A planar layer fills the rugged microstructure of a conductive fingerprint sensor layer, eliminating gaps that cause noise during identification.
Defined acoustic rings around sensor ports reduce direct echo path noise, enabling precise cliff detection and depth estimation.
Segmented leads embed in resin filler, resolving the trade-off between high-density lead arrangement and reliable filler dispersion.
Spring biasing accommodates thermal expansion differences to prevent bonding failures in high temperature environments.
A full-wave sonotrode uses low-friction air bearings to maintain axial alignment and lateral stiffness during ultrasonic vibration.
Orthogonal crank shaft support and belt-gear reduction stabilize forward movement while protecting the engine from impact forces.
Dynamic field current adjustment reduces total power and blower noise while maintaining coil temperature limits.
A torsion sonotrode transmits ultrasonic vibrations via its peripheral surface to create consistent welds on metallic components.
PTFE-coated flex circuit merges electrical interconnection and acoustic isolation, eliminating complex wire bonding.
A horn with a frame-like raised portion distributes ultrasonic vibration force peripherally to join secondary battery terminal components.
Non-uniform groove density shapes acoustic energy to suppress side lobes, resolving the trade-off between image resolution and probe size.
Integrated capacitive membrane with piezoelectric foil resolves complexity trade-offs while maintaining high-resolution imaging in aqueous environments.
A liquid-crystalline polymer film uses electric fields to orient monomers and generate regular microstructure arrays for haptic surfaces.