Heads Using Thin Films TRIZ Cases
- Lapping Stacked Row Bars with In-Wafer ELG Circuits
Continuous electrical traces through stacked row bars eliminate repeated wire reattachment steps, accelerating ABS stripe height processing.
- Thin Cap Layer Decouples Magnetoresistive Stack for High-Density Data Readers
A 4 nm cap layer decouples a magnetoresistive stack from a shield, reducing reader width offset while preventing oxidation during fabrication.
- Carrier Bridge CTE Matching for Slider Lapping Stability
A carrier bridge with matched thermal expansion prevents slider bowing during lapping.
- Magnetic Sensor Doped Ferromagnetic Cap Underlayer Read Gap
Doping soft ferromagnetic cap and underlayer with high spin orbit coupling materials stabilizes the sensor stack against spin torque destabilization.
- Virtual Side Shield Design for Magnetic Recording Areal Density
A composite virtual side shield prevents adjacent track erasure and magnetic shunting, increasing bits per inch in magnetic recording devices.
- Write Pole High Magnetic Moment Material Lamination
Laminating rare earth and transition metal layers on the write pole increases magnetic moment to overcome areal density limitations.
- Tape Head Side Shields for Crosstalk Reduction
Insulation layers separate side shields from write poles, reducing magnetic interference while maintaining high storage density.
- Multi-Layer Cap Protrusion Control for HAMR Head Collision Risk
A multi-layer cap structure with differential thermal expansion coefficients controls transducer protrusion in heat-assisted magnetic recording heads.
- Soft Bumper Pads for HDD Slider Media Damage Mitigation
Silicon and diamond-like carbon bumper pads absorb contact forces on hard disk drive sliders, preventing media damage during head/disk interactions.