Lapping Machines TRIZ Cases
- Synthetic Quartz Substrate Polishing with Impact-Absorbing Liquid
Applying impact-absorbing liquid between rotating plates reduces vertical force and prevents surface defects on thin synthetic quartz substrates.
- Wafer Double-Side Polishing Apparatus Slurry Distribution
Inverting slurry supply to the upper plate prevents wafer displacement, while optimizing carrier hole area ratios ensures uniform distribution.
- Cobalt CMP Slurry with Phosphonic Acid Rate Accelerators
Phosphonic acid rate accelerators and amphoteric surfactant corrosion inhibitors in the slurry suppress static etching while maintaining high removal rates.
- Porous Synthetic Grindstone for Dry Chemo-Mechanical Grinding
A synthetic grindstone with a porous nonwoven-fabric binder suppresses excessive frictional heat and prevents surface burns on the workpiece.