Optical Waveguide Perforation Singulation for Precise Contour Cutting
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Solution Overview
Problem
Traditional methods for cutting optical substrates using milling or water jets introduce stresses that can cause substrate separation along unintended paths, leading to stress cracks and fractures, and result in reduced yield.
Innovation Solution
A method involving three laser beams is used to singulate optical waveguide materials, where the first and second laser beams create perforations on opposite sides of the material to define a perforation zone, and a third laser beam then singulates the material at this zone, reducing wafer-level stress and enabling complex geometries for enhanced optical alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional milling or water jet methods are used to cut optical substrates, then the cutting process can be completed, but stresses are introduced in the substrate causing pieces to separate along unintended paths
Solution Approach 1:
The patent replaces traditional mechanical cutting methods (milling) and water jet methods with a laser-based singulation system. The laser beam creates perforations and applies localized stress at the contour without introducing wafer-level stresses, thereby eliminating the problem of unintended separation paths while maintaining manufacturing capability.
Solution Approach 2:
The patent changes the fundamental parameter of the cutting process from mechanical or hydraulic force to optical energy (laser). By using laser perforations and localized heating at the contour, the process achieves precise separation without the stress propagation that occurs with traditional methods, improving separation path accuracy.
2Productivity
If traditional cutting methods are used, then material can be removed to create shapes, but stress cracks and fractures occur along the preferential crystalline internal structure
Solution Approach 1:
The patent applies localized action by creating perforations only at specific locations along the contour and applying stress only at the perforation zone. This localized approach prevents stress propagation through the entire substrate, eliminating stress cracks and fractures along the crystalline structure while maintaining the ability to create complex shapes.
Solution Approach 2:
The patent segments the cutting process into discrete perforations along the contour rather than continuous material removal. By creating a series of localized perforations and applying stress at these discrete points, the process avoids the continuous stress application that causes cracking in traditional methods.
3Adaptability or versatility
If traditional methods are used to cut optical substrates, then simple shapes can be produced, but complex geometries for critical optical alignment cannot be achieved
Solution Approach 1:
The patent enables dynamic and flexible contour definition through programmable laser positioning and perforation patterns. The system can adapt to complex geometries by adjusting the perforation locations and patterns along arbitrary contours, achieving precise optical alignment for complex shapes that traditional fixed-tooling methods cannot produce.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces stress cracks and fractures, increases process yield, and allows for the manufacture of optical waveguides with complex geometries for improved visual performance in devices like augmented reality headsets.
Implementation Method 1
A first laser beam is directed onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material
Implementation Method 2
A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material
Implementation Method 3
A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone
Data Source
AI summary
Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.