Laser Details TRIZ Cases
- Planar Lightwave Circuit Integrated Optical Chip for Femtosecond Laser Production
An integrated optical chip merges planar lightwave circuit components and waveguides on a single substrate to simplify femtosecond laser manufacturing.
- Pulsed Laser Output Stabilization via Transitory Period Control
A pulsed laser system stabilizes output energy and amplitude during operational regime transitions.
- Strained Germanium Semiconductor on Metal Foot Heat Sink
A metal foot supports a strained germanium semiconductor layer surrounded by silicon nitride, resolving heat dissipation limits in optoelectronic devices.
- Switched RF Driver for Tunable Laser Sections
A switched radio frequency driver selects one of multiple in-line laser sections to generate light at a specific wavelength.
- Segmented Electro-Absorption Modulator With Integrated Heater
Segmented electro-absorption modulators use integrated heaters for thermal control, eliminating high-resolution DACs and reducing device complexity.
- 1.27 um Oxygen Laser for Singlet Oxygen Generation
A 1.27-micrometer oxygen laser generates singlet oxygen for deep tissue cancer treatment.
- Semiconductor Light Emitting Device with Dual Oxidation Layers
A semiconductor light emitting device uses a second oxidation layer to suppress natural emission light propagation.
- Tunable Laser with Silicon-Photonic Switch for Sub-Microsecond Wavelength Selection
A tunable laser uses a silicon-photonic optical switch to couple reflective amplifiers with narrow-band reflectors for rapid wavelength selection.
- Light-Emitting Device Buffer Layer Carbon Interaction
A second buffer layer prevents etching reactions between carbon-doped arsenic-based semiconductor reflection layers and phosphorus-based semiconductor buffer layers.
- Groove-Based Sealant Bonding for OLED Display Sealing
Thermosensitive laser circuits melt groove inner walls to enhance sealing performance against moisture ingress in OLED displays.