Grinding Work Supports TRIZ Cases
- Conical Table Cover for Residue-Draining Substrate Removal
A conical table cover drains processing liquid radially during substrate grinding, suppressing residue buildup and easing maintenance.
- Laser-Fused Ground Workpiece Surface for Crack-Free Recesses
Laser fusion heals grinding cracks and chipping at recess and annular projection boundaries, improving workpiece strength for later processing.
- Substrate Holding Table Grooves for Swarf-Free Back Surface Processing
Discharge and outer circumferential grooves collect swarf and liquid while suction stabilizes the substrate to keep its back surface clean.
- Suction Grinding Robot for Walls, Ceilings, and Complex Surfaces
Negative-pressure suction lets the grinding robot hold walls and ceilings while maintaining contact pressure for automated surface finishing.
- Chuck Table Holder Surface Grinding for Wafer Flatness
A staged grinding process treats the chuck table frame and porous member separately to prevent concavity and uneven wafer thickness.
- Ceramic-Metal Hydrostatic Pad for Wafer Nanotopography Control
Bonding a low-expansion ceramic pad to a conductive metal base reduces nanotopography by stabilizing surface flatness against thermal deformation.
- C-Shaped Yoke Clamping Device Neutral Axis Tie Rod
A C-shaped yoke clamping device uses a tie rod to transmit axial force, preventing yoke deformation and ram misalignment.
- Optical Fiber Polishing Fixture With Distinct Wear Paths
Distinct wear paths from varied port positioning extend abrasive film life and reduce polishing cycle time.
- Adjustable Workholder for Complex Curved Surface Polishing
An adjustable workholder with an elastic member allows axial sliding and angular adjustment of the polishing head.
- Ultrasonic Vibration Mechanism for Nanofluid Infiltration in Grinding
An adjustable ultrasonic vibration mechanism drives nanofluid into micro-channels within the grinding zone to enhance cooling and lubrication.
- Workpiece Holding Device Thermal Expansion Warping Prevention
A workpiece holding device uses a clamping member with radial gaps to press the chuck against the base, accommodating differential thermal expansion.
- Workpiece Holder Unit for Grinding Machine
Roller-mounted rotating carriers process varying height workpieces simultaneously, resolving productivity versus adaptability contradictions.
- Resin Sheet with Surface Irregularities for Wafer Fixation
Surface irregularities on a resin sheet base material layer fix wafers through suction, eliminating adhesive residue during grinding.