Glass Severing Apparatus TRIZ Cases

Variable laser pulse intervals at dummy and edge areas improve mother substrate separation while reducing rough cuts and thermal damage.

Multiple laser passes distribute stress symmetrically along the dicing path to reduce cracks and chips in complex optical device contours.

Pulse energy is raised near contour intersections to form complete defects in glass, enabling faster, cleaner, and more reliable separation.

Two laser steps and applied stress guide a glass crack from a diagonal starter to a perpendicular path, avoiding extra chamfering.

Controlled buffered pressing separates display-panel edge residue precisely, protecting the circuit layer while reducing manual injury risk.

A laser-formed separation line inside strengthened glass guides crack propagation, making flaws visible and breakage more controlled.

Pulsed laser filaments weaken glass along the cap line, enabling precise hollow glass rim separation without polishing or washing.

Laser grooving plus two-stage chemical etching forms constant-curvature thin cover glass that improves handling and side-impact resistance.

Ultrashort laser filaments and etching form tapered walls or blind holes in glass with simpler process control and precise geometry tuning.

Pulsed laser focal lines induce internal absorption and controlled cracking in glass and wafers, enabling clean separation with minimal particles and melt edges.

A CO laser with cooling fluid drives controlled crack propagation in ultra-thin glass, improving edge quality and avoiding thermal buckling.

Partial laser cuts from both wafer sides reduce micro-cracks in waveguide glass, improving strength and drop-test reliability.

A radially offset aspheric optic enables high-angle laser focal lines that cut glass with angled, particle-free edges and less breakage.

Ultrashort-pulse laser defect lines and guided crack propagation cut glass contours with clean edges, low debris, and less polishing.

Wavelength-dependent focusing and filtering reshape focal-line intensity and depth for precise, reproducible glass or glass-ceramic separation.

Opposed laser perforations define a contour zone for singulating optical waveguides with fewer stress cracks, better yield, and complex shapes.

A laser disruption element scatters transmitted light to protect the carrier support base during precise cutting of transparent materials.

A focused thermal beam from an incandescent bulb cuts curved glass scoring lines with controlled breakage, avoiding fluids, flames, and coating damage.

Offset aspheric beam shaping induces absorption defects along a contour line, enabling faster, cleaner glass separation with less debris.

Focused short-pulse laser modifications guide crack planes to detach curved semiconductor layers with less material loss and smoother surfaces.

An elongated uniform laser focus cuts brittle materials through full thickness in one pass, lowering pulse energy and improving edge quality.

Nonlinear laser absorption forms defect lines in glass, enabling interior contour removal with low debris and minimal subsurface damage.

Ultrashort-pulse laser flaws and slow etching form sub-100 μm glass channels with rounded depressions that suppress crack growth and stress.

Surface-absorbed laser heating creates interacting temperature gradients that separate brittle materials quickly and accurately without pre-damage.

Blind-hole laser drilling, annealing, and hydrofluoric acid etching reduce glass cracks and improve plating adhesion in through holes.

Asymmetrical laser power on both glass faces creates thermal stress for diagonal cleaved edges, improving cut separation and edge quality.