Dry Non-Plasma Surface Treatment for Precise Material Removal
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Solution Overview
Problem
Current material processing methodologies face challenges in efficiently removing material from substrates using pattern etching techniques, particularly in reducing feature size and altering surface chemistry without plasma, which limits precision and effectiveness.
Innovation Solution
A dry non-plasma treatment system and method that combines chemical and thermal treatments, utilizing a temperature-controlled process chamber with a chemical treatment system to alter surface layers and a thermal treatment system to evaporate these layers, controlled by a system that manages process gas introduction and substrate temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemical treatment is applied to alter surface chemistry of hard mask layers, then feature size reduction is enabled, but material removal efficiency is insufficient without effective desorption
Solution Approach 1:
The patent changes the thermal parameter by introducing a thermal treatment step that heats the substrate to a temperature sufficient to desorb the chemically altered surface layers. This parameter change enables efficient material removal while maintaining the chemical treatment's precision for feature size reduction.
Solution Approach 2:
The patent combines chemical treatment and thermal treatment in a continuous process sequence. The chemical treatment alters the surface chemistry, and the subsequent thermal treatment immediately desorbs the altered layers, creating a continuous and efficient material removal process without interruption.
2Productivity
If plasma-based etching is used for material removal, then etching speed is improved, but damage to underlying layers and contamination occur
Solution Approach 1:
The patent replaces the plasma-based mechanical/chemical etching system with a non-plasma system that uses chemical vapor deposition followed by thermal desorption. This substitution eliminates the harmful plasma effects while maintaining material removal capability through controlled chemical and thermal processes.
3Productivity
If thermal treatment is applied to desorb altered surface layers, then material removal is achieved, but temperature control precision is required to avoid damaging underlying layers
Solution Approach 1:
The patent specifies a temperature range for the thermal treatment step that is sufficient to desorb the chemically altered surface layers but remains below the damage threshold for underlying layers. This parameter optimization enables material removal while protecting sensitive structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise removal of material from substrates by chemically altering and then thermally desorbing surface layers, improving feature size reduction and surface processing without the limitations of plasma-based methods.
Implementation Method 1
a chemical treatment system coupled to the temperature controlled process chamber and configured to introduce a process gas to the temperature controlled process chamber, wherein the process gas chemically alters exposed surface layers on the substrate
Implementation Method 2
a thermal treatment system, separate from the temperature-controlled substrate holder, coupled to the temperature controlled process chamber and configured to elevate the temperature of the substrate in the temperature controlled process chamber, wherein the elevated temperature causes evaporation of the chemically altered surface layers
Data Source
AI summary
A dry non-plasma treatment system for removing material is described. The treatment system is configured to provide chemical treatment of one or more substrates, wherein each substrate is exposed to a gaseous chemistry under controlled conditions including surface temperature and gas pressure. Furthermore, the treatment system is configured to provide thermal treatment of each substrate, wherein each substrate is thermally treated to remove the chemically treated surfaces on each substrate.