Edge Grinding Machines TRIZ Cases

A cavity-based tool directs viscous media to machine exterior surfaces of complex work pieces.

Quartz sensor holders resist thermal expansion from polishing heat, maintaining accurate sensor position and reducing wafer thickness deviations.

Rotating polishing jig presses abrasive member against tube support plate holes to remove burrs and smooth edges.

Radially movable supporting members and a hydraulic clamping system align the crankshaft axis, eliminating rotational deviations during bearing grinding.

A smoothing tool uses a keyed bushing to drive abrasive sectors, resolving mounting reliability issues in precision hole finishing.

Polishing magnetic tape edges before guide roller contact eliminates irregular flange interaction, ensuring precise servo pattern writing accuracy.

Automated cleaning device rotates brushes against wheel flanges to remove casting burrs, preventing corrosion in weight-reducing pits.

A numerical control chamfering apparatus adjusts the relative position of a silicon wafer and grindstone based on circumferential crystal orientation.

Grinding machine and burnishing machine reduce surface roughness to 0.814 μm for aerospace components.

A flat deburring machine adjusts brush height automatically using encoder wheels and a reference plane to maintain consistent contact pressure.

A wafer grinding method uses an inclined rough wheel and a parallel finish wheel to improve material bite during precision processing.

A rotary shaft spacer with an outer machining surface enables precise lens scoring and counter-beveling operations.

Centrifugal diamond wire abrasion forms microscopic protuberances on optical glass substrates to reduce light reflection.

Movable grinding wheels sharpen both cutting edges simultaneously, while a pivoting state enables in-situ balance testing without removing the blade.

Servo-driven brushes dynamically adapt to varying wheel geometries, resolving the trade-off between device complexity and multi-size production versatility.

Dynamic positioning of objects within the treating container ensures uniform compressive residual stress distribution across all surface areas.

Applying a temporary fluorinated coating raises lens surface energy to prevent slippage during edging while preserving the permanent anti-fouling top coat.

Two-stage tapering shapes lateral strip edges to discharge melting steel, removing oxide penetrators and improving weld toughness.

Vacuum-fixed flexible wafer holds optical lenses for machining, eliminating thermal deformation and toxic waste from traditional wax bonding.

Abrasive media in a rotating barrel removes excess filler material from gas turbine airfoils to restore radiused edges.

Segmented cross-section detection along the longitudinal contour enables precise lens bevel machining to avoid mechanical interference.

Tilting the grinding wheel axis creates clearance inside narrow channels to grind required profiles.

Segmented protective film and liquid resin suppress wafer asperities during grinding, eliminating complex peeling operations.

A method smoothing metal surfaces using ion transport through electrically conductive free solid bodies in a gaseous environment.

Forming surface tracks during fabrication eliminates lengthy pre-conditioning, reducing downtime by 50%.

Abrasive microparticles injected during operation abrade internal surfaces, eliminating maintenance downtime and restoring engine efficiency.

A silica-based polishing composition with tetraalkylammonium salts removes silicon material while maintaining surface smoothness.

Computer-controlled auto-scraping apparatus uses multi-axis tracking and driving devices to remove material from hard rail work pieces.