Investigating Semiconductor Impurities TRIZ Cases
- Photoluminescence Edge Detection Using a Light-Emitting Sample Holder
A light-emitting support behind a transparent sample holder boosts edge contrast, helping detect photovoltaic cell defects more accurately.
- OPC Model Calibration Using SEM-GDS Alignment and Contour Verification
SEM-GDS image alignment, filtering, and genetic contour verification improve OPC model accuracy and reduce lithography pattern distortion.
- Photoluminescence Edge Detection Using Backside Transmission Light
Backside transmission light boosts edge contrast in photoluminescence measurement, enabling precise photovoltaic cell edge and defect detection.
- Pump-Probe SHG Metrology for Semiconductor Interface Characterization
Dual-source pump-probe SHG separates interface excitation from probing to distinguish defects and charge dynamics with lower optical damage.
- SPV Fe Measurement in P-Type Silicon Under Ion-Controlled Air
Controlling airborne ions and organics in SPV testing stabilizes diffusion length and improves low-Fe measurement accuracy in p-type silicon wafers.
- Semiconductor Substrate Scattered-Light Evaluation of Subsurface Damage
Laser scattering enables non-destructive evaluation of subsurface damaged layers and strain distribution in semiconductor substrates.
- Semiconductor Measurement Deviation Root-Cause Mapping
Simulation-based comparison of actual and varied scans pinpoints structural causes of semiconductor measurement deviations without destructive TEM.
- Silicon Wafer Defect Identification via Sequential Oxidation Haze
Sequential oxidation and etching create surface haze patterns on silicon wafers for visual defect region identification.
- Photoluminescence Edge Detection via Base Contrast
A photoluminescence method uses an active base with a peripheral section to identify photovoltaic cell edges.
- Semiconductor Defect Detection via Fluorescent Contrast
Optical system uses ultraviolet excitation and dichroic beam splitting to separate fluorescent signals from metallic layers for automated candidate defect identification.