Microstructural Device Assembly TRIZ Cases
- MEMS Die Structure With Segmented Anti-Stiction Bonding
Patterned seed layers preserve anti-stiction on sensing electrodes while improving bonding, enabling compact composite MEMS dies.
- MEMS Cavity Structure With Segmented Anti-Stiction Bonding
Patterning a seed layer before anti-stiction deposition preserves low-stiction sensing electrodes while enabling reliable MEMS bonding.
- Plastic Laser Welding Mask for Bond Strength and Surface Protection
Segmented masks increase weld depth and bond strength while preventing surface evaporation and oxidation damage.
- Anodic Bonding of Silicon and Glass Optical Elements
Anodic bonding joins silicon substrates to glass optical elements using electric fields at elevated temperatures.
- Overhanging Conductive Path for Thermal Sensor Die Integration
An electrically conductive circuit path overhangs an integrated circuit die to link a sensor-containing die.