High Current Circuit Adaptations TRIZ Cases
- Busbar Wiring Substrate Layout for Insulation and Thermal Stress
A sheet-like insulator between conductive plates increases insulation distance and eases heat-driven stress in compact busbar substrates.
- Wiring Substrate Seed Layer Thickness Control
Limiting the seed layer to 2.5% of total conductor thickness prevents short circuits from exposed seed portions while maintaining low resistance.
- Rigid-Flex Electronic Circuit With Embedded Busbars
A rigid-flex electronic circuit integrates embedded busbars within superposed printed circuit layers to create a compact design for turbomachine applications.