Edge Grinding Machines TRIZ Cases
- Laser Wafer Separation for Chamfered Edge Stability
Removing material along the chamfered wafer edge stabilizes internal laser separation and helps avoid focal deviation, breakage, and uneven thickness.
- Wafer Ring Frame Tape Clamping for Twist-Free Chip Handling
A two-tape ring frame setup prevents tape twisting at the wafer opening, keeping chips stable for back-surface grinding and handling.
- Wafer Edge Trimming and Wet Polishing for Clean Bonding Surfaces
Deep edge trimming plus wet polishing removes debris and abnormal surface layers before wafer bonding, reducing joint defects and breakage.
- Wafer Notch Processing for Stable Back Grinding Alignment
Pre-thinning the wafer notch with a notch wheel preserves notch integrity during back grinding and improves alignment recognition yield.
- Wheel Rim Burr Removal Using Eccentric Motion and Brush Wheels
Eccentric wheel motion spins and sways the rim so brush wheels fully remove spoke-hole burrs, cutting manual work, injuries, and defects.
- Subsurface Laser Damage Patterning for Low-Kerf Crystal Parting
Interspersed subsurface laser damage lines enable thin crystal layer separation with lower kerf loss, less surface damage, and higher throughput.
- Dual Trim Blade Wafer Edge Trimming to Prevent Bond Peeling
A two-stage trim blade process cuts an annular trench before edge removal, reducing wafer bond peeling while preserving usable die area.