Wafer Ring Frame Tape Clamping for Twist-Free Chip Handling
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Solution Overview
Problem
The existing method of disposing chips in a ring frame with a central opening using tape often results in tape twisting, which prevents suitable holding and processing of device chips.
Innovation Solution
A chip treating method involving a first tape affixed to a wafer, forming a ring frame unit with a central opening, and then disposing chips on the first tape, followed by a second tape being applied to clamp the ring frame, preventing tape twisting and allowing for chip processing without distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a tape is affixed to a ring frame having a central opening to dispose chips, then chip processing can be performed, but twisting of the tape occurs at the opening, preventing suitable holding and processing of device chips
Solution Approach 1:
The patent divides the single-tape approach into a two-tape system: a first tape affixed to the ring frame with opening, and a second tape affixed to the back surface of the chip. This segmentation eliminates the twisting problem by distributing functional requirements across separate components, allowing the first tape to provide structural support while the second tape ensures chip holding stability.
Solution Approach 2:
The patent introduces a support structure (ring frame with opening) as an intermediary between the tape and the chip. This intermediary provides mechanical support that prevents tape twisting, enabling stable chip holding and processing. The support structure acts as a mediator that resolves the conflict between tape flexibility and structural stability.
2Adaptability or versatility
If the tape is affixed to the ring frame with opening, then chip disposal is enabled, but the tape twists at the opening making it difficult to hold device chips suitably
Solution Approach 1:
The patent segments the chip holding function into two separate tape systems with distinct roles. The first tape provides adaptability for chip disposal by being affixed to the ring frame, while the second tape ensures manufacturing precision by being affixed to the chip back surface, preventing twisting and ensuring accurate chip positioning.
Solution Approach 2:
The patent applies preliminary action by pre-affixing the first tape to the ring frame structure before chip placement. This preliminary preparation creates a stable base that prevents subsequent twisting, ensuring both adaptability for chip disposal and precision for chip holding.
3Device complexity
If a single tape is used to affix chips to the ring frame, then the process is simple, but the tape twists at the opening preventing suitable processing of back surfaces
Solution Approach 1:
The patent accepts increased device complexity by implementing a two-tape system, where the first tape is affixed to the ring frame and the second tape is affixed to the chip back surface. This segmentation improves processing reliability by eliminating tape twisting, ensuring stable chip holding during back surface processing despite the increased system complexity.
Data Source
AI summary
A chip treating method includes a first tape affixing step of affixing a first tape to a circular wafer, a ring frame unit forming step of removing a central part of the wafer to form a ring frame unit having an opening, and a chip disposing step of disposing chips on the first tape exposed in the opening.