Electroforming Processes TRIZ Cases

Shield wings, electrolyte jets, and an auxiliary anode control current density to keep electroformed walls uniform and avoid excess metal.

A polyalkyleneimine leveling agent enables smooth, coplanar copper bumps and void-free filling of recessed features at high plating rates.

A zinc core bonded to bismuth-containing cladding improves elongation under tensile load while suppressing gas generation in battery foil.

An ionic liquid-water plating solution enables controlled co-deposition of multiple metals, including Cr, at practical electrodeposition speed.

Nanotwin boundaries in electrodeposited copper alloys address the strength–conductivity trade-off while preserving electrical and thermal conductivity.

Dynamic bubble templating and a removable conductive intermediate layer produce free-standing porous material with interconnected pores.

Controlled copper sulfate electrolysis produces uniform micropores and a smooth foil surface while limiting wall deposition and edge tearing.

Quadrangular electrode segments and spaced bolts support high-current copper foil production with flatter shape and uniform thickness.

Microfabricated water cavities align durable electrodes with charge-separated zones for continuous, scalable energy extraction.

Nitrogen-containing cationic polymer enables uniform matte electrodeposited copper foil at high current densities.

Inclined mold patterns enable high-resolution organic material deposition by eliminating edge rounding errors.

A suction belt transport system moves electrolytically deposited films without direct contact, preventing surface damage during removal.

A studded plate electroforming method uses a screen layer to create uniform elevation height.

Pulsed electrodeposition creates nano-twin copper with submicron grains.

Constant current pulse electrodeposition produces thick titanium sheets from molten salt while enabling easy film separation from the cathode.

Additive manufacturing creates a liquefier tube with a monotonic feed channel that prevents material decomposition by eliminating dead spots.

A copper electrolytic solution additive containing a specific epoxy-derived skeleton reduces surface roughness on the foil.

Pre-formed drum protrusions ensure uniform copper deposition, preventing adhesive force reduction and eliminating post-processing steps.

Novel porous metal alloys trap carbon dioxide at active sites to boost electroreduction efficiency.

Pulse electroforming deposits multilayer metal films that interdiffuse during thermal treatment to form controlled alloy compositions.

Electroforming deposits Fe-P-Cr alloy thin plates, bypassing rolling limitations to achieve ultrathin dimensions under 100 micrometers.

Nano-twinned copper foil with exposed (111) planes resolves high-temperature instability and intermetallic compound formation in thermal interface materials.

Optimized molten salt temperature and ion concentration enable continuous current deposition, resolving the trade-off between production speed and peelability.