Overhanging Conductive Path for Thermal Sensor Die Integration
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Solution Overview
Problem
The complexity and cost of manufacturing thermal sensor devices are increased by the need for Through-Silicon Vias (TSVs) and soldered connections between sensor and integrated circuit dies, which also add height to the device, limiting design flexibility and increasing the risk of faulty die pairings.
Innovation Solution
A thermal sensor device design featuring an integrated circuit die and a sensor-containing die with an electrically conductive circuit path that overhangs the integrated circuit die, allowing for reduced complexity and cost in manufacturing, with a modular approach enabling independent development of each die and reduced overall height, and a method of manufacturing that avoids faulty die pairings by forming an electrically conductive circuit path extending beyond the integrated circuit die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Through-Silicon Vias (TSVs) and soldered connections are used to connect sensor die and integrated circuit die, then electrical signals can be transmitted between dies, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the electrical connection function from the complex TSV and solder assembly, implementing it through simple conductive pathways formed during standard die fabrication processes. The conductive pathways are integrated into the die structures themselves, eliminating the need for separate TSV and solder connection steps, thereby reducing manufacturing complexity while maintaining reliable electrical signal transmission.
Solution Approach 2:
The die structures serve multiple functions: they provide mechanical support, define the sensor or circuit functionality, and simultaneously create the electrical connection pathways. By making the die structures multi-functional, the patent eliminates the need for separate connection components like TSVs and solder, reducing overall device complexity while ensuring reliable electrical connectivity.
2Reliability
If Through-Silicon Vias (TSVs) and soldered connections are used to connect sensor die and integrated circuit die, then electrical signals can be transmitted between dies, but device height increases
Solution Approach 1:
The patent merges the electrical connection function with the die structures themselves, eliminating the need for separate TSVs and solder layers that would add height. The conductive pathways are integrated directly into the die, allowing electrical signals to be transmitted without increasing the vertical profile of the device, thus maintaining a compact form factor.
3Reliability
If TSVs are formed through the readout IC die to provide electrical signal contacts, then electrical signals can be transmitted to the circuit board, but manufacturing cost increases
Solution Approach 1:
The patent extracts the expensive TSV formation process from the manufacturing sequence, replacing it with simpler conductive pathway formation that occurs during standard die fabrication. This eliminates the high-cost TSV step while maintaining reliable electrical signal transmission to the circuit board, thereby reducing manufacturing cost.
4Reliability
If solder is provided to the backside of the readout IC die to add height, then electrical connections can be established, but device height increases
Solution Approach 1:
The patent extracts the solder layer from the device structure, eliminating it in favor of integrated conductive pathways within the die. This removes the need for additional solder material that would increase device height, while still providing reliable electrical connections through the die-integrated conductive structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing complexity and costs, provides greater design flexibility, and minimizes the risk of faulty die pairings, while maintaining a compact form factor suitable for space-constrained applications.
Implementation Method 1
an electrically conductive circuit path extending from a first opposing surface of the first device assembly mating side of the integrated circuit die to a second opposing surface of the second device assembly mating side of the sensor-containing die
Data Source
AI summary
A thermal sensor device (100) comprises an integrated circuit die (104) having a first mating side (126) and an external side (128) opposite the mating side (126). A sensor-containing die (102) is disposed in spaced relation with the integrated circuit die (104) so that the first mating side (126) faces a second mating side (114), a portion (144) of the sensor-containing die (102) overhanging the integrated circuit die (104). An electrically conductive circuit path (132, 146, 120, 122) extends from a first opposing surface (134) of the first mating side (126) to a second opposing surface of the second mating side (114) and extends further to the overhanging portion (144) so that a portion of the electrically conductive circuit path (132, 146, 120, 122) also overhangs the integrated circuit die (104). An electrical linkage portion (148) electrically couples to the electrically conductive circuit path (132, 146, 120, 122) at the overhanging portion (144) and extends beyond the external side (128) of the integrated circuit die (104).