Electroforming Processes TRIZ Cases
- Electroforming Manifold for Uniform Wall Thickness Control
Shield wings, electrolyte jets, and an auxiliary anode control current density to keep electroformed walls uniform and avoid excess metal.
- Copper Bump Electrodeposition Composition for Uniform Void-Free Filling
A polyalkyleneimine leveling agent enables smooth, coplanar copper bumps and void-free filling of recessed features at high plating rates.