Grinding Carriages TRIZ Cases

A processing system detects vibration, current, and temperature changes to monitor functional unit states.

Segmenting the machine bed into distinct areas reduces device complexity while improving operator accessibility and safety.

A sanding machine roller rotates around a transverse axis to maintain abrasive belt equilibrium.

Adjustable whetting plates accommodate unique curved clipper geometry, resolving fixed-angle limitations while preserving original cutting edge precision.

Rotating sandpaper sheets move along a chain path to maintain consistent contact with workpieces during automated sanding operations.

A spring-loaded oscillating grinding device positions the wheel automatically over rivet joints to reduce manual effort.

A rolling structure supports a sanding tool on a vertical column, enabling radial orientation to reduce operator fatigue during large surface coverage.

Ultrasonic vibration prevents grindstone dulling and excessive grinding, ensuring stable wafer surface quality throughout the process.

Stacked modular chemical mechanical polishing modules enable concurrent substrate processing through independent linear actuator motion.

A polishing platen features an annular pad and a central aperture for optical substrate monitoring.

Segmented carriers align reference points uniformly, enabling parallel processing that increases output while maintaining dimensional accuracy.

Camera-based recognition calculates positioning offsets between misaligned centers to prevent bending, breakage, and vacuum leaks in lithium tantalate grinding.

A flexible plate-shaped structure bridges gaps between segmented waterproofing pans in wet treatment apparatuses to ensure reliable liquid containment.

A sander balancer uses a front-mounted balance element to counteract heavy rear battery weight, preventing backward tipping while preserving motor power.

Segmented handles and a platen extension resolve awkward positioning constraints, enabling precise surface control without increasing device complexity.

Inclined spindle axis reduces footprint while enabling safe manual loading.

A workpiece grinding method uses a spacing step to separate the chuck table and grinding wheel while maintaining contact.

A sanding machine base uses swivelling spherical wheels and adjustable supports to maintain constant pressure and angular stability.

Angled functional surfaces on a monolithic machine block guide workpiece and machining unit movements to reduce floor space requirements.

A robot-mounted post-process tool integrates grinding, inspection, and marking functions to refine laser brazing beads on vehicle body panels.

Eccentric support centers distorted shafts to restore tolerance without cracking.

An integrated device synchronizes inner grinding and outer polishing wheels to process diamond surfaces in a single clamping operation.

A flex-arm device with a rotatable shaft and locking set members adjusts the grinding wheel orientation for angled surface contact.