Liquid Surface Applicators TRIZ Cases

Thermal CVD forms SiCN films using silane, nitriding, and carbon hydride gases without plasma activation to reduce etching rates during cleaning processes.

A substrate processing apparatus executes a maintenance recipe during idle periods to maintain process chamber conditions.

A vibration-capable sleeve at the dip tube lower end prevents solid reaction product buildup on inner surfaces.

Periodic precursor pulses achieve low resistivity and high uniformity without post-deposition annealing.

Angled guiding rollers replace masking tape to eliminate adhesive residue and time-consuming outlining while maintaining paint precision.

A multilayer security element uses a structured metal layer as an exposure mask to define decorative zones.

A flexible gastight material forms a micro-closed-cell foam structure to seal landfill gases.

Injection molding creates sealed caps over fasteners, eliminating costly individual capping steps.

Carbide valve needles and guide blocks enable precise guidance of viscous material outlet openings.

Automated jet dispensing aligns conductive paste on solar panel busbars, replacing manual operations to boost production throughput.

A plasma enhanced atomic layer deposition system substrate holder incorporates a sealing device to isolate the process space from the transfer space.

Magnetic attraction force supplements spring bias to resolve incomplete separation of high viscosity liquids without increasing device size.

Rotatable bottom flaps adjust gap widths to optimize powder suction, reducing lower cabin height while maintaining structural stability during spray operations.