Backing Member Lead Segmentation for Ultrasonic Probes
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Solution Overview
Problem
Existing methods for manufacturing backing members for ultrasonic probes face challenges in arranging leads at pitches of 300 μm or less with high precision and reliably dispersing fillers as the pitch narrows, leading to difficulties in forming a resin layer with fillers effectively.
Innovation Solution
A novel backing member structure is developed, where leads with smaller wiring portions and larger terminal portions are embedded in a resin layer containing fillers, with the wiring portion's width and depth dimensions being smaller than the terminal portion's, and an interval between adjacent wiring portions being wider than the average filler particle size, allowing for precise lead arrangement and effective filler dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pitch of leads is made narrower to increase density, then the quantity of leads per unit area increases, but it becomes difficult to array leads with high precision and disperse fillers reliably
Solution Approach 1:
The lead structure is segmented into two distinct parts: a terminal portion with larger dimensions for connection purposes, and a wiring portion with smaller dimensions for signal transmission. This segmentation allows the terminal portions to be spaced adequately for precise arraying and filler dispersion, while the wiring portions can be closely spaced to increase lead density.
Solution Approach 2:
Different parts of the lead structure are given different dimensional properties: the terminal portion has larger width and depth dimensions for reliable connection, while the wiring portion has smaller dimensions to reduce stray capacitance and allow closer spacing. This local differentiation resolves the contradiction between density and manufacturing precision.
2Quantity of substance
If the pitch of leads is made narrower to increase density, then the quantity of leads per unit area increases, but it becomes difficult to disperse fillers reliably during resin formation
Solution Approach 1:
By segmenting the lead into terminal and wiring portions with different dimensions, sufficient space is created between adjacent wiring portions for filler particles to disperse reliably, even when leads are densely packed. The smaller wiring portion dimensions create adequate inter-lead spacing for filler dispersion.
Solution Approach 2:
The dimensional parameters of the lead structure are optimized: the wiring portion has smaller width and depth dimensions compared to the terminal portion. This parameter change ensures adequate spacing for filler dispersion while maintaining high lead density.
3Object-generated harmful factors
If the wiring portion dimensions are reduced to decrease stray capacitance, then the electrical performance improves, but the structural strength of the lead may be compromised
Solution Approach 1:
The lead is segmented into a wiring portion with smaller dimensions for reduced stray capacitance and a terminal portion with larger dimensions for mechanical strength and connection reliability. This segmentation allows each part to be optimized for its specific function without compromising the other.
Solution Approach 2:
Different parts of the lead have different dimensional qualities: the wiring portion has smaller cross-section for low stray capacitance, while the terminal portion has larger cross-section for mechanical strength. This local quality differentiation resolves the contradiction between electrical performance and structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the reliable formation of a backing member with improved ultrasonic wave absorption and reduced stray capacitance, facilitating high-performance ultrasonic probes with precise lead arrangement and efficient filler dispersion, even at narrower pitches.
Implementation Method 1
a backing member for absorbing rearward propagation of the ultrasonic waves is arranged on a lower side of the piezoelectric elements
Data Source
AI summary
A backing member includes: a resin layer which contains a filler; and a plurality of leads each of which is embedded in the resin layer to penetrate through the resin layer from an upper surface of the resin layer to a lower surface of the resin layer. Each of the leads includes a wiring portion, and a terminal portion connected to one end of the wiring portion. A width dimension and a depth dimension of the wiring portion are smaller than a width dimension and a depth dimension of the terminal portion, and an interval between adjacent ones of the wiring portions of the leads is wider than an average particle size of the filler.