Grinding Work Supports TRIZ Cases
- Conical Table Cover for Residue-Draining Substrate Removal
A conical table cover drains processing liquid radially during substrate grinding, suppressing residue buildup and easing maintenance.
- Laser-Fused Ground Workpiece Surface for Crack-Free Recesses
Laser fusion heals grinding cracks and chipping at recess and annular projection boundaries, improving workpiece strength for later processing.
- Substrate Holding Table Grooves for Swarf-Free Back Surface Processing
Discharge and outer circumferential grooves collect swarf and liquid while suction stabilizes the substrate to keep its back surface clean.
- Suction Grinding Robot for Walls, Ceilings, and Complex Surfaces
Negative-pressure suction lets the grinding robot hold walls and ceilings while maintaining contact pressure for automated surface finishing.