Electroforming Studded Plate with Uniform Elevation Height

The patent replaces mechanical machining or deforming methods with an electrolytic deposition process. By using electroforming, the elevations are formed through controlled metal deposition on a master model, ensuring uniform height and precise geometry without the variability inherent in mechanical processes.

The patent creates a master model with the desired elevation pattern and uses it as a template for electrolytic deposition. This copying approach ensures that all elevations are replicated with identical dimensions and uniform height, transferring the precise geometry from the master model to the final plate.

The electrolytic deposition process is divided into distinct stages: first forming a screen layer with dykes and screen openings, then passivating the surface, and finally depositing a continuous metal layer to fill openings and cover the surface. This segmentation allows each stage to be optimized independently while maintaining overall process control.

The patent performs preliminary actions by first creating the screen layer with dykes and screen openings, then passivating the uncovered surface before the final deposition. This preliminary passivation prevents unwanted deposition in certain areas and ensures that the continuous metal layer forms only where intended, achieving uniform elevation height.

The patent creates a copy die by electrolytically depositing metal onto the original electroforming die. This copy die can then be used for subsequent production runs, preserving the original die from damage while maintaining production efficiency. The copy process replicates the precise geometry of the original die.

The patent protects the original electroforming die by creating a durable copy die that serves as the working tool. This beforehand cushioning approach prevents direct contact between the original die and potentially damaging materials during repeated production cycles, ensuring long-term reliability.