion can be accessed for polishing, but misalignment with the rotational axis causes polishing unevenness

Engineering Contradiction:

Improvepolishing accessibilityVSAvoidpolishing uniformity

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The flexible polishing tape can adapt to slight misalignments and irregularities in substrate rotation, maintaining consistent contact with the angular portion. This flexibility compensates for alignment errors and ensures uniform polishing even when the substrate center does not perfectly align with the rotational axis.

Inventive Principle:

Principle #30Flexible shells and thin films

4Reliability

If a protection film is attached to the substrate, then devices on the front surface are protected, but the adhesive unevenness causes uneven polishing

Engineering Contradiction:

Improvedevice protectionVSAvoidpolishing uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The flexible polishing tape can conform to the substrate surface even when a protection film is attached, adapting to the uneven adhesive distribution. This allows polishing to proceed uniformly without being disrupted by the protection film's adhesive variations, resolving the contradiction between device protection and polishing uniformity.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible polishing tape reduces the risk of chipping and allows for faster polishing, shortening the air-cutting time and achieving uniform results even with protection films attached, thereby enhancing the substrate's surface quality and processing efficiency.

Implementation Method 1

pressing a polishing tape against an angular portion formed by the back surface and a circumferential surface of the substrate to polish the angular portion

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS8535117B2Method and apparatus for polishing a substrate having a grinded back surface

Publication Date: 2013.09.17 EBARA CORP

AI summary

A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.