Busbar Wiring Substrate Layout for Insulation and Thermal Stress
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing circuit substrates with busbars lack effective insulation between conductive plates, leading to insufficient electrical isolation and potential thermal stress due to heat generation.
Innovation Solution
A wiring substrate configuration featuring a first and second conductive plate with insulating elements, where the insulator separates and extends between the plates, increasing the insulation distance and using a sheet-like insulator to mitigate thermal expansion stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If busbars are connected to each other in a busbar construct, then electrical connectivity is achieved, but insulation between the busbars is insufficient
Solution Approach 1:
An insulator is introduced as an intermediary component between the first and second busbars. The insulator includes a first portion that separates the busbars and a second portion that covers the first main surface of the first busbar, thereby providing effective electrical isolation while maintaining the connectivity function of the busbar construct
Solution Approach 2:
The insulator extends in multiple directions: the first portion separates the busbars in the horizontal plane, while the second portion extends to cover the top surface of the first busbar. This multi-dimensional insulation approach increases the insulation distance and effectiveness beyond what a simple linear separator could provide
2Volume of moving object
If conductive plates are placed close together for compact design, then device size is reduced, but thermal stress from heat generation increases
Solution Approach 1:
The insulator acts as a thermal intermediary between the two conductive plates, providing thermal isolation that reduces heat transfer and thermal stress while allowing the plates to remain in close proximity for compact device design
Solution Approach 2:
The insulator is configured as a thin-walled structure with a first portion and a second portion that covers the busbar surface. This thin-film approach provides effective thermal and electrical isolation without adding significant volume, maintaining compact device size while mitigating thermal stress
Data Source
AI summary
A wiring substrate includes a first conductive plate, a second conductive plate, and a first insulator. A first end of an element is connected to a first main surface of the first conductive plate, and a second end of the element is connected to a first main surface of the second conductive plate. The first insulator includes a first portion and a second portion. The first portion separates the first conductive plate and the second conductive plate from each other. The second portion is continuous with the first portion, and covers at least a portion of the first main surface. The first portion includes an end portion. The end portion protrudes from the second main surface to the opposite of the first main surface or from the second main surface to the opposite of the first main surface.