Group 4/14 Element Organic Compounds TRIZ Cases
- Flow Cell Assays With Probabilistic Decoding for Polypeptide Identification
Multiple lower-specificity assays and computational decoding help flow-cell workflows distinguish individual polypeptides with high confidence.
- Benzotriazole Compound for Selective Keap1-Nrf2 Activation
A Formula 1 benzotriazole compound selectively inhibits the Keap1-Nrf2 interaction to activate Nrf2 against oxidative-stress diseases.
- Cyclic aminoorganoxysilane compound and method for producing the same
Reacting aminoorganoxysilane with an epoxy compound forms a cyclic molecule that increases functionality while limiting gelation.
- Metallocene complex and preparation method therefor, catalyst composition, olefin polymerization method and olefin polymer
Localized heterocyclic ligand effects improve catalytic activity and structural regularity in high-cis ethylene–diene copolymerization.
- Ring-Opening Synthesis of Cyclic Aminoorganoxysilanes
Ring-opening synthesis combines an aminoorganoxysilane with an epoxy compound to create a multifunctional liquid compound with less gelation risk.
- Single-Terminal Silyl Fluorinated Ether Compound for Uniform Coatings
Single-terminal silyl groups limit agglomeration in fluorinated ether coatings, preserving lubricity, abrasion resistance, and surface uniformity.
- Green-Absorbing Semiconductor Composition for Small-Pixel Image Sensors
Small silicon photodiode absorption areas limit sensitivity; a p-type/n-type composition targets green-light absorption for compact, thermally stable image sensors.
- 3-Halopropyltrihalosilane Hydrosilylation With Platinum Cocatalysts
A Karstedt catalyst paired with a formula (A) cocatalyst improves selectivity and yield while suppressing propyltrihalosilane side-products.
- Pan-KRAS Degrading Agent Using PROTAC-Mediated Ubiquitination
PROTAC-mediated ubiquitination bypasses KRAS G12D's lack of a cysteine residue and enables targeted proteasomal degradation.
- Silicon Compound Precursors for Strong Low-k Dielectric Films
Tailored silicon compounds enable low-k dielectric film deposition with improved mechanical strength and no additional cure step.