Controlled chemical delivery conditions wafer-cleaning brushes offline, cutting prep time, contamination risk, and semiconductor processing defects.
Chemical surface alteration followed by thermal desorption removes substrate material precisely without plasma damage or contamination.
Two-stage neutralization precipitates hexafluorosilicate before HF recovery, cutting water evaporation, energy use, and process time.
Microbubbles and active silicon convert fluorine in phosphate rock into volatile fluorides, improving recovery and lowering fluorine in phosphogypsum.
Alkali metal salts, distillation, mist removal, and condensation regenerate high-purity HF and nitric acid from waste acid.
A sulfuric acid alkylation reactor system uses an external emulsion pump to mix reactants and catalyst efficiently.
An azeotrope-like composition enables efficient separation of hydrogen fluoride from fluoroethylene products through constant boiling point distillation.